Soitec, a wafer maker, reports AMD will start using 65nm process technology and 300mm wafers later this year.
“Soitec and Advanced Micro Devices have signed an SOI wafer supply contract worth a total of more than $150 million for the calendar year 2006. This most recent contract is part of the multi-year agreement announced last year for the long-term supply of 200mm and 300mm Unibond SOI wafers,” a statement by Soitec says.
Manufacturing at 300mm instead of 200mm wafers increases the number of printed die per wafer with 240% and lowers the costs because the production requires 40 percent less energy and water per chip. More details at X-bit Labs.