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AMD's Spansion signs patent license agreement with Rambus

Posted on Tuesday, January 16 2007 @ 15:00:31 CET by

Rambus and Spansion announced today that they have signed a patent license agreement. This five-year, royalty-based agreement grants Spansion a license to a broad range of Rambus patents. Rambus management does not expect revenue generated from this license agreement to be material. Specific terms of the agreement are confidential.

"This license agreement with Rambus enables Spansion to expand our memory solutions for cellular phone applications," said Robert Melendres, executive vice president and chief legal officer at Spansion. "Working with the Rambus team to secure access to their patent portfolio will provide us more design freedom as we develop next generation Flash memory technology and solutions."

Spansion joins a growing list of semiconductor suppliers and system manufacturers who have signed patent license agreements for various products covered by Rambus patents. Other companies include AMD, Elpida, Fujitsu, Qimonda, Matsushita, NEC, Renesas, and Toshiba.



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