The site points to calculations from AMD, which show it's much cheaper to manufacture four 213mm² chiplets than a single 777mm² monolithic die. Despite the 9.7 percent larger total die area of the four chiplets, caused by overhead, it's estimated the chiplet design would cost just 59% of the cost of the monolithic die.
“Each chiplet had a die area of 213mm2 in a 14nm process, for a total aggregate die area of 4213mm2 = 852mm2 . This represents a ~10% die area overhead compared to the hypothetical monolithic 32- core chip. Based on AMD-internal yield modeling using historical defect density data for a mature process technology, we estimated that the final cost of the quad-chiplet design is only approximately 0.59 of the monolithic approach despite consuming approximately 10% more total silicon.”