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TSMC aims to start building 3nm fab in 2020

Posted on Monday, November 06 2017 @ 10:55:46 CET by

TSMC logo
TSMC founder and chairman Morris Chang revealed he expects his company will kick off construction of a 3nm wafer fab in Southern Taiwan Science Park (STSP) in 2020. Chang says he's confident that the Taiwanese government will be able to work out deals to settle all the outstanding water, power, and land supply issues to make the construction of the fab possible. Additionally, he is also confident that Taiwan will provide "a complete package of measures" to assist with the establishment of the 3nm fab.

Chang also had a couple of remarks about the importance of AI:
Chang also talked about the importance of artificial intelligence (AI) to TSMC's competitiveness. There are already mobile devices featuring AI capabilities, and the technology is expected to be used widely, such as healthcare applications, where AI could make a significant impact, Chang indicated.

TSMC has been investing in AI for its target markets including mobile computing, automotive electronics, IoT and high-performance computing, Chang noted. TSMC is gearing up to provide advanced process technologies and sufficient production capacities for more AI applications, which will make a positive contribution to company growth in the future, Chang said.
Within about seven months, Chang will retire from TSMC. Aged 86, he says he's seeking a quiet life and wants to spend the final years of his life with his family.



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