
The base tile is manufactured using Intel’s 10nm SuperFin architecture, but for instance, the Rambo Cache Tile is already using 10nm Enhanced SuperFin architecture. The compute tile is made using Next-Gen & External nodes, while the Xe I/O Tile is manufactured using external foundry exclusively. In total there are 7 advanced silicon technologies, Raja Koduri claims on Twitter.The Xe-HPC is expected to launch alongside Intel's Sapphire Rapids-based Xeon CPUs.
Xe HPC ready for power on!
— Raja Koduri (@Rajaontheedge) January 26, 2021
7 advanced silicon technologies in a single package
Silicon engineers dream
Thing of beauty @intel pic.twitter.com/RF8Prsy05f
Via: VideoCardz