
Intel CEO has meeting with EU officials
The US has seen some succes in attracting foundry players, with both TSMC and Samsung setting up new production capacity in the country. The US currently makes only 12 percent of global semiconductor chips, down from 37 percent 30 years ago.EU officials want to copy this strategy and dream about 3nm and more advanced production facilities. Now there's word from Intel that CEO Pat Gelsinger is flying to Europe next week to meet with EU officials and customers. Last month, Gelsinger promised the chip giant would set up a future fab in Europe. It's unknown if this meeting will be about a potential chip plant deal.
Intel said last month that it will build a major new semiconductor factory - called a "fab" by industry officials - in Europe, with plans to announce a site within the next year. Intel did not specify which government officials Gelsinger would meet. -- ReutersBesides Intel, which is restarting its foundry services unit, EU leaders may be interested in closing deals with TSMC or Samsung.