JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-5B, Low Power Double Data Rate 5 (LPDDR5). JESD209-5B includes both an update to the LPDDR5 standard that is focused on improving performance, power and flexibility, and a new LPDDR5X standard, which is an optional extension to LPDDR5.
Taken together, LPDDR5 and LPDDR5X are designed to significantly boost memory speed and efficiency for a variety of uses including mobile devices, such as 5G smartphones and artificial intelligence (AI) applications. Developed by JEDEC’s JC-42.6 Subcommittee for Low Power Memories, JESD209-5B is available for download from the JEDEC website.
Key updates to this latest version of LPDDR5 include:
The new LPDDR5X component of JESD209-5B is an optional extension intended to offer higher bandwidth and simplified architecture in support of enhanced 5G communication performance, and is designed for applications ranging from automotive to high resolution augmented reality/virtual reality and edge computing using AI.
- Speed extension up to 8533 Mbps (versus up to 6400 Mbps in the previous revision)
- Signal Integrity improvements with TX/RX equalization
- Reliability improvements via the new Adaptive Refresh Management feature
“As one of the fastest memories in recent memory to move from concept to industry standard, LPDDR5x is not only a turbo-charged pacesetter for the smartphone marketplace,” according to Mian Quddus, JEDEC’s Chairman of the Board of Directors, “but a power-conserving solution that will set the bandwidth bar considerably higher in taking 5G into a wider consumer embrace worldwide.”
2nm iPhone chips in 2024Hexus writes construction of the new factory is expected to start in early 2022. Production equipment will be installed in 2023, paving the way for initial test production later in 2023. The facility will be the most advanced in the world. One of the initial clients will be Apple, which will use 2nm SoCs for a 2024 iPhone release.
Earlier this year, there were worries about Taiwan's water supply. The new factory is expected to account for roughly 50 percent of TSMC's total daily water consumption of 2020. TSMC aims to significantly increase water recycling efforts to address environmental (and logistics) concerns:
Earlier this year, there was a great deal of worry due to an unusual prolonged dry spell, which meant TSMC's central and southern Taiwan facilities started to organise tankers to provide water supplies. However, the 'plum rain' season eventually made its appearance, and reservoirs now seem to be amply filled.
TSMC's new plant is expected to be rather water hungry, requiring about 98,000 tons of water a day, which is "roughly 50 per cent of TSMC's total daily water consumption in 2020," according to Nikkei Asia. With this in mind, the chipmaker has plans to use 10 per cent recycled water by 2025, moving up to an ambitious 100 per cent reused water at Baoshan by 2030.
The air cooled model adopts a gold/silver color scheme and looks a bit similar to the NITRO edition. We have no further information about the specifications nor the pricing. Presumably, the card will be released very soon.
Our engineering teams are aggressively driving our product and technology roadmaps to continue setting the pace of innovation for high-performance computing. We remain on track to launch next generation products in 2022, including our Zen 4 processors built with industry-leading 5 nanometer process technology and our RDNA 3 GPUs.Based on recent rumors, AMD's consumer processor lineup will likely get a refresh later this year. Earlier this year, AMD revealed the 3D V-Cache technology, which promises to provide a nice performance boost for certain workloads like gaming. The Zen 4-based "Raphael" desktop processors aren't expected until the second half of 2022.
On a related note, AMD also revealed it started shipments of its CDNA2-based Instinct MI200 accelerators. Based on the Aldebaran GPU, this is the first multi-chip-module (MCM) GPU from AMD to hit the market. This approach will also be used by the RDNA3-based consumer GPUs. Just like the Zen 4-based Ryzen 7000 series, the RDNA3-based video cards are expected in the second half of 2022.
At the moment, AMD is mostly constrainted by supply. AMD expects extra supply will hit the market each quarter and that things will get a lot better in 2022.
Unclear why mainstream Alder Lake is delayedIt's unknown why the non-K series Alder Lake processors are delayed. Alder Lake is a new processor architecture with a hybrid design. It will combine up to eight high-performance with eight high-efficiency cores. It requires a motherboard with LGA1700 socket and supports both PCI Express 5.0 and DDR5.
Motherboard makers reject ATX12VO and stick with 24-pin connectorAlder Lake will be manufactured on "Intel 7", the new name of Intel's 10nm Enhanced SuperFin. Igor also reports that motherboard makers will continue to sell Z690 motherboards with 24-pin connectors. Intel tried to push its new ATX12VO but motherboard makers wanted none of this. The advantage of ATX12VO is that it's more efficient and makes cable management easier. The downside is that it requires a new power supply and makes motherboards a bit more expensive.
Support ForYou can download it over here.
Added Vulkan® Support
VK_KHR_copy_commands2: This extension introduces extensible versions of the Vulkan® buffer and image copy commands that can now accept extension-specific information via their copy parameters. VK_EXT_extended_dynamic_state2: This extension allows more states to be set dynamically to reduce the number of unique pipeline state objects used by an application.
Game Compatibility advisor in AMD Radeon™ Software may incorrectly advise some users their CPU and/or GPU do not meet the minimum requirements to play some games. If some users are still experiencing this issue, reinstall or upgrade your driver and perform a factory reset. Learn more from AMD here on performing a factory reset. If a Blue or Black screen is observed in mobile systems, temporarily disable Enhanced sign-in. Resident Evil Village™ may experience an intermittent application hang or TDR on AMD Radeon™ VII graphics products in the first mission of the game. A Blue or Black screen may be observed after updating to the latest Radeon™ Software when core isolation is enabled.
For the current quarter, AMD expects revenue of $4.1 billion, plus or minus $100 million. That's quite a bit higher than analyst estimates of $3.8 billion. Furthermore, AMD is more optimistic about its full-year growth. The chip designer anticipates sales will rise 60 percent in 2021, up from prior guidance of 50 percent.
Computing and Graphics revenue was up 65 percent year-over-year and 7 percent quarter-over-quarter. Enterprise, Embedded and Semi-Custom skyrocketed 183 percent year-over-year and rose 19 percent versus the previous quarter. Sadly, AMD is still not providing a lot of granularity here. It would be interesting to see a breakdown of the GPU, client CPU, datacenter CPU, embedded, and semi-custom revenue.
AMD's shares are up 1.78 percent to $92.65 in pre-market trading.
AMD (NASDAQ:AMD) today announced revenue for the second quarter of 2021 of $3.85 billion, operating income of $831 million, net income of $710 million and diluted earnings per share of $0.58. On a non-GAAP* basis, operating income was $924 million, net income was $778 million and diluted earnings per share was $0.63.
“Our business performed exceptionally well in the second quarter as revenue and operating margin doubled and profitability more than tripled year-over-year,” said AMD president and CEO Lisa Su. “We are growing significantly faster than the market with strong demand across all of our businesses. We now expect our 2021 annual revenue to grow by approximately 60 percent year-over-year driven by strong execution and increased customer preference for our leadership products.”
Q2 2021 Results
Revenue was $3.85 billion, up 99 percent year-over-year and 12 percent quarter-over-quarter driven by higher revenue in both the Computing and Graphics segment and Enterprise and Embedded and Semi-custom segment.
Gross margin was 48 percent, up 4 percentage points year-over-year and 2 percentage points quarter-over-quarter. The increases were driven by a richer mix of sales, including high-end Ryzen™, Radeon™ and EPYC™ processor sales.
Operating income was $831 million compared to operating income of $173 million a year ago and $662 million in the prior quarter. Non-GAAP operating income was $924 million compared to $233 million a year ago and $762 million in the prior quarter. Operating income improvements were primarily driven by higher revenue.
Net income was $710 million compared to $157 million a year ago and $555 million in the prior quarter. Non-GAAP net income was $778 million compared to $216 million a year ago and $642 million in the prior quarter.
Diluted earnings per share was $0.58 compared to $0.13 a year ago and $0.45 in the prior quarter. Non-GAAP diluted earnings per share was $0.63 compared to $0.18 a year ago and $0.52 in the prior quarter.
Cash, cash equivalents and short-term investments were $3.79 billion at the end of the quarter. Cash from operations was $952 million compared to $243 million a year ago and $898 million in the prior quarter. Free cash flow was a record $888 million compared to free cash flow of $152 million a year ago and $832 million in the prior quarter.
In May 2021, the Company announced a $4 billion share repurchase program. In the second quarter, the Company repurchased 3.2 million shares of common stock for $256 million.
Quarterly Financial Segment Summary
Computing and Graphics segment revenue was $2.25 billion, up 65 percent year-over-year and 7 percent quarter-over-quarter driven by higher client and graphics processor sales.
Client processor average selling price (ASP) grew year-over-year and quarter-over-quarter driven by a richer mix of Ryzen desktop and notebook processor sales.
GPU ASP grew year-over-year and quarter-over-quarter driven by high-end graphics product sales, including data center GPU sales.
Operating income was $526 million compared to $200 million a year ago and $485 million in the prior quarter. The increases were primarily driven by higher revenue.
Enterprise, Embedded and Semi-Custom segment revenue was $1.60 billion, up 183 percent year-over-year and 19 percent quarter-over-quarter. The increases were driven by higher EPYC processor revenue and semi-custom product sales.
Operating income was $398 million compared to $33 million a year ago and $277 million in the prior quarter. The increases were primarily driven by higher revenue.
All Other operating loss was $93 million compared to $60 million a year ago and $100 million in the prior quarter.
This new gaming display offers a screen size of 49" and has a 1000R curvature. It features a 32:9 aspect ratio and has a 5120 x 1440 pixels resolution. You get typical brightness of 420 nits, peak brightness of 2000 nits, and a static contrast ratio of 1,000,000:1. It has 1ms gray-to-gray response time, 178-degrees horizontal/vertical viewing angles, a 240Hz refresh rate.
The panel supports AMD FreeSync Premium Pro and is NVIDIA G-SYNC Compatible. Display inputs include Display Port 1.4 and HDMI 2.1. Of course, the screen has a stand with premium features like tilt and swivel, and it also has integrated RGB LED illumination with 52 colors and 5 light modes.
The Odyssey Neo G9 will hit the market on August 9 for 2199EUR.
Intel ON in San Francisco on October 27-28The chip giant is hosting its first Intel ON event on October 27-28, 2021. This will take place virtually and physically in San Francisco.
The first event in the new Intel ON series, Intel Innovation, will be taking place virtually and in-person, October 27-28, 2021. Our new technical conference will focus on the latest technologies to deliver AI, 5G, Edge, Cloud and PC solutions with speed and real-world scale.Intel CEO Pat Gelsinger called it a "fully hybrid" event. Presumably not only because it's digital and in-person, but also because it could be the launch even of Alder Lake. The latter is Intel's first mainstream processor with a hybrid design, it has high-performance and high-efficiency cores.
Alder Lake will be made using Intel's 7 node, which is the new name for 10nm Enhanced SuperFin. Compared with the 10nm node used for Tiger Lake, the Intel 7 node promises 10-15 percent higher performance per Watt.
Intel Meteor Lake is 5W to 125WBesides a rendered shot of the Alder Lake die, Intel also shared a picture of how Meteor Lake will look like. Meteor Lake uses Intel 4 (aka 7nm), this process technology is projected to offer a 20 percent higher performance per Watt when compared with Intel 7. Intel 4 will make full use of EUV.
Meteor Lake will use Intel's second-generation Foveros packaging technology for chip stacking. The processor will consist of three parts; a compute die, a GPU die, and an SoC. The GPU die will offer 96 to 192 execution units. For comparison, the current Tiger Lake processors from Intel have a maximum of 96 EUs. Intel also revealed Meteor Lake will come in 5W to 125W TDP variations.
Windows 11 minimum requirements to remain firmIn a recent AMA session on Windows 11 Upgrade Paths, Microsoft expert employees insisted that the Windows 11 minimum requirements won't be relaxed any time soon. Microsoft claims Windows 11 is all about security and notes users will not be able to cheat their way to a Windows 11 upgrade.
Microsoft Program Manager, Aria Carley, told the AMA webcast watchers that she knows "it sucks" that your capable but slightly out of date system isn't going to get offered the Windows 11 update. However, Carley explained that it will be for the greater good. The minimum requirements as they stand will "keep devices more productive, have a better experience, and better security than ever before so they can stay protected," she said.Odds are high someone will figure out a couple of hacks to force a Windows 11 upgrade, but this is not a smart idea for production environments and may cause issues down the road.
You won't be able to cheat the upgrade, particularly in organisations, added Carley. "Group policy will not enable you to get around the hardware enforcement for Windows 11," warned the Microsoft exec. "We're still going to block you from upgrading your device to an unsupported state since we really want to make sure that your devices stay supported and secure."
The cooler has a ceramics-based black coating and has a brushed aluminum top cover for enhanced aesthetics. be quiet! rates the cooling performance of the Dark Rock TF2 at 230W TDP.
Mounting tools are included for the AMD Socket AM4 / AM3(+) and Intel LGA1200 / 2066 / 1150 / 1151 / 1155 / 2011(-3). The design of the heatsink ensures you can use memory modules with a maximum height of 49mm.
be quiet! will ship it from August 10 for 85.90EUR.
Dark Rock TF 2 offers extreme cooling performance for the CPU and surrounding components as well as virtually inaudible operation.
Extremely high cooling performance with 230W TDP Two heat sinks with anti-vibration rubber inserts Six high-performance 6mm heat pipes Silent Wings 3 135mm with funnel shaped air-inlet and a Silent Wings 135mm for virtually inaudible operation of max. 27.1dB(A) Optimized mounting system makes for an easy installation Special black coating with ceramic particles enables perfect heat transfer Brushed aluminum top cover for elegant look Three-year manufacturer’s warranty Product conception, design and quality control in Germany
When 10nm+ becomes Intel 7 and 7nm turns into a 4Especially in recent history, the naming of process node technology has been very arbitrary. For example, at least on paper, Intel's 10nm process is largely comparable to TSMC's 7nm node. Intel is now shaking things up a bit by renaming its future nodes.
In a nutshell, the upcoming 10nm Enhanced SuperFin process, which will be used for Alder Lake, is rebadged to Intel 7. Similarly, the future Meteor Lake processors will not be made on 7nm but on "Intel 4" -- Intel's first process to fully adopt EUV. Intel 4-based products are expected in 2023.
Looking a bit further into the future, there will be an "Intel 3" node and after that we'll be talking about ångströms with "Intel 20A". The Intel 20A node will use RibbonFET and PowerVia. One interesting development here is that Qualcomm has already signed up as a client for Intel's 20A node via the Intel Foundry Services unit. Beyond 2025, we can expect "Intel 18A" and smaller.
Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.
“Building on Intel’s unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025,” Intel CEO Pat Gelsinger said during the global “Intel Accelerated” webcast. “We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore’s Law and our path to innovate with the magic of silicon.”
The industry has long recognized that traditional nanometer-based process node naming stopped matching the actual gate-length metric in 1997. Today, Intel introduced a new naming structure for its process nodes, creating a clear and consistent framework to give customers a more accurate view of process nodes across the industry. This clarity is more important than ever with the launch of Intel Foundry Services. “The innovations unveiled today will not only enable Intel’s product roadmap; they will also be critical for our foundry customers,” Gelsinger said. “The interest in IFS has been strong and I’m thrilled that today we announced our first two major customers. IFS is off to the races!”
Intel technologists described the following roadmap with the new node names and the innovations enabling each node:
Intel 7 delivers an approximately 10% to 15% performance-per-watt increase versus Intel 10nm SuperFin, based on FinFET transistor optimizations. Intel 7 will be featured in products such as Alder Lake for client in 2021 and Sapphire Rapids for the data center, which is expected to be in production in the first quarter of 2022.
Intel 4 fully embraces EUV lithography to print incredibly small features using ultra-short wavelength light. With an approximately 20% performance-per-watt increase, along with area improvements, Intel 4 will be ready for production in the second half of 2022 for products shipping in 2023, including Meteor Lake for client and Granite Rapids for the data center. Intel 3 leverages further FinFET optimizations and increased EUV to deliver an approximately 18% performance-per-watt increase over Intel 4, along with additional area improvements. Intel 3 will be ready to begin manufacturing products in the second half of 2023.
Intel 20A ushers in the angstrom era with two breakthrough technologies, RibbonFET and PowerVia. RibbonFET, Intel’s implementation of a gate-all-around transistor, will be the company’s first new transistor architecture since it pioneered FinFET in 2011. The technology delivers faster transistor switching speeds while achieving the same drive current as multiple fins in a smaller footprint. PowerVia is Intel’s unique industry-first implementation of backside power delivery, optimizing signal transmission by eliminating the need for power routing on the front side of the wafer. Intel 20A is expected to ramp in 2024. The company is also excited about the opportunity to partner with Qualcomm using its Intel 20A process technology.
2025 and Beyond: Beyond Intel 20A, Intel 18A is already in development for early 2025 with refinements to RibbonFET that will deliver another major jump in transistor performance. Intel is also working to define, build and deploy next-generation High NA EUV, and expects to receive the first production tool in the industry. Intel is partnering closely with ASML to assure the success of this industry breakthrough beyond the current generation of EUV.
“Intel has a long history of foundational process innovations that have propelled the industry forward by leaps and bounds,” said Dr. Ann Kelleher, senior vice president and general manager of Technology Development. “We led the transition to strained silicon at 90nm, to high-k metal gates at 45nm and to FinFET at 22nm. Intel 20A will be another watershed moment in process technology with two groundbreaking innovations: RibbonFET and PowerVia.”
With Intel’s new IDM 2.0 strategy, packaging is becoming even more important to realizing the benefits of Moore’s Law. Intel announced that AWS will be the first customer to use IFS packaging solutions, while also providing the following insights into the company’s industry-leading advanced packaging roadmap:
EMIB continues to lead the industry as the first 2.5D embedded bridge solution, with products shipping since 2017. Sapphire Rapids will be the first Intel® Xeon® data center product to ship in volume with EMIB (embedded multi-die interconnect bridge). It will also be the first dual-reticle-sized device in the industry, delivering nearly the same performance as a monolithic design. Beyond Sapphire Rapids, the next generation of EMIB will move from a 55-micron bump pitch to 45 microns.
Foveros leverages wafer-level packaging capabilities to provide a first-of-its-kind 3D stacking solution. Meteor Lake will be the second-generation implementation of Foveros in a client product and features a bump pitch of 36 microns, tiles spanning multiple technology nodes and a thermal design power range from 5 to 125W.
Foveros Omni ushers in the next generation of Foveros technology by providing unbounded flexibility with performance 3D stacking technology for die-to-die interconnect and modular designs. Foveros Omni allows die disaggregation, mixing multiple top die tiles with multiple base tiles across mixed fab nodes and is expected to be ready for volume manufacturing in 2023.
Foveros Direct moves to direct copper-to-copper bonding for low-resistance interconnects and blurs the boundary between where the wafer ends and where the package begins. Foveros Direct enables sub-10-micron bump pitches, providing an order of magnitude increase in the interconnect density for 3D stacking, opening new concepts for functional die partitioning that were previously unachievable. Foveros Direct is complementary to Foveros Omni and is also expected to be ready in 2023.
The breakthroughs discussed today were primarily developed at Intel’s facilities in Oregon and Arizona, cementing the company’s role as the only leading-edge player with both research and development and manufacturing in the U.S. Additionally, the innovations draw on close collaboration with an ecosystem of partners in both the U.S. and Europe. Deep partnerships are key to bringing foundational innovations from the lab to high-volume manufacturing, and Intel is committed to partnering with governments to strengthen supply chains and drive economic and national security.
The company closed its webcast by confirming more details on its Intel InnovatiON event. Intel InnovatiON will be held in San Francisco and online on Oct. 27-28, 2021. More information is available at the Intel ON website.
Ada Lovelace or Hopper?First up, there seems to be consensus that NVIDIA targets Q4 2022 as the launch date of its next-generation GPUs.
Twitter leaker Greymon55 claims the NVIDIA Lovelace GPU design is ready and that NVIDIA will use TSMC's 5nm process for this chip. However, he's unsure about whether it will be N5 or N5P. Either way, this means NVIDIA is going back to TSMC for its next generation. The current Ampere-based video cards are manufactured by Samsung. Historically, NVIDIA has typically used TSMC for its high-end products.
Famous NVIDIA leaker kopite7kimi, who correctly leaked the specifications of the entire Ampere GPU lineup months in advance, is no longer certain that NVIDIA will use its Lovelace design. Should AMD's multi-chip module (MCM) based RDNA3 series perform very high, NVIDIA could opt to use its Hopper design. At the moment, it's believed that the latter is only for the datacenter market.
Tech YouTuber Moore's Law Is Dead on the other hand points out that Lovelace may also be used in NVIDIA SoCs. He claims that even if RDNA3 beats Lovelace in terms of performance, NVIDIA will outship AMD by just having a lot more volume and cheap-to-make chips.
Basically, the rumors about NVIDIA's next-generation GPUs are still very confusing.
Launch on August 11The event will be a paperlaunch. Tech sites will reportedly be allowed to post unboxing videos on August 6 and the actual launch of the Radeon RX 6600 XT is said to be August 11.
AMD Radeon RX 6600 XT is a Navi 23 XT-based model with 32 Compute Units (2048 Stream Processors). This model will debut with 8GB GDDR6 memory with a 128-bit memory bus.
How much will it really cost?The pricing of the card remains a mystery. Neowin claims AMD will go for a MSRP of $349 for the Radeon RX 6600 XT and that the Radeon RX 6600 should end up at $299. The latter is expected to be launched at a later point.
French tech site Cowcotland on the other hand heard street prices of the Radeon RX 6600 XT will be more in the "499EUR to 549EUR" range. The site also heard from its sources that the supply of the Radeon RX 6600 XT isn't as good as some other sites (or YouTubers) recently mentioned.
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