Posted on Wednesday, October 26 2005 @ 2:44 CEST by Thomas De Maesschalck
The unique design used in the XTC heatspreaders optimizes the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.
“Memory modules that implement conventional, solid heatspreaders provide sufficient heat dissipation but do not adequately address the build up of heat pockets; The new Xtreme Thermal Convention Heatspreader design tackles this problem and more," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "Our goal is to get rid of the thermal load as quickly and efficiently as possible. A honeycomb perforation contour promotes the physical escape of hot air from the space in between the individual memory components, thus enhancing the performance of the high performance Gold GX series and preserving the life of the ICs and future parts to come.”
The PC-3200 and PC-3500 Gold Gamer eXtreme Series with 2-2-2-5 timings will be the first OCZ memory parts to include the new XTC heatspreader. The new Gold GX series modules are designed and qualified with special selection of premium components to maximize performance when playing even the most demanding graphics intensive games. With the addition of the new gold mirrored XTC heatspreader, the GX series in now better than ever.
The PC-3200 & PC-3500 Gold GX XTC series will be available in 512MB modules and 1GB (2x512) dual channel optimized kits.
