German tech site Igor's Lab has a lot of interesting tidbits about the LGA1700 socket and future cooling solutions. First up, it's revealed that the socket will be thinner. The so-called Z-height will be at least one millimeter thinner than Comet Lake-S
The new socket has a different shape and uses a new hole pattern, rendering all existing coolers incompatible. The current Comet Lake-S has a 37.5mm x 37.5mm package, whereas Alder Lake-S will be a 37.5mm x 45.0mm chip. VideoCardz points out the chip is smaller than previous-gen HEDT processors -- so some existing coolers may offer compatibility if manufacturers provide new mounting clips.
The standard reference cooler is not getting any fancier with the Alder Lake generation. Those are of course for mid-range and entry-level processors which are usually under 65W. The cooler will not be compatible with existing models, so they cannot be used interchangeably. The drawings do not confirm if the cooler has a copper core attached to the aluminum heatsink.Igor also reveals Intel is working with a partner, presumably Cooler Master, on a Peltier-based cooler for Alder Lake-S. This model will be similar to the current Cooler Master MasterLiquid ML360 Sub-Zero cooling.