AMD Zen 4 to have a peculiar heatspreader?

Posted on Monday, May 31 2021 @ 10:09 CEST by Thomas De Maesschalck
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Twitter leaker ExecutableFix posted renders of the supposed heatspreader design of AMD's Zen 4-based processors. For the desktop market, there will be a Zen 4-based "Raphael", it's expected to hit the market as the Ryzen 7000 series. These chips will be made on a 5nm process and are currently expected in Q4 2022.

AMD going LGA and adopting futuristic heatspreader design?

Based on the leak, Raphael will use a new AM5 socket with an LGA-based design. Basically, it looks like AMD is switching to Intel's approach by swapping the pins for pads. Definitely a good thing as LGA is less error-prone.

One of the interesting things is that the integrated heatspreader of Raphael will have an unusual design. According to Executable Fix's render, it will have a somewhat futuristic shape. Each of the heatspreader's four sides will reportedly have two cutouts. It's unknown if this is merely for aesthetic reasons.
The same leaker earlier revealed the bottom design of the AM5 package, which would retain the size of AM4 CPUs: 40x40mm. The Zen4 CPU package would only be slightly smaller than Alder Lake (1600 mm² vs 1687 mm²).
It's also rumored that AM5 will support dual-channel DDR5 memory but PCI Express support will stick with 4.0 The number of PCIe lanes will get upgraded to 28, four more than Zen 3. AMD reportedly plans 120W CPUs for Socket AM5, with some models possibly taking it as high as 170W.

Via: VideoCardz

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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