Here is another collab between ASUS and Noctua. The firm's partnered up a third time to create the ASUS GeForce RTX 4080 Noctua Edition graphics card. The promise here is this RTX 4080 is the quietest air-cooled video card in its class.

The Noctua-cooled card has two NF-A12x25 PWM 120mm and an optimized heatsink with a vapor chamber and a total of eight heatpipes. The Noctua edition is said to produce just 33.7dBA at maximum fan speed, a massive difference versus the 48.6dBA of the stock model, while delivering comparable cooling performance.

Following the resounding success of the ASUS GeForce RTX 3070 and RTX 3080 Noctua Edition, the Noctua Edition of ASUS’ GeForce RTX 4080 is the third graphics card to feature Noctua fans and a heatsink that has been co-engineered by Noctua. By switching from the stock three slim 110mm fans to two of Noctua’s award-winning NF-A12x25 PWM 120mm units and to a more elaborate, tailored heatsink with vapour chamber and five instead of two 8mm diameter heatpipes, thermals and acoustics of ASUS’ original TUF Gaming GeForce RTX 4080 could be improved significantly for the Noctua Edition, making it the quietest card in its class.

Corsair introduced a number of new VENGEANCE DDR5 series memory modules this week. The California-based hardware maker now has 7000MHz 48GB dual-channel kits, as well as 5200MHz 192GB quad-channel kits. Pricing is listed below.

CORSAIR® (NASDAQ: CRSR), a world leader in enthusiast components for gamers, creators, and PC builders, today announced new high-speed 7000MT/s 48GB (2x 24GB) VENGEANCE RGB DDR5 and VENGEANCE DDR5 memory kits, as well as the general availability of its massive 192GB (4x 48GB) DDR5-5200 kits. CORSAIR has worked closely with motherboard manufacturer ASUS to ensure that these new kits work flawlessly across its full range of 700 series motherboards, making them an ideal high-speed companion for the latest 13th Gen Intel® Core™ processors.

These new memory kits are compatible with all Intel® 700 series motherboards, but the close working relationship between ASUS and CORSAIR demonstrates both company’s commitment to delivering optimal performance and compatibility for customers. Rigorous testing of these new VENGEANCE DDR5 memory kits ensures they work across the full range of ASUS motherboards, including at the new higher DDR5-7000 speeds.

CORSAIR announced its 48GB and 96GB Memory kits on February 22nd, but has now bolstered this high-capacity line-up with faster 7000MT/s 48GB kits with 40-52-52-114 timings. These 1.4V DDR5 memory modules support Intel® XMP 3.0 for easy setup and offer the critical combination of high-capacity and impressive throughput, making them ideal for enthusiasts that want the best from their machines.

Recent games have started demanding at least 32GB of RAM for the highest settings, and these new 48GB kits ensure plenty of capacity to handle such games while also giving room for other demanding workloads such as streaming, 8K video editing, AI and deep learning training, as well as 3D rendering.
Also launching today are VENGEANCE RGB DDR5 and VENGEANCE DDR5 192GB kits. Using 4x 48GB modules and rated at 5200MT/s with 38-38-38-84 timings, these kits also support Intel® XMP 3.0 for easy setup and operate at 1.25V.

Both the 48GB and 192GB memory kits are available as VENGEANCE RGB DDR5 and VENGEANCE DDR5 memory kits, giving you the option of building an aesthetically striking machine with fully-programmable RGB lighting using CORSAIR iCUE Murals and ASUS Armoury Crate, or a more subdued system—the choice is yours.

Specifications and pricing:

• CMH48GX5M2B7000C40: CORSAIR VENGEANCE RGB DDR5 48GB (2x24GB) DDR5-7000 (PC5-56000) - 40-52-52-114 - $284.99
• CMK48GX5M2B7000C40: CORSAIR VENGEANCE DDR5 48GB (2x24GB) DDR5 7000 (PC5-56000) - 40-52-52-114 - $274.99
• CMH192GX5M4B5200C38: CORSAIR VENGEANCE RGB DDR5 192GB (4x48GB) DDR5 5200 (PC5-41600) - 38-38-38-84 - $749.99
• CMK192GX5M4B5200C38: CORSAIR VENGEANCE DDR5 192GB (4x48GB) DDR5 5200 (PC5-41600) - 38-38-38-84 - $724.99

Corsair delivers an industry first by creating a power supply with side-positioned connectors. The RMx SHIFT ATX 3.0 power supplies are fully modular and promise to make cable management easier than ever. The units feature 80Plus Gold certification and are available in 750W to 1200W versions.

CORSAIR® (NASDAQ: CRSR), a world leader in enthusiast components for gamers, creators, and PC builders, today announced the revolutionary RMx SHIFT Series of ATX 3.0 certified power supplies, giving custom PC enthusiasts a new way to build. Available in wattages from 750W up to 1200W, these fully modular 80 PLUS Gold-certified PSUs feature the DC connector panel on the side of the unit, granting easier access to your cables and simpler, cleaner cable management.

The RMx SHIFT Series' repositioned side panel (patent-pending) gives you a clear view and better access to all modular micro-fit connections, making connecting and maintaining your cables a breeze. Not only does this make attaching and detaching cables easy, it also means they won’t be bent or twisted as much to reach the connectors, resulting in less strain and a cleaner build.

Every model of RMx SHIFT is ATX 3.0 certified and PCIe 5.0 compliant for powering the latest cutting-edge systems, helping to improve overall system performance and reliability while providing the power needed to operate at the highest levels. With an included high-quality PCIe 5.0 12VHPWR GPU cable, the RMx SHIFT Series is ready for use with modern graphics cards such as the NVIDIA® GeForce™ RTX 40 Series.

The RMx SHIFT Series comes equipped with all the features that PC builders have come to expect from the RMx name. Only connect the cables your system needs thanks to fully modular CORSAIR Type 5 Gen 1 micro-fit cables. A 140mm fluid dynamic bearing fan utilizes a specially calculated fan curve for high performance, low noise, and superior reliability, with support for Zero RPM fan mode for near-silent operation at low loads. 80 PLUS Gold and Cybenetics Gold-certified, the RMx SHIFT Series is rated for steady power output at up to 90% efficiency. 100% 105°C-rated Japanese electrolytic capacitors guarantee unwavering power delivery and long-term durability.

CORSAIR has tested the RMx SHIFT in all current CORSAIR cases to guarantee compatibility, and has already updated the online PC Builder database with the most popular third party cases. CORSAIR is hard at work verifying compatibility with most third party cases and will continue to add that information to the PC Builder database over the coming weeks. As a general guideline, a minimum clearance of 30mm of open space to the side of the bottom compartment is necessary to accommodate the side-positioned connector panel.

For a new perspective on how to build and connect your next PC, look for the RMx SHIFT Series and get a PSU that’s on your side.

Here's something I believed we'd never see from Noctua: fan grills. The Austrian cooling specialist sends out word about its NA-FG1, a new type of fan grill that uses a tool-free mounting system that promises to reduce turbulence. The firm sells versions for 40, 50, 60, 70, 80, 92, 120, 140, and 200mm fans. Packs of two and packs of five are offered but don't expect them to be cheap. A dual pack for 120mm or 140mm fans will set you back $14.90.

Noctua today introduced its new NA-FG1 series of fan grills for 40, 50, 60, 70, 80, 92, 120, 140 and 200mm fans. Available in sets of 2 (Sx2) or 5 (Sx5) including screws and a tool-free mounting system that can help to reduce turbulence and thereby improve both airflow performance and noise levels, Noctua’s NA-FG1 are premium grade fan grills for the highest demands in acoustic optimisation and ease of installation.

“Fan grills may seem like a trivial accessory, but many available solutions can seriously hamper your fans’ acoustics and performance, so we decided to offer our own selection of grills”, explains Roland Mossig (Noctua CEO). “Our NA-FG1 use a proven, highly efficient design and top it off with a convenient tool-free mounting system that introduces an extra offset and can thereby help to improve both airflow and noise levels.”

While flat fan grills or fan guards with sharp edges can create unpleasant, high-pitched turbulence noises and often also reduce airflow significantly, Noctua’s NA-FG1 units use an offset design with rounded struts in order to ensure that the impact on fan acoustics and performance is as low as possible.

The included tool-free push-pin mounting system not only makes installation a breeze, even if the fans are already installed in a PC system, it also introduces an additional 5mm offset in order to achieve even lower influx turbulence, further improved running smoothness and better airflow performance. In Noctua’s tests, the additional offset allowed to reduce the grills’ average impact on airflow performance from 3 to 2% and the average impact on noise levels from 1.2dB(A) to 0.6dB(A).

Last but not least, the high-quality matte black finish and the Noctua logo at the centre make the NA-FG1 grills a visual testament to Noctua’s renowned premium quality.

The NA-FG1 are available in sets of 2 (Sx2) and 5 (Sx5). In addition to the fan grills, the kits include standard fan screws as well as Noctua’s unique, offset push-pin mounts for tool-free, acoustically optimised installation (one set of screws and one set of push-pins for each fan grill).

The manufacturer’s suggested retail prices are as follows: NA-FG1-4: EUR/USD 12.90 (Sx2) / EUR/USD 19.90 (Sx5)
NA-FG1-5: EUR/USD 12.90 (Sx2) / EUR/USD 19.90 (Sx5)
NA-FG1-6: EUR/USD 12.90 (Sx2) / EUR/USD 19.90 (Sx5)
NA-FG1-7: EUR/USD 12.90 (Sx2) / EUR/USD 19.90 (Sx5)
NA-FG1-8: EUR/USD 12.90 (Sx2) / EUR/USD 19.90 (Sx5)
NA-FG1-9: EUR/USD 12.90 (Sx2) / EUR/USD 19.90 (Sx5)
NA-FG1-12: EUR/USD 14.90 (Sx2) / EUR/USD 24.90 (Sx5)
NA-FG1-14: EUR/USD 14.90 (Sx2) / EUR/USD 24.90 (Sx5)
NA-FG1-20: EUR/USD 19.90 (Sx2) / EUR/USD 29.90 (Sx5)

Earlier this week we saw the launch of Intel's newest processor, the Core i9-13900KS. This powerful processor boasts an impressive 6.0GHz max turbo frequency, making it the fastest desktop processor on the market. It's the first processor in the PC industry to cross the 6.0GHz mark at stock. It's sold for $699.

What's New: Intel today announced full details and availability for the new 13th Gen Intel® Core™ i9-13900KS, the world's fastest desktop processor1. It delivers up to 6.0 gigahertz (GHz) max turbo frequency out of the box – the first processor in the PC industry to cross that threshold at stock – to power world-class gaming and creating experiences for desktop enthusiasts.

"The Core i9-13900KS continues our 13th Gen Intel Core desktop processor family excellence, showcasing the new performance heights made possible by our performance hybrid architecture. Extreme gamers and enthusiasts can now push their everyday performance further than ever before with the first desktop processor in the PC industry to provide 6.0 GHz speeds at stock." –Marcus Kennedy, Intel Client Computing Group manager, Gaming and Channel

Why It Matters: The unlocked i9-13900KS processor represents a major milestone in the PC industry – bringing faster speeds than before to enthusiast desktop users. In addition to 24 cores, it delivers up to 6.0 GHz max turbo frequency and 36MB Intel® Smart Cache for incredible performance in gaming and content creation workloads.

What It Offers: Key features and capabilities of the i9-13900KS include:

• Up to 6.0 GHz max turbo frequency with Intel® Thermal Velocity Boost – the first CPU in the PC industry to reach 6.0 GHz without overclocking.
• Intel® Adaptive Boost Technology for improved gaming performance by opportunistically allowing higher multicore turbo frequencies.
• 24 cores (eight Performance-cores and 16 Efficient-cores), 32 threads, 150W processor base power, 36MB Intel Smart Cache and a total of 20 PCIe lanes (16 PCIe 5.0 and four PCIe 4.0 lanes).
• Up to DDR5 5600 MT/s and DDR4 3200 MT/s support.
• Compatible with Z790 and Z690 motherboards, with the latest BIOS recommended for the best gaming and content creation experience.

The i9-13900KS processor allows gamers and enthusiasts to take performance to the next level.

When It's Available: This special edition processor will be available beginning Jan. 12, 2023, with a recommended customer price starting at $699. It can be found at retailers worldwide as a boxed processor and integrated into systems from Intel's channel and OEM partners.

XDA Developers offers a hot take on the recent news about TSMC's 3nm process technology. One of the profound implications of TSMC's latest process technology seems to be that historical scaling is officially dead. According to TSMC's own figures, the 3NE node will have exactly the same SRAM cache density as its 5nm predecessor.

The 3NB node, which is more of a niche product, will have some SRAM scaling. But even that node's SRAM scaling will be a mere 5 percent better than 5nm. Chip-level transistor scaling is still 1.6x and 1.7x for N3B and N3E, but overall it's bad news for Moore's Law as shrinking chips is becoming increasingly more complex.

But the problem isn't just about not being able to increase the amount of cache without using up more area. Processors can only be so large, and any space taken up by cache is space that can't be used for logic, or the transistors that lead to direct performance gains. At the same time, processors with more cores and other features need more cache to avoid memory-related bottlenecks. Even though the density of logic continues to increase with every new node, it might not be enough to compensate for the lack of SRAM scaling. This might be the killing blow for Moore's Law.

Dear readers of DVHARDWARE,

Christmas is almost upon us, and that means it's time to look back on the past year and look forward to the new one. First and foremost, I would like to apologize for posting relatively little content this year. It has been a busy year for me. Between a new job and a family, I was often too busy with other things to make time for writing and posting new articles.

However, despite my absence on the website, I still believe in the power of technology to improve and enrich our lives. DVHARDWARE looks forward to the new year, in which there will hopefully be more time to post new and interesting articles.

I wish all readers of DVHARDWARE a happy holiday season and a healthy and successful new year!



P.S. This post was almost entirely written by AI! The capabilities of ChatGPT are impressive to say the last.

MONTECH showcases the SKY TWO, a new mainstream computer case that offers an unobstructed view of your hardware by incorporating not only a left side window but also a front side window. The case uses a unique airflow design, by using fine mesh intake from the bottom of the front and side panels. The SKY TWO is sold online in three colors; Black (US$99.99), Pristine White (US$105.99), and Morocco Blue (US$119.99).

Highlights:

• Front and side tempered glass panels for unobstructed view
• Unique airflow with fine mesh intake from the bottom of front and side panel
• Supports motherboards from Mini-ITX to E-ATX, and 360mm radiator on top
• Supports the latest NVIDIA 4000 series GPUs
• 3 x pre-installed RX120 reversed blades 120mm ARGB/PWM fans with fan controller hub, 1 x pre-installed AX120 fan at the rear
• Available in Black US$99.99, Pristine White US$105.99, Morocco Blue US$119.99

MONTECH, an innovative PC components and peripherals brand, announces the SKY TWO, a mainstream mid-tower case that showcases your PC components with the front and side tempered glass panels. The latest addition to the SKY series offers top cooling performance with a unique airflow configuration featuring fine mesh bottom front panel and side panel, 3 pre-installed RX120 reversed 120mm ARGB/PWM fans at the side and bottom and pre-installed AX120 ARGB/PWM fan at the rear. The SKY TWO is compatible with motherboards from Mini-ITX to E-ATX, supports top mounting of up to a 360mm radiator and fans, and features a top I/O including a USB Gen 2 Type C port. The SKY TWO is available in Black US$99.99, Pristine Frost White US$105.99, and Morocco Blue US$119.99.

Designed for High-Performance
The SKY TWO offers a unique airflow approach with the lower portion of the front and left side panel designed with a fine mesh optimized for airflow and dust filtration. This concept ensures plenty of air is pushed through the PSU shroud and fed into the fans above it, providing a direct supply of fresh air to the GPU. In addition, the 3 pre-installed RX120 120mm ARGB/PWM fans (2 at the side and 1 at the bottom) feature a reverse blade design which allows them to be installed as intake with their best side visible. An additional 120mm ARGB/PWM fan is pre-installed at the rear of the SKY TWO to create a balanced out-of-the-box thermal solution.

Unobstructed View and High-End Compatibility
The SKY TWO is equipped with two tempered glass panels, one at the front and one on the left side of the case, allowing a full view of the PC hardware installed inside, and easily removable to provide an unrestricted building experience. Users are presented with great configuration possibilities with the SKY TWO’s compatibility for Mini-ITX to E-ATX motherboards, 168mm tall CPU cooling towers support, up to a 360mm radiator at the top, and up to 400mm long GPUs, enough to support the latest NVIDIA 4000 series graphics without any issues. In addition, the SKY TWO can support up to 2 x HDDs/SSDs in the PSU chamber drive cage, and 2 x SSDs in the second chamber, which is also equipped with 3 large Velcro straps, and a fan hub capable to support up to 6 ARGB and PWM devices (with 3 ports each populated by the pre-installed fans).

3 Colors to Choose From
The SKY TWO is available in classic black, a Pristine white, and a special Morocco blue. The Pristine White edition is an inside-out all-white design with white rubber grommets, white fans, and silver screws. The Morocco Blue edition, each part of the case features a unique blue from the tempered glass panel’s edges to the fans, grommets, and case screws.

Optional Accessories
The AX120 PWM and RX120PWM (reversed fan) are also sold separately, MSRP $8.90 in black, and $9.90 in white. The reversed blade design complements builds with more intake fans while maintaining a great aesthetics. Users can also opt for the VGM Vertical GPU Mounting at MSRP$59. The vertical GPU kit comes with a 220mm PCIe 4.0 riser card and is compatible with any case with 7 PCIe expansion slots.

Specifications
Product Name	SKY TWO
Exterior Color	Black, Pristine White, Morocco Blue
Dimensions (LxWxH)	430x215x490mm
Motherboard Support	E-ATX/ATX/Micro ATX/Mini ITX
Fan Support	Top: 3 x 120 / 2 x 140mm Side: 2 x 120mm Bottom: 2 x 120mm Rear: 1 x 120mm
Radiator Support	Top: 120//240/280/360mm Rear: 120mm
Clearances	GPU: 400mm CPU: 168mm PSU: 210mm
Power Supply Support	Bottom mount, ATX
Expansions Slots	7
Drive Bays	3.5” = x 2 2.5” = x 4
I/O Port	2 x USB3.0, 1 x USB Type C, 1 x HD Audio, 1 x Mic, LED Button
Included Fans	3 x RX120 Reversed Blades ARGB/PWM 120mm (Front) 1 x AX120 ARGB/PWM 120mm (Rear) Speed: 800-1600 RPM Airflow: 59 CFM Air Pressure: 1.8 mm H2O Noise: 27 dBA
Accessory	Fan hub with 6 x ARBG/PWM headers

Over at IEDM 2022 this week, Intel talked about how it plans to keep Moore's Law alive. Among other things, the chip giant revealed advances in 3D packaging tech with a 10x density improvement and new materials for 2D transistor scaling beyond RibbonFET, including a material just 3 atoms thick. Intel says we can expect packages with trillions of transistors by 2030.

What's New: Today, Intel unveiled research breakthroughs fueling its innovation pipeline for keeping Moore's Law on track to a trillion transistors on a package in the next decade. At IEEE International Electron Devices Meeting (IEDM) 2022, Intel researchers showcased advancements in 3D packaging technology with a new 10x improvement in density; novel materials for 2D transistor scaling beyond RibbonFET, including super-thin material just 3 atoms thick; new possibilities in energy efficiency and memory for higher-performing computing; and advancements for quantum computing.

"Seventy-five years since the invention of the transistor, innovation driving Moore's Law continues to address the world's exponentially increasing demand for computing. At IEDM 2022, Intel is showcasing both the forward-thinking and concrete research advancements needed to break through current and future barriers, deliver to this insatiable demand, and keep Moore's Law alive and well for years to come." –Gary Patton, Intel vice president and general manager of Components Research and Design Enablement

What's Happening at IEDM: Commemorating the 75th anniversary of the transistor, Dr. Ann Kelleher, Intel executive vice president and general manager of Technology Development, will lead a plenary session at IEDM. Kelleher will outline the paths forward for continued industry innovation – rallying the ecosystem around a systems-based strategy to address the world's increasing demand for computing and more effectively innovate to advance at a Moore's Law pace. The session, "Celebrating 75 Years of the Transistor! A Look at the Evolution of Moore's Law Innovation," takes place at 9:45 a.m. PST on Monday, Dec. 5.

Why It Matters: Moore's Law is vital to addressing the world's insatiable computing needs as surging data consumption and the drive toward increased artificial intelligence (AI) brings about the greatest acceleration in demand ever.

Continuous innovation is the cornerstone of Moore's Law. Many of the key innovation milestones for continued power, performance and cost improvements over the past two decades – including strained silicon, Hi-K metal gate and FinFET – in personal computers, graphics processors and data centers started with Intel's Components Research Group. Further research, including RibbonFET gate-all-around (GAA) transistors, PowerVia back side power delivery technology and packaging breakthroughs like EMIB and Foveros Direct, are on the roadmap today.

At IEDM 2022, Intel's Components Research Group showed its commitment to innovating across three key areas to continue Moore's Law: new 3D hybrid bonding packaging technology to enable seamless integration of chiplets; super-thin, 2D materials to fit more transistors onto a single chip; and new possibilities in energy efficiency and memory for higher-performing computing.

How We Do It: Components Research Group researchers have identified new materials and processes that blur the line between packaging and silicon. We reveal critical next steps on the journey to extending Moore's Law to a trillion transistors on a package, including advanced packaging that can achieve an additional 10x interconnect density, leading to quasi-monolithic chips. Intel's materials innovations have also identified practical design choices that can meet the requirements of transistor scaling using novel material just 3 atoms thick, enabling the company to continue scaling beyond RibbonFET.

Intel introduces quasi-monolithic chips for next generation 3D packaging:

• Intel's latest hybrid bonding research presented at IEDM 2022 shows an additional 10 times improvement in density for power and performance over Intel's IEDM 2021 research presentation.
• Continued hybrid bonding scaling to a 3 um pitch achieves similar interconnect densities and bandwidths as those found on monolithic system-on-chip connections.

Intel looks to super-thin '2D' materials to fit more transistors onto a single chip:

• Intel demonstrated a gate-all-around stacked nanosheet structure using 2D channel material just 3 atoms thick, while achieving near-ideal switching of transistors on a double-gate structure at room temperature with low leakage current. These are two key breakthroughs needed for stacking GAA transistors and moving beyond the fundamental limits of silicon.
• Researchers also revealed the first comprehensive analysis of electrical contact topologies to 2D materials that could further pave the way for high-performing and scalable transistor channels.

Intel brings new possibilities in energy efficiency and memory for higher-performing computing:

• To use chip area more effectively, Intel redefines scaling by developing memory that can be placed vertically above transistors. In an industry first, Intel demonstrates stacked ferroelectric capacitors that match the performance of conventional ferroelectric trench capacitors and can be used to build FeRAM on a logic die.
• An industry-first device-level model captures mixed phases and defects for improved ferroelectric hafnia devices, marking significant progress for Intel in supporting industry tools to develop novel memories and ferroelectric transistors.
• Bringing the world one step closer to transitioning beyond 5G and solving the challenges of power efficiency, Intel is building a viable path to 300 millimeter GaN-on-silicon wafers. Intel breakthroughs in this area demonstrate a 20 times gain over industry standard GaN and sets an industry record figure-of-merit for high performance power delivery.
• Intel is making breakthroughs on super-energy-efficient technologies, specifically transistors that don't forget, retaining data even when the power is off. Already, Intel researchers have broken two of three barriers keeping the technology from being fully viable and operational at room temperature.

Intel continues to introduce new concepts in physics with breakthroughs in delivering better qubits for quantum computing:

Intel researchers work to find better ways to store quantum information by gathering a better understanding of various interface defects that could act as environmental disturbances affecting quantum data.

Reports out of Asia suggest NVIDIA and Apple will be among the first customers of the future TSMC fab in Arizona. This fab is expected to make 5nm chips and is believed to be ready for production in 2024. In February, Seeking Alpha noted the fab's construction was running about three to six months behind schedule.

More domestic chip production capacity is one of the big goals of both the US and the European Union, as both realize the world's supply is very concentrated in a tiny part of Asia.

Last month, Apple (AAPL) Chief Executive Tim Cook told employees that the tech giant would source some of its chips from Arizona as the company looks to diversify its supply chain.

"We’ve already made a decision to be buying out of a plant in Arizona, and this plant in Arizona starts up in ’24, so we’ve got about two years ahead of us on that one, maybe a little less,” Cook told employees in Germany. "And in Europe, I’m sure that we will also source from Europe as those plans become more apparent."