Cooler Master announces the availability of the Sentinel III, a new eight-button palm grip mouse with the Avago 3988 sensor with sensitivity of up to 6400dpi, a tiny OLED screen for logo or game info, 16.8 million color LED illumination, weight adjustment system, and 512KB on-board memory for complex macro support. The mouse has a MSRP of 59.90EUR.
Cooler Master, a leading manufacturer of desktop components and peripherals, today announced the Sentinel III, an improved gaming mouse building upon the ergonomic palm grip design that fans have come to love. Sporting LED illumination in 16.8 million customizable colors, greatly improved intuitive software, and matte coating with an acrylic top panel, the Sentinel III is the perfect choice for palm grip gamers looking for comfort and advanced features.
"Designed for right-handed palm grip players, the Sentinel III includes a new sensor and expanded on-board memory" said Leo Cheng, Product Manager at Cooler Master. "The new and improved OLED display also allows you to rename your profiles in addition to knowing your exact DPI settings and/or uploading custom logos. This is the first step in making the Sentinel III truly yours."
Ergonomic Palm Grip Mouse with sharp Avago 3988 Sensor allows for extra precision
The ergonomic, contoured body of the Sentinel III is slightly larger than average sports a thumb and pinky rest, giving the mouse a natural, comfortable shape and allowing your hand and arm muscles to relax. Each of the eight buttons on the mouse can be easily reached without altering your grip. An Avago 3988 sensor offers pixel-perfect movements and sensitivity up to 6400 DPI. For lightning-quick movement or methodic precise aiming, on-the-fly DPI adjustments can be preset at 400, 1200, 4000 and 6400.
Program your perfect weapon with five macro programming profiles and Storm TactiX (TX) double button count
Take your macros and settings wherever you go. The user-friendly software makes creating even complex macros quick and easy. The processing power of a 32-bit ARM processor and 512KB on-board memory allows you to save and playback complex macros. It also allows you to save settings for DPI, lift-off distance, and LED configurations for use on any computer without the need to install additional software. If you run out of buttons to achieve your ideal combination for quick access, just double Sentinel III's button count. 'Storm TactiX' can assign secondary functions to your mouse, triggered swiftly in-game simply by holding the function aka 'TX' button. This essentially increases your button count from eight to 15. Combined with macros and five profiles to save, customization is all but endless.
Have it your way: Customize the OLED Display and full spectrum 16.8 million color options
The OLED display puts the Sentinel III in a class of its own. You can upload any logo or re-name your profiles (maximum character limit 11) across the display to represent different settings and/or your team logo. The display allows you to see your in-game setting adjustments with just a quick glance at the screen. The Sentinel III also radiates any color you choose. Two different areas (the headlights and the top) can glow crimson red, burnt orange, gunmetal grey, or any other color that piques your fancy. With 16.8 million color options, you can tinker till you drop or completely switch off all LED lighting.
Built to Last: The Sentinel III's Shell and Weight System
Nearly every inch of the Sentinel III body is covered in a matte UV coating. This coating is highly durable and will not peel, wear off or tarnish. The main buttons are guaranteed for 20 million clicks. Pop the trunk on the Sentinel III and you will see a weight system for fine tuning mass and balance. Five disks weighing 4.5g each can be removed or added until you find a weight that feels just right.
While overall demand for PCs remains weak, some segments are doing much better than the overall market. Gaming laptops for instance do quite well, and the same is true for inexpensive desktops and mini PCs, especially those using Intel's Pentium or Celeron processors.
The latter segment is seeing high demand in Europe, North America and Southeast Asia and Intel plans to respond to the trend by rolling out a new line of Apollo Lake-based processors in June-August 2016. At present, Intel is pushing Braswell or the entry-level market and this chip will see upgraded desktop models in Q1 2016 and new notebook models in Q2 2016:
Currently, over 500 million existing PCs worldwide have already been used for more than five years, and PC players including Intel, Microsoft, Hewlett-Packard (HP), Dell and Lenovo have all been aggressively promoting their new PCs, looking to attract consumers to replace their old products.
Intel is now mainly pushing its 14nm Braswell-based SoC processors for the entry-level PC market, succeeding the 22nm Bay Trail. Intel will release upgraded versions of the Braswell processors in the first quarter of 2016 for desktops, and an upgraded one for notebooks in the second quarter.
DigiTimes writes entry-level PCs based on Apollo Lake are expected to hit retail shelve in October 2015. Apollo Lake is the successor to Braswell, it will feature dual and quad-core CPUs made on a 14nm process with Gen9 integrated graphics, Ultra HD support, USB 3.1 Type-C and eMMC 5.0.
Cooler Master announces the availability of its MasterGel Maker, a new thermal compound based on non-abrasive nanodiamond particles that promises an ultra-high conductivity of 11W/mK. Furthermore, the MasterGel Maker also promises excellent viscosity that makes spreading or removing easy without cracking or drying out the comopund.
A kit is priced at 9.90EUR, it featurs a 1.5ml syringe with the thermal compound, a plastic scraper and a bag of grease cleaner.
“Enthusiasts and overclockers need a product that will help deliver the best performance with the lowest electrical conductivity within a short span of time. The MasterGel Maker fills that need,” said Ron Classen, Product Manager. “It has fewer additives, which also makes it extremely lightweight and easy to spread, allowing users to apply it without much difficulty.”
Developed for users needing the best thermal conductivity for high performance CPUs, GPUs or even chipsets. The non-curing time and resistance to electrical current help prevent short circuits and provide protection and performance for long-term use. The hi-tech nanodiamond particles can withstand extreme temperatures, are extremely lightweight and easy to spread or remove while containing properties that slow auto-oxidation or erosion over time.
An article published by Israeli news site Ynet indicates Microsoft may be making a 180-degree turn with its HoloLens project. The software giant reportedly fired as many as 60 Israeli engineers working on the project: about half of them were dismissed immediately, while the other half of permanent employees were given one month to find a new job within Microsoft.
According to the source, Microsoft plans to move forward with the HoloLens based on different technology developed by a US-based team. This late in the development cycle of the device, we can only guess what this means, and whether it impacts the entire project or just a small aspect of it.
This news all comes from Israeli news site, Ynet, so right now all we have are rough translations, so it is hard to get the full story. The team impacted by this change had been working on the Hololens for two and a half years prior to this. According to the report, Microsoft’s Israel branch did confirm that it recently made decisions that would impact a number of jobs but didn’t mention the Hololens project specifically.
A rough translation of the article was posted to NeoGAF, so take everything here with a pinch of salt. Right now, it is not known if this change impacts the entire Hololens project or just one aspect of it, either way though, the developer edition of the headset is still due out next year for $3000.
DRAMeXchange reports contract prices of mainstream solid state disks are down 10-11 percent this quarter, marking the fourth quarter in a row of price drops that exceed the 10 percent level.
Despite lower SSD pricing, adoption in the laptop market is going slower than anticipated due to weak market performance. This year the number of laptops with SSDs is estimated to be between 25 and 28 percent of total sales, and next year SSD penetration is expected to rise to over 30 percent of the laptop market.
DRAMeXchange Senior Manager Alan Chen also predicted that pricing of 256GB SSDs will be moving close to price parity with mainstream HDDs in 2016, which will result in higher adoption in the business notebook segment.
Third-quarter shipments of notebooks worldwide rose to 43.3 million units on a quarterly growth of about 13% on account of peak seasonality. However, the numbers are not as impressive as they appear since the second quarter’s base period was shorter. In the retail SSD market, channel distributors were conservative in their restocking efforts in the third quarter because they had expected NAND Flash prices to drop further. Therefore, retail SSD market’s total shipments during that period were disappointing by peak quarter standards, rising only slightly. As a result of the industry’s slowing momentum, the adoption rate of SSDs in the notebook market for the third quarter was around 24~25%. Client-SSD shipments in the same period (including those from the retail SSD market) reached a total of 21.6 million units.
Fourth quarter is the traditional peak sales season in the U.S. and European markets. Chen noted that while MacBook sales continue to grow and non-Apple branded notebooks with Intel’s Skylake CPUs have hit the market, quarterly notebook shipment growth will still be constrained by ongoing inventory adjustments. DRAMeXchange expects the SSD adoption rate in the notebook market to move up a bit to 27~28% during the same period.
Since the decline in NAND Flash prices and aggressive pricing from SSD suppliers are showing no sign of stopping, the retail SSD market will deviate from the seasonal pattern in the fourth quarter, with the global Client-SSD shipments registering a slight quarterly growth of 4~6%.
While rumors about a December launch date for AMD's dual-GPU Radeon R9 Fury X2 have been going around for some time, it appears actual retail availability of the card may take a bit longer. Rumor site WCCF Tech picked up news that AMD is planning to paperlaunch the card later this month and that retail market availability won't happen until later in Q1 2016. The dual-GPU beast is reportedly suffering from scheduling issues in production and may not be on shelves until after January 2016.
Benchlife.info claims that while AMD has delivered engineering samples for testing, it has yet to begun AIB seeding and full fledged mass production. Which if true, could mean a delay in the order of months, not weeks. Although the source in question is reliable and has been accurate in the past, I would still urge the usual grain of salt with this – just in case. While we are on the topic, I would also like to report that AMD’s Fury X2 was recently spotted on Zauba. AMD has decided to scrub the identifying information from GPU shipments but the timing and pricing of the item makes it pretty obvious.
More news and rumors will likely follow in the coming days/weeks.
Rumors are going around that NVIDIA is no longer supplying the GM107-300 GPU, which is used for the GeForce GTX 750 video card. This card was the first iteration of the Maxwell architecture, and if the rumors are right NVIDIA plans to replace the card by offering a cut-down version of the more powerful Maxwell 2.0 based GM206 GPU:
Naturally once we heard this, we did our own digging and came across multiple points of confirmation. The source mentioned that the silicon in question will be named “GM206-150” and we were able to find the die in PCI id code databases. The full nomenclature is actually “GM206-150-A1”. I was also able to find listed models of the GM206 based Geforce GTX 750, from which we can confirm that the core count will remain exactly the same as before (512 CUDA cores).
These new cards will reportedly have the same core count, but a modified ROP count and new features like HDMI 2.0, Dynamic Super Resolution, Third Generation Delta Color Compression, Multi-Pixel Programming Sampling, Nvidia VXGI (Real-Time-Voxel-Global Illumination), VR Direct, and Multi-Frame Sampled Anti-Aliasing(MFAA). The card will support DX12 API up to feature level 12_1.
MSI announces it's bundling Tom Clancy’s Rainbow Six Siege with its new Z170A KRAIT GAMING R6 SIEGE motherboard as well as with the Z170A GAMING M5:
MSI, world leading in gaming hardware design, is pleased to announce a new partnership with Ubisoft Entertainment, creator of one of the most anticipated titles this year and awarded Best PC game in E3 2015, Tom Clancy’s Rainbow Six Siege. MSI is Ubisoft’s exclusive motherboard partner and introduces a new version of the Z170A KRAIT EDITION motherboard, specially designed to celebrate this new partnership, the MSI Z170A KRAIT GAMING R6 SIEGE.
With this new model you will receive a free copy of Tom Clancy’s Rainbow Six Siege [Standard Edition]. But that’s not all, during this exclusive promotion MSI is also giving away a free copy of the game with the Z170A GAMING M5 motherboard. The promotion starts on Tuesday 1st of December, 2015.
Team up and win everything with MSI GAMING Motherboards and a FREE copy of Tom Clancy’s Rainbow Six Siege
The new Z170A KRAIT GAMING R6 SIEGE motherboard comes with a unique black & white design and exclusive Rainbow Six Siege packaging and accessories. For gamers who want to be different and like to fully customize and personalize their game PC while demanding top performance, The Z170A KRAIT GAMING R6 SIEGE motherboard is sure to meet any expectation. The Z170A GAMING M5 motherboard is made for enthusiast gamers whose main ambition is to master their favorite game. Featuring MSI’s true GAMING DNA, outstanding design and unique gaming features, this one is ready to guide you to the next level in gaming.
The Z170A KRAIT GAMING R6 SIEGE & Z170A GAMING M5 motherboards feature Audio Boost 3 with industries’ highest quality audio components, delivering an unprecedented, realistic and immersive sound experience. Enjoy the game more vivid and pinpoint your enemies’ exact locations to gain a true tactical advantage. DDR4 Boost ensures the memory signals stay pure for optimal performance, endorsed by world-leading memory brands including Kingston, Corsair, Crucial and others. With perfect compatibility and reliability you get to enjoy a high performance and rock-solid system while gaming without any compromise. USB 3.1 Gen2 Type-A & Type-C offers gamers lightning-fast data speeds while transferring games, audio and movies through future proof solutions with 2 types of connectors.
This game bundle promotion applies to selected countries during a limited time. Redemption period starts Tue 1st of December 2015 and ends Tue 1st of March 2016. Please contact your local retailer, MSI representative, or check the event page link: goo.gl/NhqSL5 for further information.
Software maker Autodesk teamed up with Microsoft to leverage the HoloLens for 3D engineering and industrial design. It's still early days but augmented reality technology like the HoloLens could be of significant help in everyday design/engineering projects as it enables as it removes the limits of displaying 3D objects on relatively small displays:
To fully understand what we could do with HoloLens, we spent several months building dozens of prototypes and tested many scenarios to understand how customers could benefit most from a mixed reality environment. We explored ways to make work areas have infinite space by using walls and open areas overlaid with holographic objects. We explored how users could collaborate together by looking at the same holographic model and being able to walk around it and discuss various aspects of the design as if it were really sitting on their table. We explored the possibilities of creating and editing directly from a holographic model, as well as pitching a final design to an executive team or a customer.
We were blown away by the possibilities. All of those benefits and other variations are coming to fruition in the FreeForm project.
But one of the hardest things about this experience is trying to explain it in words or even pictures. Unfortunately, we can’t give everyone the hands-on (or should I say “heads-on”) experience yet. But we have assembled a video that illustrates how a mechanical engineer and an industrial designer can work together in holographic space to solve various tasks in a far more collaborative way than they could without it.