Patriot teases its upcoming dual-interface USB 3.1 flash drive; one end features the traditional USB connector while the other end has one of those new reversible Type-C connectors. Patriot will start shipping the Type-C USB Flash Drive in June, it will be offered in 32GB and 64GB capacities.
I thought this was the first dual-interface USB stick but a quick Google search reveals SanDisk already revealed a very similar product in early March.
Patriot, a leading manufacturer of mobile accessories, computer and USB memory, announces the development of a Type-C USB Flash Drive for the new MacBook, Google Chromebook Pixel™ and other Type-C equipped notebooks and systems available on the market. With the recent release of the latest MacBook, which has been upgraded with the new Type-C port, consumers will now be able to use the Type-C USB Flash Drive to transfer data from any other form factor using a single robust and small solution.
Outfitted with a polished metal exterior, the dual-sided Type-C / Type A USB Flash Drive will feature both a small Type-C at one end and a standard USB 3.0 connector at the other end allowing seamless data transfer from traditional devices to the new Type C based device. Patriot solves the problem of compatibility, providing a solution that is compatible with all devices.
“As many MacBook users rely heavily on external storage options, we wanted to be at the forefront with a product that will cater to these consumers,” said Meng J. Choo, Patriot’s Product Manager. “As a leading manufacturer of USB and flash memory, we want to offer solutions for our customers that are easy-to-use and provide seamless experiences across all their devices.”
Chinese motherboard maker Colorful is one of the first to showcase its upcoming 100-series motherboards for Intel's Skylake processors. The firm presented three motherboards, all with pretty high-end features and one of the interesting things seems to be the capability of supporting either DDR3L or DDR4. You can view a bunch more pictures at eTeknix.
The new boards come will all the high-end features you would expect, such as a 14-phase power circuit, GamerVoice, Nichicon Audio Capacitors, Killer E2201 + Intel I211-AT dual NIC, CrossFire / SLI three-way (8x + 4x + 4x), PCI-E M.2 slots, six SATA 6GBPS, two SATA Express, USB 3.1, USB 3.0, DDR3L / DDR4 memory compatibility and more.
A slide revealing details about AMD's Zen core has been leaked at the forum of German tech site Planet3DNow! The slide is supposedly part of a presentation that will be revealed at AMD's Financial Analyst Day and is under embargo until May 6, 2015.
The diagram reveals the major architectural changes between Excavator and Zen. Zen breaks away from the Bulldozer architecture family by returning to a more Phenom-like design with a monolithic decode unit and equally large, single integer and floating point units. This should result in better single-threaded performance, an area in which the Bulldozer design severely lacks.
The first processors based on Zen are expected in 2016.
To begin with, Zen features monolithic fetch and decode units. On Bulldozer, two cores inside a module featured dedicated decode and integer units with shared floating-point units. On Zen, there's a monolithic decode unit, and single integer and floating points. The integer unit has 6 pipelines, compared to 4 per core on Bulldozer. The floating point unit has two large 256-bit FMAC (fused-multiply accumulate) units, compared to two 128-bit ones on Bulldozer. The core has a dedicated 512 KB L2 cache. This may be much smaller than the 2 MB per module on Bulldozer, but also indicate that the core is able to push through things fast enough to not need cushioning by a cache (much like Intel's Haswell architecture featuring just 256 KB per core). In a typical multi-core Zen chip, the cores will converge at a large last-level cache, which routes data between them to the processor's uncore, which will feature a DDR4 IMC and a PCI-Express 3.0 root complex.
Kingston announces a new SATA 6Gbps 2.5" 7mm thick SSD: the HyperX Savage. This fiery red disk features the Phison S10 quad-core, eight-channel controller and replaces the HyperX 3K SSD. Available in capacities from 120GB to 960GB, this unit promises read speeds of up to 560MB/s, write speeds of up to 530MB/s and random 4k read/write IOPS of 100,000 and 89,000, respectively.
HyperX®, a division of Kingston® Technology Company, Inc., the independent world leader in memory products, today announced HyperX Savage, its next-generation SATA Rev. 3 (6Gb/s) SSD. HyperX Savage is powered by the Phison S10 quad-core, eight-channel controller delivering incredible read/write speeds for both compressible and incompressible data, as well as high IOPS. It replaces the highly successful HyperX 3K SSD.
HyperX Savage is the fastest SATA-based SSD in the HyperX family. With sequential speeds of up to 560MB/s read and 530MB/s write, and IOPS of up to 100,000 read and 89,000 write, HyperX Savage offers higher performance, ultra-responsive multitasking and an overall faster system. It features an eye-catching red steel and aluminum case with a low profile to fit most notebooks, desktops and small-form factor PC builds. This new design continues the HyperX trend as a leader in stylish gaming products.
“We are proud to introduce the HyperX Savage as our latest and fastest SATA-based SSD,” said Lawrence Yang, business manager, HyperX. “The HyperX 3K drive has been a core part of our SSD offerings since 2012, and now with Savage, we are unleashing even higher performance and capacities to satisfy the most demanding consumers, enthusiasts and gamers.”
HyperX Savage is available in 120GB, 240GB, 480GB and 960GB capacities. It is sold as a stand-alone SSD or with an upgrade bundle kit that includes a 2.5? USB 3.0 enclosure, 3.5? bracket and mounting screws, SATA data cable, hard drive cloning software5, multi-bit screwdriver and a 7mm to 9.5mm adapter. The drive is available at Tiger Direct, Rakuten, Newegg and Amazon.
Industry sources shared with DigiTimes that chip designer MediaTek is gearing up to enter volume production of its 10-core ARM-based smartphone chip in Q3 2015. This new chip, named Helios X20, will reportedly be manufactured by TSMC on a 20nm process. MediaTek's 10-core chip is primarily aimed at Chinese flagship phones.
MediaTek is likely to start its marketing activities for the upcoming Helios X20 around the middle of the second quarter, the sources indicated. The solution is expected to be the world's first 10-core chip solution available, the sources said.
The MediaTek Helios X20 will come with a 2+4+4 design, delivering 40% more performance than 8-core chips, the sources noted. Taiwan Semiconductor Manufacturing Company (TSMC) has been contracted to manufacture the 10-core chips using a 20nm fabrication process, the sources said.
Cooler Master announces the addition of a new XL size to its cloth Swift-RX mousepad lineup. The XL version measures 900mm x 360mm and is large enough to provide a uniform surface under both your mouse and your keyboard. The MSRP is 29.90EUR and it should be available in stores very soon.
Cooler Master, a leading creator, innovator, and manufacturer of desktop components and peripherals today announced the addition of the Extra Large Swift-RX to compliment and complete the Swift-RX mousepad series.
When Size Matters
The recently launched Swift-RX mousepad series will now also be available in an XL size for environments where a normal size mousepad just isn’t enough.The Swift-RX XL’s size is 900x360mm, making it large enough to not only give enough space to the mouse but also the entire keyboard for maximum surface area!
Speed and Control
The Swift-RX XL, just like the Small (S), Medium (M) and Large (L), is designed for gamers who desire both comfort and speed in their mousepad. The mousepad is crafted with finely textured microscopic mesh to ensure excellent precision for both optical and laser sensors and encompasses a very smooth, low friction surface for optimal comfort and control. The base of the mousepad is made of 100% natural rubber to ensure the mousepad stays in place, regardless of how intense you game. The Swift-RX XL also features the special treated stitched edges which prevents the top surface from fraying and makes the mousepad extremely durable.
The Swift-RX mousepad series are available in four sizes to suit everyone’s needs: Small: 250x210mm, Medium: 320x270mm, Large: 450x360mm and now Extra Large: 900x360. All models of the Swift-RX series share a 3mm thickness.
The Swift-RX XL will be available from end of April, beginning of May for a MSRP of €29,90. The Swift-RX Small, Medium and Large are also available from for a MSRP of €9,50, €13,50 and €19,50. Price and availability may vary based on region.
Last week CyberPowerPC introduced its Trinity 100 gaming PC series, one of the most special things about that announcement was the system's pretty special star-shaped case. I remembered seeing this case in CES or CeBIT footage but couldn't quite remember who manufactured it. We now have more information about this case, it's the new TriStellar from Deepcool.
The case takes up 395mm x 435mm x 388mm (L x W x H) and weighs a whopping 16kg, the cabin covers are made from 2mm thick sheets of SPCC steel while the other panels are 0.6mm thick. We've heard this case feels pretty solid, which is reflected by the huge weight.
While the TriStellar sacrifices space for aesthetics, it is surely one of the most unique cases on the market. TriStellar consists of a three cabin design; a graphic card cabin, a motherboard cabin and a cabin for the PSU and storage.
The motherboard cabin fits a Mini-ITX motherboard with a low-profile 80mm HSF or a 120mm watercooling solution. The graphics card cabin supports a triple-slot graphics card with a maximum length of up to 320mm and has room for three 2.5" storage disks. Last we have the power supply cabin, it can accommodate a PSU with a length of up to 160mm as well as two 3.5" HDDs and one slot-loading optical disk drive.
The VGA cabin comes with a preinstalled 90mm fan and the motherboard cabin has room for an optional 120mm fan if you don't use watercooling.
Deepcool's TriStellar starts shipping in May but unfortunately not only the name but also the pricing will be astronomical. German tech site ComputerBase received word from Deepcool that pricing will be in the 370EUR to 450EUR range.
Unique compartmentalized system
Reliable and solid structure
Fully black interior
Supports the latest gaming configuration
Capable to hold 320mm graphic card
Supports 120mm liquid cooler
Support standard ATX PSU with 150*160*86mm
Total 5pcs hot plugging (SATA) port ( 2*3.5''HDD/3*2.5'' SSD)
Scythe published details of its upcoming Ninja 4 HSF. The new generation features a nickel-plated copper base, six 6mm diameter heatpipes and a large heatsink with a T-M.A.P.S (Three-dimensonal Multiple Airflow Pass-through Structure) design.
The heatsink itself measures 130mm x 155mm x 153mm (W x H x D) and weighs 900g. It comes with the Hayabusa 120mm PWM fan, which delivers up to 84.64CFM at a noise level of 29.5dBA. One of the special features of this fan is that it has a switch that lets you select the maximum RPM between 300/800/1500rpm.
Scythe's Ninja 4 comes with mounting tools for the Intel 775 / 1150 / 1155 / 1156 / 1366 / 2011 / 2011(V3) and AMD AM2 / AM2+ / AM3 / AM3+ / FM1 / FM2 / FM2+ platforms.
Car maker Audi and clean tech firm Sunfire announced the development a new production process for a cleaner, carbon-neutral diesel fuel. The new fuel is called e-diesel and it can be created using water, carbon dioxide and renewable energy sources like solar or wind power.
The e-diesel uses a multi-step process. First electricity is used to split water into hydrogen and oxygen via reversible electrolysis (rSOC) at a very high efficiency of approximately 90 percent. That by itself already sounds like an amazing achievement. Next the hydrogen is mixed with carbon monoxide under high temperatures and pressure to create something Audi refers to as "blue crude". The carbon monoxide is obtained directly from the ambient air using direct air capturing technology from Swiss firm Climeworks. The blue crude is then further refined to create the synthetic diesel fuel, Audi claims about 80 percent of the blue crude can be converted into synthetic diesel.
While the whole process sounds rather energy-intensive, Sunfire claims the overall energy efficiency of the e-diesel is 70 percent.
The e-diesel can be used on its own or can be mixed with conventional diesel fuel. Interestingly, the e-diesel promises to deliver superior quality over traditional diesel. Engines reportedly run quieter on e-diesel and fewer pollutants are being created. The press release mentions e-diesel is sulphur free and has a cetane number of roughly 70, ensuring a cleaner and better combustion.
Audi and Sunfire set up a pilot plant in Dresden, Germany that will manufacture 160 liters of e-diesel per day in the coming months.
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The interesting part of this news is that this process delivers a method to store the electricity generated by renewables in a way that fits into our current energy infrastructure.
Audi and Sunfire are planning to scale up production and hope to be able to sell e-diesel to the public for between 1 and 1.5EUR per liter, depending on the cost of electricity used to generate the fuel. We're not sure if this factors in taxes but if the price achieves the middle of that range it would be quite competitive with traditional diesel in Europe.
DigiTimes claims AMD will use both Samsung and GlobalFoundries to manufacture its 14nm Summit Ridge APUs in 2016.
Summit Ridge is based on the upcoming high-performance Zen architecture, which reportedly features up to eight cores and DDR4 support.
The report mentions Bristol Ridge, a new mainstream APU that will replace the the Godavari "Kaveri Refresh" APU in 2016, will get the same manufacturing treatment and that this applies to Raven Ridge as well.
Raven Ridge is a codename we haven't heard before, DigiTimes claims this APU is scheduled for 2017.
Taiwanese supply chain makers also mentioned that AMD placed orders with ASMedia for USB 3.1 controller ICs to match its chipsets to be launched in September 2015.