Following the setup of an advanced wafer fab in the US because of the US government's pressure, TSMC is now facing pressure from governments of Japan, Germany and the US, demanding it to strengthen its support to carmakers. Meanwhile, the notebook industry has seen the winds of change as the US government is no longer pushing extra tariffs on notebooks products and therefore, given brand vendors times to decide whether to proceed with their production relocation plans. PCB makers are optimistic about server replacement demand in 2021 as Intel is set to unveil its new Whitley processors, but they still remain cautious about the market.
TSMC facing political pressure to boost car chip output
Posted on Tuesday, Feb 09 2021 @ 11:14 CET by Thomas De Maesschalck