SK Hynix teases HBM3 specifications

Posted on Thursday, Jun 10 2021 @ 22:36 CEST by Thomas De Maesschalck
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SK Hynix has offered the first specifications of its future HBM3 memory chips. Tom's Hardware writes we're looking at bandwidth in excess of 665GB/s and I/O speed greater than 5.2Gbps. For comparison, the current HBM2E achieves maximum bandwidth of 460GB/s and I/O speed of 3.6Gbps.
Nowadays, bandwidth-hungry devices, like ultra-high-end compute GPUs or FPGAs use 4-6 HBM2E memory stacks. With SK Hynix's HBM2E, such applications can get 1.84-2.76 TBps of bandwidth (usually lower because GPU and FPGA developers are cautious). With HBM3, these devices could get at least 2.66-3.99 TBps of bandwidth, according to the company.
SK Hynix did not share an expected availability date. It's not expected soon as there is no HBM3 specification yet. JEDEC still needs to outline the industry standard.


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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