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Latest news on DV Hardware - Older stories
Intel Core i7 7740K (KBL-X) CPU rears its head in SiSoft Sandra March 25, 2017 - 22:50
AMD Ryzen CPU with 12 cores and 24 threads spotted March 25, 2017 - 21:51
AMD Radeon RX Vega coming with 4GB and 8GB HBM2 March 25, 2017 - 11:48
Are these AMD X390 and X399 chipset diagrams? March 24, 2017 - 22:01
Semiconductors to stop shrinking in 2024, chips to go 3D March 24, 2017 - 18:57
Dell 31.5-inch 8K LCD display offers 7680 x 4320 for $4,999.99 March 24, 2017 - 13:58
Intel combines AI efforts in new Artificial Intelligence Products Group March 24, 2017 - 13:49
TSMC to start pilot production at its new 300mm Nanjing plant in 1H 2018 March 24, 2017 - 13:41
AMD reportedly has Ryzen HEDT 16-core engineering sample at 3.1GHz/3.6GHz March 24, 2017 - 13:31
Corsair debuts ONE gaming PC March 23, 2017 - 18:54
Wikileaks: CIA made UEFI spyware for Apple Mac and infected iPhone supply chain March 23, 2017 - 15:02
Motherboard makers suffering from low demand March 23, 2017 - 14:16
Oops.. some shops are already selling AMD Ryzen 5 CPUs March 23, 2017 - 13:35
GeForce GTX 1080 Ti gets pushed over 3GHz mark using LN2 March 23, 2017 - 13:24
3DMark API Overhead feature test adds Vulkan support March 23, 2017 - 13:13
EVGA reveals clockspeeds of its custom GTX 1080 Ti cards March 23, 2017 - 13:06
CeBIT 2018 moves to the mid-June timeframe to become summer tech festival March 23, 2017 - 12:45
EK Waterblocks shows rotary terminals for GPU waterblocks March 22, 2017 - 15:30
Samsung ahead of TSMC in 10nm race? March 22, 2017 - 15:24
DoubleAgent zero-day flaw exploits anti-virus tools to inject malware March 22, 2017 - 15:11

The Mailbox - reviews and news from other tech sites
Mass Effect Andromeda Performance Analysis March 25, 2017 - 17:01
AZIO MK MAC Mechanical Keyboard March 25, 2017 - 10:10
Cougar Panzer Max March 24, 2017 - 21:45
Ballistix Sport LT 16GB Red DDR4 2666MHz Memory Kit March 24, 2017 - 21:41
Thermal Image Testing on AMD X370 Motherboards by ASUS, Gigabyte and MSI March 24, 2017 - 18:50
Dell XPS 15 (9560): More Performance, Same Killer Good Looks March 24, 2017 - 16:23
How to make a 3D scanner from an Xbox 360 Kinect? March 24, 2017 - 15:04
Toshiba OCZ VX500 March 24, 2017 - 12:37
NZXT Kraken X42 Liquid CPU Cooler March 24, 2017 - 11:35
NVIDIA GeForce GTX 1080Ti Founders Edition Video Card March 24, 2017 - 11:35
Razer DeathAdder Elite Mouse March 24, 2017 - 11:35
AMD Ryzen - Single-Rank Versus Dual-Rank DDR4 Memory Performance March 23, 2017 - 23:03
Corsair ONE Pro SFF Gaming PC March 23, 2017 - 15:03
Patriot LX Series 256GB MicroSD Card March 23, 2017 - 14:38
Rosewill EX-500 & EX-700 March 23, 2017 - 12:29
Cryorig H7 Air Cooler March 23, 2017 - 11:31
AMD Ryzen 7 1700X Processor March 23, 2017 - 10:27
Gamdias Hermes P1 RGB Mechanical Gaming Keyboard March 23, 2017 - 10:27
ASRock Fatal1ty Z270 Gaming-ITX/ac motherboard March 23, 2017 - 10:27
Swiftech MCP655-PWM Pump March 22, 2017 - 21:48

Posted on Saturday, March 25 2017 @ 22:50:39 CET by
Intel logo
SiSoft Sandra's benchmark database seems to be the place to be these days to find details about upcoming processors. Earlier today there was a leak about a 12-core Ryzen HEDT processor from AMD and VideoCardz also spotted some interesting details about the Intel Core i7-7740K. Most of the data matches an earlier leak from February.

The chip was benchmarked in the unreleased ASRock X299 Professional Gaming i7 motherboard, which uses the new X299 chipset to support Skylake-X and Kaby Lake-X. The board has a LGA2066 socket and the Core i7 7740K appears to be the very first Kaby Lake-X processor.

The benchmark listing reveals the CPU is a quad-core model with eight threads. It's clocked at 4.3GHz, it has a 4.5GHz Turbo, no IGP, and a 112W TDP. Memory support is reportedly limited to dual-channel as this appears to be a more budget class version of Intel's HEDT platform. Skylake-X will be where the flagships will end up, with six, eight and ten-core options, more PCIe lanes, and quad-channel DDR4 support.


It's not exactly sure when these chips will launch, last we heard they may not launch until Gamescom in August. VideoCardz compared the performance with some other chips, not sure how reliable the score of the 7740K is but it suggests multimedia performance comparable with the AMD Ryzen 7 1800X and CPU arithmetic performance comparable with the Ryzen 5 1600. Based on what we know today, it doesn't look too exciting and it's hard to see how much value this will add versus the 7700K.

Posted on Saturday, March 25 2017 @ 21:51:22 CET by
AMD logo
While AMD hasn't said anything yet in its official communication about a Ryzen HEDT platform, we've had several leaks this month that claim AMD is working on a 16-core multi-chip-module (MCM) CPU that consists of two Ryzen 7 dies.

According to these leaks, the upcoming HEDT platform from AMD will feature quad-channel DDR4 and more PCIe lanes than what's offered by the current Ryzen platform. It's meant to compete with the Intel HEDT lineup and will use a different socket than the regular Ryzen CPUs.

Now there's a new leak that suggests there's also a 12-core version with 24-threads. VideoCardz spotted a SiSoft Sandra benchmark listing that shows an AMD engineering sample that's identified as the 2D2701A9UC9F4_32/27_N (2N 6M 24T 2.7GHz, 12x 512kB L2, 8x 8MB L3).

The chip is a second-generation B-stepping engineering sample, it has a base frequency of 2.7GHz, a 3.2GHz Turbo, 12x 512KB L2 cache and 8x 8MB L3 cache. Also worth mentioning is the benchmark listing reveals the chip is housed in the Alienware Area-51 R3 gaming PC.

AMD 12C 24T Ryzen

Posted on Saturday, March 25 2017 @ 11:48:47 CET by
AMD logo
VideoCardz offers a bit of coverage of the recent AMD Tech Summit event. The site learned several things, including that Vega will have a smaller footprint that will make it more likely to get adopted in notebooks than AMD's Fiji design. AMD says Vega will allow OEMs to make thinner and lighter laptops capable of rendering the greatest AAA games and VR.

More interesting perhaps is the part that reveals the memory configuration of the Radeon RX Vega lineup. We can expect variants with 4GB or 8GB HBM2:
Herkelman explained that “Vega will use HBM2 that has different capacity stacks”. He then added: “you will see from our board partners different configurations, whether that’s 4 Gig or 8 Gig or those types of memory architectures that will allow you to drive different games and different resolutions based upon what capacity stack they end up using”. That sounds like AIBs will have the option to use single stacks or double stacks of HBM2 memory. So Vega might be available with one or two stacks and that, as you probably know, will affect memory bandwidth, because the more stacks the chip has access to, the higher the bandwidth. But we are yet to see if there will be 2GB HBM2 stacks so that the board partners could still offer 2 stacks with full bandwidth, but only 4GB memory.
AMD hinted at the event that Vega is "just around the corner" but didn't reveal a specific launch date. The company will reveal more Vega tech details as we get closer to launch.

Posted on Friday, March 24 2017 @ 22:01:58 CET by
Another quick post before we call it a night, a couple of diagrams are circulating around the web that claim to show the AMD X390 and X399 chipset diagrams. There's not a whole lot information, the info was discovered by a Reddit user and it's not clear if this is the real deal or a mockup created by sometime with too much free time.

The leak shows a X390-based motherboard layout from ASUS, an X390 block diagram and a X399 block diagram. The X390 diagram seems to show a "Ryzen 2700" processor while the X399 diagram shows a dual-socket with two Ryzen 4700 CPUs.
Two chipset block diagrams were also posted. The X399 chipset for dual-CPU motherboard and X390 for single-CPU motherboard. The first diagram could be a new workstation/server platform for Naples CPUs, as we can see it has ECC memory support. Meanwhile, X390 corresponds to earlier rumors about Ryzen HEDT, which is meant for 16-core 32-thread Ryzen processors. Also unlike X399, the X390 has PCI-E lanes connected directly to the chipset. So if those diagrams are real, then X390 chipset would support up to 44 PCI-Express lanes.
Full details and two more images can be seen at VideoCardz. As noted before, I would take this with a grain of salt.

AMD possible X390 leak

Posted on Friday, March 24 2017 @ 18:57:48 CET by
A couple of industry whitepapers reveal semiconductor scaling is expected to reach an end by about 2024. The International Roadmap for Devices and Systems (IRDS) predicts chip makers will be able to hit a node range of 4/3nm, beyond that point it will no longer be physically possible to shrink chips any further.
“Die cost reduction has been enabled so far by concurrent scaling of poly pitch, metal pitch, and cell height scaling. This [will likely] continue until 2024,” according to one of nine white papers published today as part of the International Roadmap for Devices and Systems (IRDS).

Beyond that date “there is no room for contact placement as well as worsening performance as a result of contacted poly pitch (CPP) scaling. It is projected that physical channel length would saturate around 12nm due to worsening electrostatics while CPP would saturate at 24nm to reserve sufficient CD (~11nm) for the device contact providing acceptable parasitics,” the white paper reported.
The report predicts FinFETs will reach their limits a couple of years from now, and suggests the transition to gate-all-around (GAA) transistors could start in 2019, as well as a transition to vertical nanowires. After this, it will be necessary to pursue 3D stacking and monolithic 3D designs to be able to continue to make progress in terms of performance, energy efficiency and cost. Full details can be read at EE Times, they also discuss some of the new materials that are likely to get adopted.

More Moore

Posted on Friday, March 24 2017 @ 13:58:58 CET by
Dell added the UltraSharp 32 8K to its lineup, this new flagship display features a 31.5" IPS panel with a resolution of 7680 x 4320 pixels! This means this LED-backlit 8K 60Hz panel has 280 pixels per inch (PPI), other specifications include 6ms gray-to-gray response time, 400 nits brightness, 1300:1 contrast ratio and 178° vertical and horizontal viewing angles.

The screen has two DisplayPort 1.4 inputs and features a four-port USB 3.0 hub. As usual, the stand is adjustable in height and has tilt, swivel and pivot functionality. Typical power consumption is rated at 87W, with maximum power consumption of 125W.

You can buy the screen today via the Dell website for $4,999.99!

INTC logo

Posted on Friday, March 24 2017 @ 13:49:59 CET by
INTC logo
Intel announced it has formed a new Artificial Intelligence Products Group to house all its artificial intelligence projects. The new business unit will be headed by Naveen Rao, the co-founder of Nervana, the AI company that Intel bought last year. The chip giant is also creating an applied AI research lab to explore new architectural and algorithmic approaches for future generations of AI.
Artificial Intelligence (AI) is changing the world around us and will bring new capabilities to everything from smart factories to drones to sports to health care and to driverless cars. Data is the common thread across all these applications, and our strategy is to make Intel the driving force of the data revolution across every industry.

As a data company, it is imperative that we deliver solutions that create, use and analyze the massive amounts of data that are generated each and every minute. Data inference, or finding useful structure in data, may indeed be the largest computational problem of our time. That is why AI is so important to Intel. It is also why we are announcing that Intel is aligning its AI efforts under me, in a single cross-Intel organization: the Artificial Intelligence Products Group (AIPG).

Just as Intel has done in previous waves of computational trends, such as personal and cloud computing, Intel intends to rally the industry around a set of standards for AI that ultimately brings down costs and makes AI more accessible to more people – not only institutions, governments and large companies, as it is today.

This organization is about aligning our focus. The new organization will align resources from across the company to include engineering, labs, software and more as we build on our current leading AI portfolio: the Intel Nervana platform, a full-stack of hardware and software AI offerings that our customers are looking for from us.

In addition, we will be creating an applied AI research lab dedicated to pushing the forefronts of computing. We will be exploring novel architectural and algorithmic approaches to inform future generations of AI. This includes a range of solutions from the data center to edge devices, and from training to inference – all designed to enable Intel and its customers to innovate faster. This will be the home for AI innovation at Intel.

I am personally very energized about the opportunities before us as an industry. As CEO of Nervana, an AI company that Intel acquired last year, I saw what could be done. Now, after six months here, I see how the world can change when a company like Intel focuses on an effort. I believe this new organization will have a huge impact, not only for Intel, but upon the entire evolving AI space.

We look forward to creating the future together.

Naveen Rao is vice president and general manager of the Artificial Intelligence Products Group at Intel Corporation.


Posted on Friday, March 24 2017 @ 13:41:20 CET by
TSMC logo
TSMC revealed it plans to move in equipment at its new Nanjing-based plant in the second half of 2017. This is the Taiwanese foundry's first chip plant in mainland China, TSMC plans to initiate pilot production in the first half of 2018 and intends to kick off mass production in 2H 2018.

The Nanjing fab will manufacture 16nm chips and has a production target of 20,000 wafers a month.

In related news, TSMC confirmed its 10nm node has moved to volume production and that it's going to tape-out the first 7nm chips for its customers in the second half of 2017.

TSMC plans to adopt extreme ultraviolet (EUV) lithography for an enhanced version of its 7nm node and will fully implement it to make 5nm chips. The foundry says it has ASML's new NXE:3350B in operation and that the machine was capable of processing 1,500 wafers a day for three consecutive days.

EUV has been delayed for many years, there are still some hurdles to clear so it will be interesting to see if the major foundries will be able to switch to this new generation lithography technique in the coming years. This time there's not really an alternative as traditional lithography is reaching its limits.

Posted on Friday, March 24 2017 @ 13:31:54 CET by
AMD logo
A couple of days ago there was a rumor about an upcoming Ryzen HEDT platform from AMD, which would be a competitor for Intel's flagship processors. According to the rumor, this new platform will require a new motherboard because it uses a different socket and needs the AMD "X399" chipset. The platform reportedly offers more cores, quad-channel DDR4 support and more PCIe lanes than the current Ryzen lineup. The previous rumors indicated this is basically a multi-chip package with two Ryzen 7 dies.

Now French tech magazine Canard PC Hardware reports second-generation B1 engineering samples of the Ryzen HEDT CPU are circulating among AMD partners. The tweet below talks about a 16-core, 32-threaded part that features a 3.1GHz base clock and 3.6GHz Turbo. The TDP is 180W and effective maximum power consumption may even be higher. The site stresses this is not yet the qualification sample, so this isn't the final stepping.


Posted on Thursday, March 23 2017 @ 18:54:39 CET by
One last post for today. Corsair just officially introduced the ONE, a new gaming PC packed with the company's products including RAM, SSD, PSU and custom GPU and CPU liquid cooling. Corsair designed a special compact case that measures 380mm x 176mm x 200mm (H x W x D) and promises the system has a noise level of less than 20dBA.

You can find the features and specifications at Corsair. Pricing starts at $1,799.99 for a Windows 10 system with the Intel Core i7 7700K, GeForce GTX 1070, 16GB DDR4-2400, 240GB SSD, 1TB HDD, Z270-based Mini-ITX motherboard and a 80Plus Gold SFX form factor PSU.


Intel Kaby Lake or AMD Ryzen?

Kaby Lake


Votes 104

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