AMD to start 300mm production later this year

Posted on Thursday, January 19 2006 @ 9:06 CET by Thomas De Maesschalck
Soitec, a wafer maker, reports AMD will start using 65nm process technology and 300mm wafers later this year.
“Soitec and Advanced Micro Devices have signed an SOI wafer supply contract worth a total of more than $150 million for the calendar year 2006. This most recent contract is part of the multi-year agreement announced last year for the long-term supply of 200mm and 300mm Unibond SOI wafers,” a statement by Soitec says.
Manufacturing at 300mm instead of 200mm wafers increases the number of printed die per wafer with 240% and lowers the costs because the production requires 40 percent less energy and water per chip. More details at X-bit Labs.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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