FUD Zilla delivers word that NVIDIA's GeForce GTX 780 is scheduled to be launched on May 23rd. The cards will be available in retail stores at launch day, but overclocked models won't arrive until a few weeks later.
Anticipated to sell for between 500-600EUR ($500), the GTX 780 is reportedly based on a GK110 GPU with 2304 CUDA cores, 863MHz base clock, 900MHz boost and 3GB GDDR5 memory clocked at 6000MHz.
As noted earlier the GTX 780 reference graphics card will use the same cooler previously seen on the GTX Titan that should hold it at somewhere between 40 and 45 dBA making it much less noisy than the GTX 680.
According to an Nvidia-made performance slide that we had a chance to see, which pits the new card to AMD's Radeon HD 7970 GHz Edition, the GTX 780 should end up anywhere between 25 and 50 percent faster than the HD 7970 GHz Edition, with exception of the Tomb Raider where it is faster by around 20 percent.
ThinkComputers came across some benchmarks that show that the GeForce GTX 780 is about 20 percent faster than the GeForce GTX 680 in 3DMark, 3D Mark 11 and Valley Benchmark.
The GeForce GTX 770 on the other hand is anticipated to follow on May 30th. This card is based on the GK104 GPU, it's basically a rebrand of the GeForce GTX 680 but with faster clockspeeds. FUD Zilla says the card will aim at a price point similar to the Radeon HD 7970 GHz Edition, or in the 400-450EUR / $450 range.
As noted and rumored earlier, the GTX 770 will be a simple rebrand of the GTX 680, but with slightly higher clocks. It features 1536 CUDA cores and runs at 1046MHz base GPU clock. It also feature Nvidia GPU Boost 2.0 that will take the GPU up to 1085MHz when possible. It will be available with both 2GB and 4GB of memory, clocked at a pretty impressive 7000MHz and paired up with a 256-bit memory interface.
As it is based on a version of the GK104 chip it is no wonder that it needs 6+8-pin PCI-Express power connectors and has a 230W TDP. It will also feature two DL-DVI, HDMI and DisplayPort outputs. Judging by earlier leaks, pictures and some information that we saw, it will also use a reference cooler similar or same as the one on the GTX Titan. This means that the card will be significantly quiter.
In an interview with The Atlantic, outgoing Intel CEO Paul Otellini revealed that one of his regrets is that he passed up the opportunity to have Intel silicon inside the original iPhone. Otelini says Intel grossly underestimated the volume that the iPhone would sell and claims he should have followed his gut rather than rely on the forecasted data:
A squabble over pricing apparently led Otellini to back off, steering Apple right toward the ARM-powered competition.
Here's what happened, in Otellini's words:
We ended up not winning it or passing on it, depending on how you want to view it. And the world would have been a lot different if we'd done it . . . The thing you have to remember is that this was before the iPhone was introduced and no one knew what the iPhone would do... At the end of the day, there was a chip that they were interested in that they wanted to pay a certain price for and not a nickel more and that price was below our forecasted cost. I couldn't see it. It wasn't one of these things you can make up on volume. And in hindsight, the forecasted cost was wrong and the volume was 100x what anyone thought.
The Atlantic says Otellini expressed visible regret when telling the story. The retiring Intel chief lamented that he should have followed his gut and not the data alone. "My gut told me to say yes," he told the paper.
Engadget writes Sony showed off a 13.3" e-Ink paper prototype notepad at the Educational IT Solutions Expo in Japan. The A4-sized device is said to be world's first that uses the E Ink Mobius, a display that's flexible and light.
Co-developed by Sony and E Ink, the display only contributes 60g to the overall weight, which is apparently 50 percent lighter than similar screens built with glass. Sony says the software isn't quite as slick as it'd like it to be just yet, but nevertheless, you can check out people scrawling, annotating and highlighting on the prototype in the video below.
Samsung announced the creation of the first 45nm embedded flash logic process:
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, today announced the industry's first 45 nanometer (nm) embedded flash ("eFlash") logic process development. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.
"Samsung's 45nm eFlash logic process has the potential to be broadly adopted into various components for security solutions and mobile devices, including smart card IC, NFC IC, eSE (embedded secure element) and TPM (Trusted platform module)," said Taehoon Kim, vice president of marketing, System LSI Business, Samsung Electronics. "The excellent performance from this smart card test chip will help solidify our leadership in the security IC market."
The smart card IC based on Samsung's 45nm eFlash logic process guarantees high reliability and endurance of 1 million cycles per flash memory cell. The performance results are the industry's best class and superior to any other solutions currently on the market, generally rated for 500,000 cycles.
Through the improvement in both flash cell structure and operating scheme, the test chip features random access time to read memory that is 50 percent faster and the power efficiency is enhanced by 25 percent over previous products built on the 80nm eFlash logic process.
Samsung's advanced 45nm eFlash logic technology, built on the technological synergies created through decades of know-how and experience in both embedded flash and logic processes, will enable Samsung to provide competitive performance levels and greater value to its foundry and ASIC customers in the field of consumer microcontrollers and automotive chips that require higher speed, larger memory capacity and higher power efficiency.
Initial smart card IC samples for commercialization using this 45nm eFlash logic technology are expected to be available in the second half of 2014.
Currently the electronics industry is pushing to adopt 4K ultra-HD but Japan Broadcasting Corp (NHK) already foresees the need for much bigger resolutions. NHK claims 8K (7320 x 4320) resolution is the maximum needed for 2D images, as well as 22.2-chanel audio, because this is the highest resolution that the human eye can process. Any further developments will be in 3D, NHK says Super Hi-Vision will require about 33 million pixels, while true stereo-3D will take 10 to 100 times as many as that.
“One of the main reasons we carried out research into 8K TV is due to the characteristics of human perception. Our conclusion is that 8K will be the final two-dimensional television format. The resolution involved is the highest that the human eye can process. Any further developments will be in 3D,” said Kimio Hamasaki, a senior research engineer at NHK science & technology research laboratories in Japan, in an interview with The Hollywood Reporter.
NHK began developing 8K technology also known as Super Hi-Vision (SHV) in 1995. The 8K format has resolution of 7680*4320 pixels – four times the resolution of 4K and 16 times that of current HD – as well as 22.2-channel audio. The equipment for 8K was designed in partnership with Japanese leading manufacturers of electronics, including Fujitsu, JVC, Panasonic and Sharp. The annual R&D budget of NHK is around $77 million, yet it is unclear how much the company has spent on 8K/SHV development. Having spent well-over a billion of dollars on R&D since 1995, NHK has developed plethora of technologies not only for 8K/SHV, but also for other applications.
A report by IHS DisplayBank claims 4.57 million notebooks shipped in Q1 2013 featured a capacitive touchscreen, up 51.8 percent from the previous quarter. The number represents just over ten percent of all 46 million notebooks shipped in the period.
“Touch-screen notebooks should hold at least 10 percent of the total laptop shipments,” the company said in a new report on the sector. “In particular, brands from the greater China region, including Lenovo, Acer and Asus, have set higher targets of achieving more than 20 percent [adoption],” the report said.
Microsoft ignited the rush to touch screen notebooks with the release of Windows 8 last fall, its first operating system to natively support the technology. Win 8 has seen sluggish uptake to date, but Displaybank remains cautiously optimistic.
Razer announced it has finalized Atrox, an arcade stick for the Xbox 360 designed in cooperation with the fighting game community. The device is now available for pre-order on Razer's website and will ship worldwide in June for $199.99 (199.99EUR).
Razer™, the world leader in high-performance gaming hardware, software and systems, today announced the Razer Atrox Arcade Stick for Xbox 360®, the final product following an extensive beta testing program.
Tested by some of the world’s best pro-gamers and Fighting Game Community members all over the world, the Razer Atrox Arcade Stick is constructed with modders and tournament gamers in mind. Featuring premium quality Sanwa™ components, the 10 highly responsive buttons and a precision eight-way joystick allow gamers to strike instantly and surely, game after game, while maintaining peak performance and reliability.
An extremely moddable controller, the inside of the arcade stick platform opens up at the touch of a button, making the Razer Atrox a breeze to customize for all tastes and play styles. Users can swap in their own personal designs for a unique look, while also getting access to the internal compartments and honeycomb structure for easy screw mounting.
The easily accessible internal compartment of the Razer Atrox reveals dedicated slots to store an included alternate bat top joystick, the detachable cable, and a screwdriver for modding, giving gamers plenty of room for storage as they travel around dominating FGC events.
“Following a huge beta testing program, we’re confident that we’ve built an arcade stick enthusiasts will love,” says Min-Liang Tan, Razer co-founder, CEO and creative director. “We know that the Fighting Game Community is huge on modding their arcade sticks, and that is why we made the Razer Atrox extremely mod friendly. We are excited to see what extreme mods the Razer Atrox will be the base for.”
About the Razer Atrox Arcade Stick for Xbox 360®
Arcade gaming has come a long way since its glory days– an era woven into the fabric of gaming history as one that paved the way for innovation, and also one that brought us bittersweet nostalgia. Hours spent at the arcade honed the gamer in you; for every coin you inserted, every combo you executed, every hit you took, and every ultra you unleashed in return – you became a better player. And this is the approach we took when designing the Razer Atrox Arcade Stick.
Years upon years of collective gaming experience from pro-gamers and you, the Razer community, have culminated in the ultimate Arcade Stick for the Xbox 360. Engineered and refined to perfection through countless prototypes and an extensive beta testing phase, the Razer Atrox Arcade Stick is crafted to allow advanced modification – With internals and storage easily accessible at the touch of a button, the joystick, all 10 buttons and the top panel are fully interchangeable for full customizability. And that’s just the beginning.
Featuring genuine Sanwa hardware and an ergonomically authentic arcade layout, the Razer Atrox represents the pinnacle of precision and reliability and is the definitive Arcade Stick for tournament-grade gaming.
Forged from the fires of an arcade gaming legacy, the Razer Atrox is, in the most primeval sense, Bred to Fight.
Product features:
10 tournament-grade Sanwa buttons
Authentic Sanwa joystick with ball top and additional bat top
Interchangeable top plate allows for custom artwork finishes
Fully accessible internals and storage compartments for easy modding
Honeycomb structure on the inside for easy screw mounting
Storage room for alternative bat top joystick and more
Lenovo announces its Yoga 11S convertible, a laptop with tablet functionality.
Lenovo(HKSE: 992) (ADR: LNVGY) announced that customers can place orders for the IdeaPad Yoga 11Sbeginning today on www.lenovo.comor pre-order on www.bestbuy.com. The acclaimed 360° flip and fold Yoga 11S premiered in January at the International Consumer Electronics Show, following its popular predecessor, the IdeaPad Yoga 13.
Svelte and Powerful Mini-Ultrabook Convertible
Sized well for mobility in a thin, 11.6-inch design, the Yoga 11S Ultrabook convertible comes with choices of a powerful third generation Core i3, i5 or i7 Intel processor giving consumers the ability to create high-performance content and presentations and seamless graphics that make it a great entertainment device.
Yoga in Four Modes
Yoga converts into four special modes to fit the changing ways people are using technology. It offers a new way to experience mobile computing, letting people define which mode works best for them in their environments, from the park and the coffee shop to in transit, at home or at the office.
For example, users can watch movies like never before by putting Yoga in tent mode while enjoying the convertible’s rich Dolby Home Theatre audio. They can convert Yoga into stand mode for a different environment; good for things like swiping through family photos using the high definition IPS screen’s 10-finger multitouch support. Yoga even supports hand gestures so consumers can just wave their hand in front of the webcam to instantly advance photos, videos and other content.
In tablet mode, Yoga makes exploring Windows 8 apps fun and up close with its 11-inch touchscreen. And in laptop mode, Yoga offers a great typing experience with its comfortable and responsive keyboard. Additionally, the Yoga 11S has a soft-touch exterior and comes in attractive Silver Grey and Clementine Orange colors.
Quote
“Consumers around the world loved our first Yoga for its unique flip and fold and multi-mode design,” said Jay Parker, president, Lenovo, North America. “We’re continuing to develop the Yoga franchise with the new Yoga 11s, and due to Yoga’s popularity already, we’ve created a pre-sale program so customers can get their hands on one before it even hits the shelves.”
“The IdeaPad Yoga 11S is a great example of the commitment Lenovo is making to continued innovation with Windows,” said Jordan Chrysafidis, vice president, Worldwide OEM Marketing, Microsoft Corp. “The commitment is evident in its beautiful hardware designs that exhibit flexibility, mobility and extended battery life; combining that with the new touch capabilities of Windows 8 provides an experience that is sure to delight customers.”
“Lenovo continues to deliver on its reputation for innovative Ultrabook designs and experiences that people are hungry for with the new IdeaPad Yoga 11S,” said Navin Shenoy, vice president and general manager of Intel's Mobile Client Platforms. “We created our new line of low power 3rd gen Core processors for products like Yoga, to give people a full PC experience in thinner and lighter convertible designs.”
Pricing and Availability
Beginning today, customers can place orders on www.lenovo.comand www.bestbuy.com. Models will be available in Best Buy stores starting on June 23. Multiple configurations will be available with suggested list price starting at $799.99
Xigmatek introduces Janus, a low-profile HSF with a nickel-plated copper base, six 6mm diameter nickel-plated copper heatpipes, and a large auminium fin array. There are two fans but they're arranged in a somewhat unusual top-flow push-pull configuration. The top fan is a 120mm PWM model, it spins at 800 - 1200RPM with a max airflow of 38.42CFM at a noise level of 22.4dBA, while the bottom fan is a 2000RPM 80mm model with max airflow of 13.53CFM at a noise level of 19.2dBA.
The cooler measures 120mm x 110mm x 45mm (without fan) and weighs 317g (430g with fual fans). The kit includes Xigmatek's Universal Mounting Kit for Intel LGA Socket 755, 1155, 1150, 1156, 1366, 2011 and AMD Socket AM2 / AM2+/ AM3 / AM3+ / FM1 / FM2
Janus is the god of beginnings and transitions, gates, doors, endings and time. Janus is a two-faced god which has the ability to look into the future and past. Xigmatek continues to innovate once again, this time adopting Janus to be the name that will be heard for many years to come in the CPU cooling industry. Janus is one of the world’s thinnest low-profile coolers. Standing at a height of 60mm Janus can virtually fit in any case.
SilverStone is about to ship two new sealed watercooling units; the Tundra TD02 and the Tundra TD03. Based on a design by Asetek, these coolers feature a SilverStone fan and some other customizations. Availability is slated for later this week.
The TD02 features a radiator assembly that measures 278 x 124 x 33.5 mm (LxWxH, excluding fans), and can latch on to four 120 mm fans, a pair of FM121 fans come included. The TD03, on the other hand, uses a radiator assembly close to half the size of its sibling, measuring 124 x 159 x 45 mm. The base+pump assembly is the same for both, measuring 55 x 60 x 33.5 mm, which features a polished copper base.
