The new generation is said to enable a massive 12 stacks of HBM memory on a package. You are reading that right. Imagine if each stack would be an HBM2E variant with 16 GB capacity that would be 192 GB of memory on the die present. Of course, that would be a very expensive chip to manufacture, however, it is just a showcase of what the technology could achieve.Via: TechPowerUp
TSMC 6th gen CoWoS can do HBM with 12 stacks
Posted on Monday, October 26 2020 @ 11:05 CET by Thomas De Maesschalck