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Latest news on DV Hardware
Intel debuts new technologies for its foundry customers August 27, 2014 - 18:21
Sharkoon VS4 low-budget cases start at 24.99EUR August 27, 2014 - 17:09
Zotac debuts pocket-sized ZBOX PI320 pico August 27, 2014 - 17:05
EK introduces its new flagship waterblock August 27, 2014 - 13:11
Samsung mass producing 64GB DDR4 modules using 3D TSV August 27, 2014 - 12:56
Kobo introduces the first waterproof eReader August 27, 2014 - 12:49
Intel Skylake-S to support DirectX 12 and 4096 x 2304 August 27, 2014 - 12:37
HP recalls over 6 million power plugs over fire risk August 27, 2014 - 12:28
Apple rumored to be working on 12.9-inch iPad for 2015 August 27, 2014 - 12:21
Amazon Fire Phone sold just 35,000 units in first month August 27, 2014 - 12:17
Windows 9 to offer no middle ground between desktop and Modern UI August 27, 2014 - 12:12
Windows XP fans create unofficial Service Pack 4 August 26, 2014 - 17:10
Seagate teases its first 8TB HDDs August 26, 2014 - 15:34
Graphics card sales plunge 17.5 percent August 26, 2014 - 13:53
Intel Haswell-E pricing revealed August 26, 2014 - 13:32
Surprise: Amazon buys Twitch for almost $1 billion August 26, 2014 - 11:57
TSMC to make 16nm wafers in Q1 2015 August 26, 2014 - 11:44
Microsoft aims to make streaming gaming better with predictive modeling August 26, 2014 - 11:13
Tablet game revenue expected to triple by 2019 August 26, 2014 - 10:56
JEDEC reveals LPDDR4 memory standard August 25, 2014 - 21:37

Software Zone - new downloads and updates
AIDA64 4.60 July 30, 2014 - 09:26
Paint.NET 4.0.2 July 16, 2014 - 14:02

The Mailbox - cool news and reviews from other sites
20-Way Radeon Comparison With Open-Source Graphics For Steam On Linux Gaming August 27, 2014 - 18:34
Cooler Master V750 Semi Modular PSU August 27, 2014 - 18:06
Crucial DDR4 Memory Performance Overview Early Look vs. DDR2 & DDR3 August 27, 2014 - 17:43
Corsair RM Series 1000W August 27, 2014 - 17:33
ASUS ROG Maximus VII Formula (Intel Z97) Motherboard August 27, 2014 - 16:34
Tt eSPORTS THERON Gaming Mouse August 27, 2014 - 16:33
Corsair HX750i Power Supply August 27, 2014 - 15:48
Aerocool DS200 August 27, 2014 - 14:24
Gigabyte J1900N-D3V August 27, 2014 - 09:55
bequiet! Shadow Rock Slim Heatsink August 27, 2014 - 09:55
Synology DS415play Four Bay NAS August 27, 2014 - 09:55
MSI GS70 Stealth Pro August 27, 2014 - 09:54
SanDisk Extreme PRO 480GB SSD August 27, 2014 - 09:54
Silicon Power Slim S70 240GB SSD August 26, 2014 - 21:59
AMD Radeon R9 290: Gallium3D vs. Catalyst Drivers August 26, 2014 - 18:43
Plextor M6 Pro SSD August 26, 2014 - 18:43
Amazon Fire Phone, A Dynamic Perspective August 26, 2014 - 18:24
LEPA G1600 MA EU 1600W PSU August 26, 2014 - 16:52
Digital Storm Bolt II Small Form Factor PC August 26, 2014 - 16:29
GIGABYTE Z97X-UD5H Motherboard - Circuit and Overclocking Guide August 26, 2014 - 16:29

Posted on Wednesday, August 27 2014 @ 18:21:26 CEST by
Intel logo
Intel announced it's now offering new packaging and test technologies to its foundry customers:
Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies.

Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and specialized interposer silicon that add complexity and cost.

"The EMIB technology enables new on-package functionality that may have been too costly to pursue with previous solutions," said Babak Sabi, Intel vice president and director, Assembly and Test Technology Development.

Intel also announced the availability of its revolutionary High Density Modular Test (HDMT) platform. HDMT, a combination of hardware and software modules, is Intel's test technology platform that targets a range of products in diverse markets including server, client, system on chip, and Internet of Things. Until now, this capability was only available internally for Intel products. Today's announcement makes HDMT available to customers of Intel Custom Foundry.

"We developed the HDMT platform to enable rapid test development and unit-level process control. This proven capability significantly reduces costs compared to traditional test platforms. HDMT reduces time to market and improves productivity as it uses a common platform from low-volume product debug up to high-volume production," said Sabi.

EMIB is available to foundry customers for product sampling in 2015 and HDMT is available immediately.


Posted on Wednesday, August 27 2014 @ 17:09:19 CEST by
Sharkoon debuts the VS4, a new line of budget cases with prices starting at just 24.99EUR.
VS4 series for home and office PCs | Standard, Value and Window versions available | USB 3.0 | pre-installed fan | MSRP from 24.99 euros

Sharkoon expands its range of low-cost cases and introduces a new ATX case series. The minimalist VS4 series is ideal for both home and office PCs and stands out due to its versatile features at an attractive price. The all-black ATX cases with a black interior finish are compatible with mini-ITX, micro-ATX as well as ATX, weigh 3.5 kg each, and are available in a Standard, Value or Window version. Dimensions are 445 x 200 x 430 mm (L x W x H).

In the front of both the Value and Window version there are two USB 3.0 and two audio ports. The Standard version provides two USB 2.0 and two audio ports. Thanks to the provided side panels the entire VS4 series offers space for the hassle-free installation of tower coolers with a height of up to 16 cm. Graphics cards with a maximum length of up to 31 cm, up to 38.5 cm after removing the SSD hard drive cage, can also be installed. A total of up to seven expansion cards can be installed. The maximum length for power supplies is 25 cm; a suitable dust filter is pre-installed on the bottom. All cases in the series offer installation openings for a CPU cooler, two openings for water cooling as well as a comfortable cable management system. The Window version is available with an acrylic side panel.

A 120 mm fan and provided dust filter are pre-installed in the front of all versions. In order to further strengthen the air flow inside the case, two additional 120 mm fans can be mounted on the side panel of the Value and Standard version. On the rear panel of the Window version, an additional 120 mm fan in pre-installed; it is optional for the Standard and Value version.

The entire series offers three 5.25" drive bays for optical drives (two of which are equipped with quick fasteners) or two 5.25" drive bays and an externally accessible 3.5" bay. Internally, three 3.5" hard drives using the quick fasteners can be installed. In the second mounting frame can three 2.5" HDDS/SDDs be installed, in the bottom of the case there is space for an additional 2.5"HDD/SDD.

The Sharkoon VS4 series is available in the versions Standard (VS4-S), Value (VS4-V) or Window (VS4-W) for the suggested retail price starting from 24.99 euros from authorized retailers.


Posted on Wednesday, August 27 2014 @ 17:05:42 CEST by
Zotac announces the ZBOX PI320 pico, a pocket-sized Windows 8.1 mini computer that measures just 115.5mm x 66mm x 19.2mm. It's based on the Intel Atom Z3735F (quad-core, 1.33 GHz, 1.83GHz Boost) with integrated graphics, 2GB DDR3L memory, 32GB eMMC flash storage, microSD memory card slot, 10/100Mbps Ethernet, 802.11n WiFi, Bluetooth 4.0, HDMI, and three USB 2.0 ports.
ZOTAC International, a global innovator and manufacturer of graphics cards and mini-PCs, today shrinks the mini-PC further with the pocket-sized ZBOX PI320 pico. The new ZOTAC ZBOX PI320 pico delivers a superb quad-core Windows 8.1 with Bing computing experience in a compact and versatile form factor.

“ZOTAC is a major innovator when it comes to miniaturizing the traditional PC. We began our push towards smaller and smaller mini-PCs with the ZBOX nano form factor and followed up with the ZBOX nano XS,” said Tony Wong, CEO, ZOTAC International. “Now with the all-new ZBOX PI320 pico, we have created our smallest mini-PC that can fit in your pocket.”

The pocketable form factor measures in at 115.5mm x 66mm x 19.2mm, which is roughly the same size as a small smartphone. Thanks to the tiny size, the ZOTAC ZBOX PI320 pico is the perfect mini-PC for any room in a house, specialized installations, and for seasoned travelers on the go

At the heart of the ZOTAC ZBOX PI320 pico is a quad-core Intel Atom processor with Intel HD Graphics technology for snappy system responsiveness and stunning high-definition video playback capabilities. The very energy-efficient processor is cooled with a fan-less heatsink that generates zero noise for an excellent silent computing experience.

Microsoft Windows 8.1 with Bing is preinstalled on the ZOTAC ZBOX PI320 pico mini-PC for instant out-of-box use. Just unbox the ZOTAC ZBOX PI320 pico, plug it in, connect peripherals, and power it on.

The ZOTAC ZBOX PI320 pico ships with 2GB of DDR3L memory and 32GB solid-state storage with a micro SDXC slot to instantly increase storage up to 128GB. External expansion is available via three USB 2.0 ports on the ZOTAC ZBOX PI320 pico.

A single HDMI output that’s capable of up to 1080p resolution enables the ZOTAC ZBOX PI320 pico to easily connect to most LCD monitors and displays. High-speed 10/100 Ethernet, 802.11n Wi-Fi, and Bluetooth 4.0 technologies ensure the ZOTAC ZBOX PI320 pico delivers fast networking performance with and without wires.

It’s time to experience versatile and pocketable computing with the ZOTAC ZBOX PI320 pico.

Posted on Wednesday, August 27 2014 @ 13:11:58 CEST by
EK Waterblocks delivers the EK-Supremacy EVO, the company's new flagship waterblocks. The firm promises the new very high-flow design will deliver unmatched thermal performance. On its website, EK claims you can get an enhancement of more than 2.2°C on most popular LGA1150 and LGA2011 processors compared with the Supremacy waterblock. Prices start at 62.95EUR.
EK Water Blocks, Ljubljana based liquid cooling gear manufacturer, is proud to introduce the successor to EK-Supremacy flagship performance universal CPU water block.

EK-Supremacy EVO is an evolution of a EK-Supremacy flagship performance water block, introduced in 2012. More than one year worth of round-clock development, CFD analysis and rigorous testing is now resulting in ultimate performance, unmatched by any other product on the market.

"One of the key performance improvements is closely related with flow velocity field distribution optimization through the nozzle of the water block", said Vlado Schweiger, chief hydrodynamic engineer at EK Water Blocks.

EK-Supremacy EVO is a universal CPU water block that fits all modern CPU sockets with a universal mounting mechanism that offers error-preventing, tool-less installation. The result is a perfect installation which results in optimal performance every time. EK-Supremacy EVO is truly the only product for performance seeking enthusiasts. The key features are:

- unmatched thermal performance - more than 2.2°C better performance on most popular LGA-1150 & LGA-2011 processors.
- very high-flow design - low hydraulic restricion allows this product to be used in setups using weaker water pumps.
- modular design - using various inserts and jets the performance can be further fine-tuned to unleash maximum performance by ensuring the optimal contact with the CPU integrated heat spreader (IHS).

"The key to optimal heat transfer is to ensure best possible mechanical contact between CPU and water block surface", said Niko Tivadar, Product Manager at EK Water Blocks. "We have achieved this by employing interchangeable inserts and jet plates. Getting those just right was a project on it's own".

The EK-Supremacy EVO uses the same cooling engine as it's predecessor. The cooling liquid accelerates through jet plate's nozzle and turbulently continues its path through numerous very thin channels, which provide extreme heat dissipating surface area. Specifically designed and carefully machined copper base (sometimes referred to as ‘cold plate’) is made from purest copper available on the market and is further polished to absolute mirror finish. This alone greatly improves the cooling performance of EK-Supremacy EVO. To top it off this CPU water block comes with Gelid GC-Extreme premium performance thermal compound. It just doesn't get much better than this!

The top is made from either CNC machined acrylic glass, POM Acetal or Brass (depending on the variant) while the insert is made from injection moulded (M)ABS polymer. Plexi top variants have two slots for easy installation of 3mm LED diodes.

CPU socket compatibility:
- Intel LGA-775
- Intel LGA-1150/1155/1156
- Intel LGA-1366
- Intel LGA-2011
- AMD Sockets: 939, 754, 940
- AMD Sockets: AM2, AM2+, AM3, AM3+,FM2, FM2+

- EK-Supremacy EVO series water block
- EK-Supremacy EVO PreciseMount mounting mechanism
- EK-Supremacy Backplate system (Intel LGA-1366 & AMD AMx Backplate; Intel LGA-115x Backplate ; rubber gasket)
- Additional AMD Socket mounting plate
- TIM / thermal grease: Gelid GC-Extreme (EKWB 1.5g)

Made in Slovenia - Europe!
EK-Supremacy EVO

EK-Supremacy EVO

Posted on Wednesday, August 27 2014 @ 12:56:17 CEST by
Samsung logo
Samsung announced it started mass producing world's first 64GB DDR4 RDIMM using 3D TSV (through silicon via) package technology. The modules feature 36 4Gb DDR4 memory chips manufactured on Samsung's most-advanced 20nm-class process.
Samsung Electronics, Ltd. announced today that it has started mass producing the industry's first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) "through silicon via" (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions.

The new RDIMMs include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies. The low-power chips are manufactured using Samsung's most advanced 20-nanometer (nm) class* process technology and 3D TSV package technology.

"Samsung is reinforcing its competitive edge in the DRAM market with its new state-of-the-art solution using its 3D TSV technology, while driving growth in the global DRAM market," said Jeeho Baek, vice president, memory marketing, Samsung Electronics. "By introducing highly energy-efficient DDR4 modules assembled with 3D TSV, we're taking a big step ahead of the mainstream DDR4 market, which should dramatically expand with the expected introduction of next-generation CPUs in the second half of this year."

Samsung's volume production of 3D TSV modules marks a new milestone in the history of memory technology, following the company's initial production of 3D Vertical NAND (V-NAND) flash memory last year. While 3D V-NAND technology embraces high-rise vertical structures of cell arrays inside a monolithic die, 3D TSV is an innovative packaging technology that vertically interconnects stacked dies. With its introduction of the new TSV modules, Samsung has further strengthened its technological leadership in the "3D memory" era.

To build a 3D TSV DRAM package, the DDR4 dies are ground down as thin as a few dozen micrometers, then pierced to contain hundreds of fine holes. They are vertically connected through electrodes that are passed through the holes. As a result, the new 64GB TSV module performs twice as fast as a 64GB module that uses wire bonding packaging, while consuming approximately half the power.

In the future, Samsung believes that it will be able to stack more than four DDR4 dies using its 3D TSV technology, to create even higher density DRAM modules. This will accelerate expansion of the premium memory market, in line with an acceleration of the transition from DDR3 to DDR4 throughout the server market.

Samsung has worked on improving 3D TSV technology since it developed 40nm-class* 8GB DRAM RDIMMs in 2010 and 30nm-class* 32GB DRAM RDIMMs in 2011 using 3D TSV. This year, Samsung started operating a new manufacturing system dedicated to TSV packaging, for mass producing the new server modules.

According to a research report from Gartner, the global DRAM market is expected to reach U.S. $38.6 billion and 29.8 billion units (1Gb equivalent) by year-end. Gartner also predicted that the server market will account for more than 20 percent of DRAM production this year with approximately 6.7 billion units (1Gb equivalent).
Samsung DDR4

Posted on Wednesday, August 27 2014 @ 12:49:05 CEST by
Kobo shows off its new Aura H2O, world's first eReader with a waterproof design. The device is IP67 certified and can withstand being submerged for up to 30 minutes in 1m of water with the USB port cover closed. The waterproof design should make the device safe to use near water, eliminating fears of using your eReader near a pool or at the beach.

The Aura H2O has a 1440 x 1080 pixels e-Ink screen with a pixel density of 256dpi. The device has WiFi and the screen includes a backlight for reading in low-light conditions. Pricing will be around 179EUR, which is 20EUR more than the non-waterproof Aura HD.
Kobo Aura H2O is the first premium eReader to have a waterproof* and dustproof design that allows you to take it worry-free from the beach, to the bath, to your bed. Plus, with up to 2 months of battery life, you have the freedom to keep reading, wherever you go. So if you drop it in the bath or accidentally spill a drink on it, your Kobo Aura H2O will still work like new. Just use the included drying cloth to dry the screen, so you can get back to reading**.

Kobo Aura H2O has an extra-large, no-glare 6.8” Carta E Ink touchscreen that reads like print on paper – even in direct sunlight. With ClarityScreen+, you will get a high definition reading experience, with crisp, clear text for easy reading. Plus, with its fully adjustable ComfortLight directing light at the page and not your eyes, eyestrain is minimized day or night.
Kobo Aura H2O

Posted on Wednesday, August 27 2014 @ 12:37:17 CEST by
Intel logo
Intel's Skylake-S will feature a new integrated graphics core with support for DirectX 12, OpenGL 5.x and Open CL 2.x. Skylake-S will be a bit of a strong duck, this 14nm architecture is actually the successor of Broadwell, the upcoming 14nm shrink of the current Haswell architecture, but both architectures are expected to coexist and sit on top of each other in 2015.
We cannot guarantee that the DirectX 12 support means that it will support all fixed function hardware features of the DirectX 12 API. It could indicate lower level support, closer to the AMD’s Mantle API.

The new thing that comes from the house of Intel is accelerated media support for the latest generation codecs including HEVC, VP8 and VP9. Intel doesn’t specify what sort of High Efficiency Video Coding it supports as this video compression standards goes all the way to 8192x4320.

Skylake-S graphics supports display resolution up to 4096x2304 which should be enough for everyone. Essentially this is 4K in 16:10. It comes with support for three independent displays. Intel HD graphics features embedded Display Port eDP.
Source: FUD Zilla

Posted on Wednesday, August 27 2014 @ 12:28:45 CEST by
HP logo
HP announced a recall of over 6 million power cords that were shipped with HP and Compaq laptops and docking stations in the United States and Canada from September 2010 to June 2012. The affected power cables are marked with part number "LS-15", which is molded into the connector that plugs into the AC adapter.

The company explains these power cords pose a risk of a fire and burn hazard to consumers, if you have one of these power plugs you can check at HP's website if yours needs to be replaced.

To date HP received 29 reports of incidents with the LS-15 power plug, including two claims of minor burns and 13 claims of minor property damage. If your power cord is affected, HP urges you to stop using it until you receive your free replacement.
On August 26, 2014 HP announced a worldwide voluntary recall and replacement program in cooperation with various government regulatory agencies, for affected AC power cords distributed worldwide with HP and Compaq notebook and mini notebook computers, as well as with AC adapters provided with accessories such as docking stations, sold from September 2010 through June 2012.

HP customers affected by this program will be eligible to receive a replacement AC power cord for each verified, recalled AC power cord at no cost.

HP believes that certain power cords shipped with notebook PC products and AC adapter accessories may pose a risk of a fire and burn hazard to customers. We are taking this action as part of our commitment to provide the highest quality of service to our notebook customers.

Note: Not all HP and Compaq notebook and mini notebook PCs were sold with an affected power cord. Please validate the power cord shipped with your notebook PC or purchased with an accessory, or as a spare.


Posted on Wednesday, August 27 2014 @ 12:21:13 CEST by
Apple logo
Bloomberg claims Apple is developing its largest-ever iPad in an effort to increase tablet adoption in businesses. The new iPad will reportedly enter production in the first quarter of 2015 and may have a 12.9" screen.
Potential customers for larger-screen iPads are businesses, where the device could take on more tasks of a traditional laptop computer. In July, Apple unveiled a partnership with International Business Machines Corp. (IBM), and Cook said part of the pact’s rationale was to sell to corporations so they could “be a catalyst for future iPad growth.”

Jitesh Ubrani, an analyst at researcher IDC, said while tablet sales growth has slowed, he projects businesses, schools and governments will become bigger buyers of the devices. Those groups accounted for 16 percent of tablet sales in the second quarter this year, up from 13 percent a year earlier, he estimated.


Posted on Wednesday, August 27 2014 @ 12:17:39 CEST by
Amazon's Fire Phone hit the market about a month ago and even though there are no official sales figures it seems like the smartphone fails to impress consumers. The Guardian's Charles Arthur did his best to estimate how many units were sold and his best-case scenario is that only 35,000 Fire phones were sold.
The reasons for the Fire Phone’s flop are numerous and obvious: It was launched as an exclusive on AT&T, it was priced as highly as established brands such as the iPhone and the Galaxy S series even though it was a very late entrant, and it didn’t offer any compelling features outside of a 3D display and other gimmicks. In retrospect, comparisons between the Fire Phone and HTC’s ill-fated “Facebook Phone” may have been unfair to the Facebook phone.
Amazon Fire Phone

Source: BGR

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