TSMC to raise $9 billion to fuel expansion

Posted on Thursday, Feb 11 2021 @ 10:33 CET by Thomas De Maesschalck
EE Times reports TSMC is prepping a series of bonds to raise close to $9 billion. The funds will be used for a variety of investments, including capacity expansion.
In a Feb. 9 board meeting, the world’s largest chip foundry approved the issuance of corporate bonds in Taiwan for as much as NT$120 billion (approximately $4.4 billion) and provided a guarantee to subsidiary TSMC Global to issue US dollar-denominated corporate bonds for up to $4.5 billion that would fund capacity expansion as well as pollution-prevention measures.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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