be quiet!, the German manufacturer for premium PC components, is expanding its Pure Power 11 FM power supply range with two high-wattage models: 850W and 1000W. Pure Power 11 FM is aimed at mainstream computer users who appreciate the versatility of modular cables and 80 PLUS® Gold efficiency up to 93.9 percent. The new high-wattage options are specifically aimed at value-oriented PC systems with high-end graphics cards.
High-wattage, fully modular power supply for mainstream users
At be quiet!, Pure Power stands for peerless dependability and a comprehensive feature set at a competitive price point. The new additions tot he Pure Power 11 FM series are no exceptions: by exclusively using fully modular instead of fixed cables, only cables that serve a purpose are installed, resulting in a smoother airflow, lower temperatures, and easier handling inside the case. Pure Power 11 FM comes equipped with black flat cables for all common connections and a black sleeved 20+4-pin ATX power cable. With two independent 12V rails for signal stability, up to six PCI-Express connectors, and power output options now ranging up to an impressive 1000 watts, Pure Power 11 FM is fully suited for silent PC configurations and even gaming systems with a high-end graphics card.
80 PLUS® Gold efficiency and improved topology
Pure Power 11 FM is 80 PLUS® Gold certified with an efficiency rating of up to 93.9 percent, a truly outstanding level for this PSU class. The most compelling benefits of this high efficiency are lower power consumption, lower electricity costs and a cooler, quieter operation. Pure Power 11 FM is equipped with LLC + SR + DC/DC technology for advanced stability and voltage regulation. Cooling is achieved with a silence-optimized 120mm be quiet! fan with airflow-optimized fan blades, enabling the extraordinarily silent operation that be quiet! is famous for. As usual, all modern protection circuits (including UVP, OVP, SCP, OPP, OCP, and OTP) are integrated. be quiet! offers a 5-year manufacturer’s warranty on all Pure Power 11 FM.
With a sales start of Pure Power 11 FM 850W and 1000W on February 8, this is the full recommended retail pricing of the series:
- Pure Power 11 FM 550W: €89.90 $89.90 £79.99
- Pure Power 11 FM 650W €99.90 $99.90 £89.99
- Pure Power 11 FM 750W €114.90 $114.90 £105.99
- Pure Power 11 FM 850W €124.90 $129.90 £109.99
- Pure Power 11 FM 1000W €154.90 $159.90 £134.99
The ARM deal faces a lot of issues, including a lawsuit with the FTC that could take months. Furthermore, NVIDIA also has yet to receive the thumbs up from the European Union, the UK, and China. Having failed to convince regulatory authorities, NVIDIA is reportedly no longer expecting the transaction to close. The green team originally expected the deal would close around March of this year -- a timeline that's no longer realistic.
Nvidia has told partners that it doesn’t expect the transaction to close, according to one person, who asked not to be identified because the discussions are private. SoftBank, meanwhile, is stepping up preparations for an Arm initial public offering as an alternative to the Nvidia takeover, another person said.If NVIDIA backs away from the deal, it will have been a pricey folly. ARM and SoftBank, which owns ARM, are entitled to keep the $2 billion NVIDIA paid at the signing of the deal, including a $1.25 billion breakup fee.
InWin has announced its latest N127 and 127 mainstream, mid tower PC cases. With a myriad of ARGB shimmering, shining stars adorning the front panel, the “Nebula” effect provides users with a spectacular luminous effect that creates a ripple of reflections that appear to recede to infinity. The N127 is designed for builders that prefer ATX, mATX or mini-ITX builds, and are looking for a strong, high-quality chassis that exhibits a beautiful, striking design with ARGB elements, uncompromised cooling and easy-to-build features.
Improving the powerful airflow design from the previous 100-series, the N127 features a steel mesh front panel and honeycomb ventilation on its side panel that optimizes airflow and heat dissipation. Six fans (two front, three side, one rear) support up to two liquid-cooling radiators (240mm and 360mm) to ensure powerful cooling performance for CPUs and graphics cards. It’s ideal for partnering with a new InWin Nebula AIO liquid CPU cooler, which boasts a similar Nebula ARGB effect on the CPU block!
The tinted, tempered glass side panel offers a convenient, quick-release button to gain access to the hardware inside. The N127 supports high-end graphics cards up to 345mm long, which can be directly supported using an updated anti-sag bracket that keeps your GPU from sagging, protecting your hardware even while being transported. Builders can fit two 2.5-inch drives plus two more 3.5-inch/2.5-inch or drives, as well as premium power supplies up to 200mm long.
InWin equips the N127 with a premium Luna AL120 ARGB PWM fan, giving users exceptional cooling performance and the option of ARGB inside, right out the box. It’s soft radiating glow from its internal ARGB lighting can be controlled by compatible motherboards.
Speedy front panel I/O connectivity includes the latest USB 3.2 Gen 2x2 Type-C connector offering 20Gbps of wired performance to external peripherals and accessories such as external drives, DAS, direct data transfers or even eGPUs. Other connectivity includes two USB 3.1 Gen-1 Type-A, and 3.5mm HD headphone and microphone sockets.
Alongside the N127, InWin also offers the new 127 chassis with all the same, great features except for a modest ARGB InWin logo, replacing the Nebula lighting effect on the front panel. This will also come without the AL120 fan, for PC builders that prefer a more subtle build.
Intel today announced plans for an initial investment of more than $20 billion in the construction of two new leading-edge chip factories in Ohio. The investment will help boost production to meet the surging demand for advanced semiconductors, powering a new generation of innovative products from Intel and serving the needs of foundry customers as part of the company's IDM 2.0 strategy. To support the development of the new site, Intel pledged an additional $100 million toward partnerships with educational institutions to build a pipeline of talent and bolster research programs in the region.
"Today's announcement is monumental news for the state of Ohio," said Ohio Gov. Mike DeWine. "Intel's new facilities will be transformative for our state, creating thousands of good-paying jobs in Ohio manufacturing strategically vital semiconductors, often called 'chips.' Advanced manufacturing, research and development, and talent are part of Ohio's DNA, and we are proud that chips – which power the future – will be made in Ohio, by Ohioans."
"Today's investment marks another significant way Intel is leading the effort to restore U.S. semiconductor manufacturing leadership," said Pat Gelsinger, CEO of Intel. "Intel's actions will help build a more resilient supply chain and ensure reliable access to advanced semiconductors for years to come. Intel is bringing leading capability and capacity back to the United States to strengthen the global semiconductor industry. These factories will create a new epicenter for advanced chipmaking in the U.S. that will bolster Intel's domestic lab-to-fab pipeline and strengthen Ohio's leadership in research and high tech."
As the largest single private-sector investment in Ohio history, the initial phase of the project is expected to create 3,000 Intel jobs and 7,000 construction jobs over the course of the build, and to support tens of thousands of additional local long-term jobs across a broad ecosystem of suppliers and partners. Spanning nearly 1,000 acres in Licking County, just outside of Columbus, the "mega-site" can accommodate a total of eight chip factories – also known as "fabs" – as well as support operations and ecosystem partners. At full buildout, the total investment in the site could grow to as much as $100 billion over the next decade, making it one of the largest semiconductor manufacturing sites in the world.
Planning for the first two factories will start immediately, with construction expected to begin late in 2022. Production is expected to come online in 2025, when the fab will deliver chips using the industry's most advanced transistor technologies. Ohio will be home to Intel's first new manufacturing site location in 40 years.
In addition to Intel's presence in Ohio, the investment is expected to attract dozens of ecosystem partners and suppliers needed to provide local support for Intel's operations – from semiconductor equipment and materials suppliers to a range of service providers. Investments made by these suppliers will not only benefit Ohio but will have a significant economic impact on the broader U.S. semiconductor ecosystem. As part of today's announcement, Air Products, Applied Materials, LAM Research and Ultra Clean Technology have indicated plans to establish a physical presence in the region to support the buildout of the site, with more companies expected in the future. (See accompanying quote sheet for more details.)
"The impact of this mega-site investment will be profound," said Keyvan Esfarjani, Intel senior vice president of Manufacturing, Supply Chain and Operations. "A semiconductor factory is not like other factories. Building this semiconductor mega-site is akin to building a small city, which brings forth a vibrant community of supporting services and suppliers. Ohio is an ideal location for Intel's U.S. expansion because of its access to top talent, robust existing infrastructure, and long history as a manufacturing powerhouse. The scope and pace of Intel's expansion in Ohio, however, will depend heavily on funding from the CHIPS Act."
To help develop and attract a pipeline of skilled talent from within the region, Intel plans to invest approximately $100 million over the next decade in partnership with Ohio universities, community colleges and the U.S. National Science Foundation. These partnerships will span a range of activities, from collaborative research projects to building semiconductor-specific curricula for associate and undergraduate degree programs.
"Semiconductors make almost every facet of modern life possible – from computers and smart phones to cars and appliances – and they played an integral role in the technologies that enabled us to stay connected throughout the pandemic," said Kristina M. Johnson, president of The Ohio State University. "They will also be integral to a wide range of applications in which Ohio State is actively involved from a research perspective, including artificial intelligence, quantum computing, vaccine development and more. So, it's a natural fit for Ohio State, along with our fellow institutions of higher education, to partner on this game-changing investment in semiconductor manufacturing. Today's announcement is significant for Ohio, for Intel and for the national interest, as we are still in the midst of a global chip shortage. But it also presents a remarkable opportunity for current and future students. It will cement Ohio as a top magnet for retaining and attracting a new generation of talent and build on numerous opportunities under development within our state's colleges and universities, including at Ohio's innovation districts, which are already taking shape in partnership with JobsOhio."
Intel has a long history of corporate responsibility at its current U.S. manufacturing sites and is committed to building strong relationships with the community in Licking County and beyond. Intel has a long-standing commitment to sustainability and continually strives to minimize its impact on the environment. The new site will be designed and constructed with green building principles, and the new factories have a goal to be powered by 100% renewable electricity and to achieve net positive water use and zero total waste to landfill in support of Intel's 2030 sustainability goals.
Intel Foundry Services Momentum
In addition to providing capacity for Intel's leading-edge products, these new factories will support growing demand for the company's new foundry business, Intel Foundry Services (IFS).
"With IFS, Intel is opening its factory doors wide to serve the needs of foundry customers around the globe – many of whom are looking for more geographical balance in the semiconductor supply chain," said Dr. Randhir Thakur, senior vice president and president of Intel Foundry Services. "The Ohio factories are designed for the 'Angstrom era,' with support for Intel's most advanced process technologies, including Intel 18A. These technologies are critical for enabling next-generation foundry customer products across a range of applications, from high-performance mobile to artificial intelligence."
The Ohio site will also provide leading-edge process technology to support the U.S. government's unique security and infrastructure needs.
Sharkoon Technologies, an international supplier of high-quality, high-performance PC components and peripherals, now introduces the SKILLER SGH50. This is a high-performance gaming headset with Hi-Res Audio certification and carefully balanced audio drivers for immersive gaming and intense music enjoyment. To fit the head, the ear cups and headband adjust automatically and, together with their soft synthetic leather cushioning, should ensure lasting comfort.
According to the manufacturer, the audio drivers of the SKILLER SGH50 were continuously optimized during an ongoing process in order to achieve an expressive and crystal-clear sound. In addition, the SKILLER SGH50 has Hi-Res Audio certification as well as a certified frequency range from 10 hertz to 40 kilohertz. In games, opponents can be acoustically located, and explosions can be powerfully reproduced. When listening to music, the sounds of treble, mid and bass are harmoniously balanced so that no details are lost.
Clear and Understandable
The microphone of the SKILLER SGH50 can be detached if necessary, and it is equipped with a pop filter which should effectively filter plosive sounds, enabling clear communication in video conferences and voice chats.
Fits Any Head
According to the manufacturer, particular emphasis has been placed on comfortable wearing. The ear cups, which are padded with supple synthetic leather, and the headband automatically adapt to the shape of the head. The SKILLER SGH50 should therefore be comfortable to wear even after hours of use.
Durable and Modular
According to the manufacturer, the cables are particularly robust and durable, thanks to their TPE sheathing. The modular configuration of the cables allows easy connection to all devices with audio ports. Also, the inline controller can be used to accessibly mute the microphone and adjust the volume.
Intel Ireland last week chalked up a milestone in its $7 billion Fab 34 construction project: A team rolled in the new plant's first huge chipmaking tool. The machine, a lithography resist track, arrived by truck at Intel's Leixlip, Ireland, plant after a flight across the Atlantic Ocean from an Intel Oregon plant.
Ireland's new lithography tool runs in conjunction with an extreme ultraviolet (EUV) scanner, a crown jewel in Intel's manufacturing capability. The new tool provides precision coating of silicon wafers before alignment and exposure inside the EUV scanner. The wafer then returns to the lithography tool for a series of precision oven bakes, photo development and rinsing.
A typical Intel fab contains about 1,200 advanced tools, many of them costing millions of dollars apiece.
Work on Fab 34 started in 2019, with the facility set to go online in 2023. The factory will double Intel Ireland's manufacturing space and pave the way for production of the Intel 4 process technology.
Intel's expansion in Ireland is part of the company's global factory build-out to meet burgeoning worldwide chip demand. Intel has tens of billions of dollars of new manufacturing infrastructure in the works in Arizona, New Mexico, Oregon and Malaysia. The company has also said it will soon announce additional plant sites in the U.S. and Europe. Intel's current manufacturing investments are the largest in the company's 54-year history.
There are no further details yet so we can only speculate whether this will be an actual product that will be sold or little more than an interesting research project.
Intel, one of the world's largest chip makers, is likely to unveil a specialized crypto-mining chip at the International Solid-State Circuits Conference (ISSCC) in February, according to the conference's agenda. -- Coindesk
Sharkoon Technologies is an international supplier of high-performance quality PC components and peripherals. Now, with the TG7M RGB, Sharkoon is introducing a PC case that should match up to cases of a higher class. In addition to an air-permeable mesh front panel, the case has four pre-installed 120-millimeter RGB PWM fans. As the first case in the series, a 360-millimeter radiator can be installed not only behind the front panel of the TG7M RGB, but also under the top panel. Graphics cards can be installed vertically in the case using a separately available kit. In addition to two USB 3.0 ports, the I/O panel also has a USB-C 3.2 Gen 2 port.
Built for Convincing Cooling Results
According to the manufacturer, the TG7M RGB is especially designed for efficient cooling: In addition to a mesh grille on the front panel, four 120-millimeter PWM RGB fans have been pre-installed in the case: three at the front and one at the rear of the case. Three fans with an edge-to-edge length of 120 millimeters can also be installed under the top panel. The TG7M RGB is the first case of the TG series where a 360-millimeter radiator can be installed either behind the front panel or under the top panel. Depending on the installed hardware, the size of the mainboard and the height of the RAM, there is at least 5 centimeters of space available under the top panel. Behind the front panel there is space for a radiator with a height of up to 6 centimeters.
Tidy Presentation of Hardware
Like the previous models of the series, the TG7M RGB has a side panel made of tempered glass on the left. To ensure a tidy presentation of the built-in components, the screws of the panel are not directly visible from the outside. The front panel is framed on its left and right by a light-grey metal wing which rounds off the sharp edges of the casing. The cable management inside the case with several cable pass-throughs should ensure an unobstructed view of the installed hardware. By means of an RGB control on the mainboard with a pinout of 5V-D-G or 5V-D-coded-G, the illumination can be personalized as desired. Behind the tempered-glass side panel there is also a power supply tunnel with a window for the constant view of the power supply unit.
Despite its compact design, the TG7M RGB has plenty of space, even for large hardware components. For example, a graphics card 38 centimeters long can also be installed vertically using an optionally available graphics card kit. Power supply units with a length of up to 22 centimeters can be installed in the power supply tunnel on the underside of the case. The case also has space for up to four 2.5-inch and two 3.5-inch data storage drives.
For ARCTIC, it has always been a top priority to supply customers only with products of the best quality and durability. Should there ever be any doubts about products we’ve delivered, we stand by our responsibility to our customers.
Current findings from our permanent quality assurance tests show that certain batches of our MX-5 thermal compound contain anomalies in consistency and shelf life. The affected products show an increased separation of oil within the paste, resulting in premature hardening. This can lead to adverse effects and application difficulties.
Affected batches have already been identified and recalled from circulation so that no further affected product can enter the market. We regret that this quality defect could not be detected before delivery to distributors and customers, despite constant quality controls and diligent care during production.
Affected MX-5 thermal compounds can of course be returned without exception, and we will offer a replacement product. For this purpose, we ask you to contact us and provide proof of purchase via the form support.arctic.de/de/menu/support.
Activision Blizzard is currently plagued by a number of scandals, including claims of workplace misconduct, but is behind some of the largest video game franchises. If the deal succeeds, Microsoft will add Call of Duty, Warcraft, Diablo, Overwatch, StarCraft, Candy Crush, and countless others to its portfolio. Microsoft Gaming instantly becomes the third largest video game company, behind Tencent and Sony.
With three billion people actively playing games today, and fueled by a new generation steeped in the joys of interactive entertainment, gaming is now the largest and fastest-growing form of entertainment. Today, Microsoft Corp. (Nasdaq: MSFT) announced plans to acquire Activision Blizzard Inc. (Nasdaq: ATVI), a leader in game development and interactive entertainment content publisher. This acquisition will accelerate the growth in Microsoft’s gaming business across mobile, PC, console and cloud and will provide building blocks for the metaverse.
Microsoft will acquire Activision Blizzard for $95.00 per share, in an all-cash transaction valued at $68.7 billion, inclusive of Activision Blizzard’s net cash. When the transaction closes, Microsoft will become the world’s third-largest gaming company by revenue, behind Tencent and Sony. The planned acquisition includes iconic franchises from the Activision, Blizzard and King studios like “Warcraft,” “Diablo,” “Overwatch,” “Call of Duty” and “Candy Crush,” in addition to global eSports activities through Major League Gaming. The company has studios around the world with nearly 10,000 employees.
Bobby Kotick will continue to serve as CEO of Activision Blizzard, and he and his team will maintain their focus on driving efforts to further strengthen the company’s culture and accelerate business growth. Once the deal closes, the Activision Blizzard business will report to Phil Spencer, CEO, Microsoft Gaming.
“Gaming is the most dynamic and exciting category in entertainment across all platforms today and will play a key role in the development of metaverse platforms,” said Satya Nadella, chairman and CEO, Microsoft. “We’re investing deeply in world-class content, community and the cloud to usher in a new era of gaming that puts players and creators first and makes gaming safe, inclusive and accessible to all.”
“Players everywhere love Activision Blizzard games, and we believe the creative teams have their best work in front of them,” said Phil Spencer, CEO, Microsoft Gaming. “Together we will build a future where people can play the games they want, virtually anywhere they want.”
“For more than 30 years our incredibly talented teams have created some of the most successful games,” said Bobby Kotick, CEO, Activision Blizzard. “The combination of Activision Blizzard’s world-class talent and extraordinary franchises with Microsoft’s technology, distribution, access to talent, ambitious vision and shared commitment to gaming and inclusion will help ensure our continued success in an increasingly competitive industry.”
Mobile is the largest segment in gaming, with nearly 95% of all players globally enjoying games on mobile. Through great teams and great technology, Microsoft and Activision Blizzard will empower players to enjoy the most-immersive franchises, like “Halo” and “Warcraft,” virtually anywhere they want. And with games like “Candy Crush,” Activision Blizzard´s mobile business represents a significant presence and opportunity for Microsoft in this fast-growing segment.
The acquisition also bolsters Microsoft’s Game Pass portfolio with plans to launch Activision Blizzard games into Game Pass, which has reached a new milestone of over 25 million subscribers. With Activision Blizzard’s nearly 400 million monthly active players in 190 countries and three billion-dollar franchises, this acquisition will make Game Pass one of the most compelling and diverse lineups of gaming content in the industry. Upon close, Microsoft will have 30 internal game development studios, along with additional publishing and esports production capabilities.
The transaction is subject to customary closing conditions and completion of regulatory review and Activision Blizzard’s shareholder approval. The deal is expected to close in fiscal year 2023 and will be accretive to non-GAAP earnings per share upon close. The transaction has been approved by the boards of directors of both Microsoft and Activision Blizzard.
The site Intel intends to build on appears to be 3,190 acres that have recently been annexed from Jersey Township in western Licking County to the Columbus suburb of New Albany.
The area is bounded by the Franklin-Licking County line, Green Chapel Road, Mink Street and Jug Street.
The land would become part of the burgeoning New Albany International Business Park, where tech giants Google, Amazon and Facebook have data centers.
The RTX 3090 Ti will pack 24GB of GDDR6X running at 21 Gbit/s, the fastest memory ever. The GPU will crank out 40 teraflops for shaders, 78 teraflops for ray tracing and a whopping 320 teraflops of AI muscle. More details will be coming later this month.
New laptop cards tooFurthermore, NVIDIA released the GeForce RTX 3080 Ti and RTX 3070 Ti mobile video cards:
NVIDIA’s launch of the GeForce RTX 3080 Ti laptop GPU brings the flagship 80 Ti class of GPUs to laptops for the first time. Featuring 16GB of the fastest GDDR6 memory ever shipped in a laptop, the RTX 3080 Ti delivers higher performance than the desktop NVIDIA TITAN RTX™. RTX 3080 Ti laptops start at $2,499.
The new GeForce RTX 3070 Ti is up to 70 percent faster than RTX 2070 SUPER laptops and can deliver 100 frames per second at 1440p resolution. RTX 3070 Ti laptops start at $1,499.
Laptops powered by both of these new GPUs will be available starting on Feb. 1.
NVIDIA also introduced the fourth generation of Max-Q technologies, which have revolutionized laptop performance since their introduction four years ago. These features include CPU Optimizer, Rapid Core Scaling and Battery Boost 2.0, which further enhance efficiency, performance and battery life.
NVIDIA further expanded its family of NVIDIA Ampere architecture-based GPUs with the GeForce RTX 3050.
Bringing the performance and efficiency of the architecture to more gamers than ever, the RTX 3050 is the first 50-class desktop GPU to power the latest ray-traced games at over 60 frames per second. RTX 3050 makes ray tracing, which is the new standard in gaming, more accessible than ever before.
With 75 percent of gamers still playing on GTX GPUs, the 3050, which also includes second-generation RT cores as well as third generation Tensor cores for DLSS and AI, represents a compelling upgrade opportunity to step up to RTX.
The RTX 3050, which comes with 8GB of GDDR6 memory, starts at just $249 and will be available on Jan. 27 from NVIDIA’s worldwide partners.
Furthermore, AMD also teases the Radeon RX 6000M Series and Radeon RX 6000S for the laptop market. Systems based on these mobile GPUs are anticipated in Q1 2022.
AMD Radeon RX 6500 XT and Radeon RX 6400 Graphics Cards The AMD Radeon RX 6500 XT graphics card delivers up to 35 percent faster gaming performance on average in 1080p resolution with high settings compared to the competitive offering, while the AMD Radeon RX 6400 graphics card is designed to offer incredible 1080p gaming in OEM systems. Built using 6nm process technology for exceptional performance and power efficiency, the AMD Radeon RX 6500 XT and Radeon RX 6400 graphics cards bring incredible gameplay and advanced AMD Radeon features to legions of new and existing PC gamers.
AMD Radeon RX 6000M Series and Radeon RX 6000S Series Mobile Graphics The new AMD Radeon mobile graphics lineup is designed for high-performance gaming on the go. At the top of the AMD Radeon RX 6000M Series product stack is the new AMD Radeon RX 6850M XT GPU, delivering epic 1440p gaming performance for next-gen premium laptops. The fastest AMD GPU for extreme gaming laptops, it offers 7 percent faster gaming performance on average than the previous top-of-the-line AMD Radeon RX 6800M mobile GPU.
AMD Radeon RX 6000S Series mobile graphics offer an ideal blend of performance and efficiency for slim form factors, enabling gaming laptop designs that can weigh less than 4.5 lbs. and can be up to 20 percent thinner than existing devices. The high-end AMD Radeon RX 6800S GPU at 100W is projected to offer the ultimate in thin-and-light 1080p gaming by delivering up to 100 FPS in select titles with max settings, and is projected to offer 10 percent higher performance on average across select titles at 1080p than the competition.
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