Posted on Wednesday, August 15 2018 @ 22:27:49 CEST by Thomas De Maesschalck
Over at SIGGRAPH, Intel provided a teaser for its upcoming discrete GPU. Not a whole lot has been shared so far, but in the video clip Intel confirms it plans to launch its first product in 2020. Let the hyping begin!
Posted on Wednesday, August 15 2018 @ 22:12:54 CEST by Thomas De Maesschalck
Now the Turing cat is out of the bag, lots of rumors are popping up again about NVIDIA's next-gen gaming cards. VideoCardz compiled some of the interesting ones but there's still a lot of contradicting information going around.
First up, it appears the codename of the new GeForce GPUs is still unknown. According to the site's sources NVIDIA has still not confirmed the codename, it could be GT, TU, or even RT. Furthermore, it's claimed that there are no performance leaks yet because NVIDIA hasn't provided final drivers to their partners. They can't test the cards so the there are no scores to provide to the usual moles.
Take the following with a grain of salt.
Some rumors talk about GeForce RTX 2080, RTX 2080 Ti, and even Titan Turing cards. The RTX 2080 could feature something like 3072 CUDA cores, in combination with a 256-bit memory bus and at least 8GB GDDR6 memory. The memory may be clocked at 7000MHz, the same as the Quadro cards. One leak claims the card has a 210W TDP.
Posted on Wednesday, August 15 2018 @ 19:02:48 CEST by Thomas De Maesschalck
Indonesian overclocker IvanCupa had some fun with AMD's new Ryzen Threadripper 2990WX processor. With the help of liquid nitrogen (LN2), he managed to clock all of the chip's cores to 5955.4MHz, representing an almost 100 percent overclock considering the 2990WX has an all-core base clockspeed of 3GHz. Pretty nice feat.
The overclocking effort was achieved bu user IvanCupa on MSI's X399 MEG Creation motherboard paired with 8 GB of single-channel DDR4 memory (easier on the CPU to support than if more channels were populated). We'll see whether this chip can be taken even closer to the stratosphere than this - remember it's only been a few days since the chip's release to the wild.
Posted on Wednesday, August 15 2018 @ 18:51:33 CEST by Thomas De Maesschalck
VideoCardz spotted an interesting teaser from Gainward. The promotional material shows three "glaring eyes" that look similar to earlier custom-design video cards from the company. Not a whole lot of details here, but given the timing this is most likely a teaser of an upcoming triple-fan GeForce RTX 2080 video card from Gainward.
It remains unclear if the company is teasing multi-fan cooling solution or the fact that the fans are illuminated by RGB lighting.
Posted on Wednesday, August 15 2018 @ 11:47:04 CEST by Thomas De Maesschalck
Yesterday we wrote about the three L1 Terminal Fault (L1TF) vulnerabilities that were discovered in Intel's processors. The attacks are known as Foreshadow, they're somewhat similar to the Meltdown vulnerabilities but focus on the L1 cache. Attacks abuse speculative execution to retrieve data from the Intel SGX (Software Guard eXtensions) and Virtual Machine Manager. Two of the three vulnerabilities already have CPU microcode updates from Intel and Windows patches from Microsoft. The third bug is harder to fix and exclusively targets datacenters.
There isn't a whole lot of news to post today so let's expand upon L1TF a bit more. Here's a video from Intel that explains the weakness:
There are three applications of L1TF speculative execution side-channel cache timing vulnerabilities. They are similar to previously reported variants. These particular methods target access to the L1 data cache, a small pool of memory within each processor core designed to store information about what the processor core is most likely to do next.
Here's a video that explains the Foreshadow attack:
And here's a more technical demonstration of Foreshadow:
Posted on Wednesday, August 15 2018 @ 11:00:16 CEST by Thomas De Maesschalck
TSMC's Board has given the greenlight for a capacity expansion. The Taiwanese foundry will invest approximately US$4,488.09 million to construct new fabs, expand existing capacity, and develop advanced process and packaging technology. At the same time, the Board also appointed Dr. H.-S. Philip Wong as Vice President of TSMC.
TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:
1. Approved capital appropriations of approximately US$4,488.09 million for purposes including: 1) Construction of fab facilities; 2) Installation, expansion, and upgrade of advanced technology capacity; 3) Conversion of logic capacity to specialty technology capacity; 4) Conversion of mature technology capacity to specialty technology capacity; 5) Expansion and upgrade of specialty technology capacity; 6) Expansion of advanced packaging technology capacity; 7) Fourth quarter 2018 R&D capital investments and sustaining capital expenditures.
2. Approved the capital injection of not more than US$2 billion to TSMC Global Ltd., a wholly-owned BVI subsidiary, for the purpose of reducing foreign exchange hedging costs.
3. Approved the appointment of Dr. H.-S. Philip Wong as Vice President of TSMC. Dr. Wong will serve as Head of Corporate Research and report directly to Senior Vice President Dr. Y. J. Mii.
Profile of Dr. H.-S. Philip Wong:
Dr. H.-S. Philip Wong holds a Ph.D. degree in Electrical Engineering from Lehigh University, USA. Prior to joining TSMC, Dr. Wong was a Tenured Professor of Electrical Engineering at Stanford University, and also has 16 years of semiconductor industry experience in IBM.
Posted on Wednesday, August 15 2018 @ 10:22:10 CEST by Thomas De Maesschalck
Lian Li reveals the LanCool One, a new mid-tower with a steel chassis and a brushed aluminium front panel with RGB LED effects. The case has a tempered glass side panel and features 7+2 expansion slots, four 2.5" SSD slots, two 3.5" HDD slots, room for up to nine 120mm fans (two are included), support for radiators of up to 360mm, and room for VGA cards of up to 420mm.
A front I/O panel offers two USB 3.0 ports and HD Audio. Besides the LanCool One, Lian Li also offers the LanCool One Digital. That version adds USB 3.1 Type-C to the front I/O and has addressable RGB LEDs. The cases are offered today via Newegg for $89.99 and $99.99, respectively.
Lian Li Industrial Co. Ltd., world’s leading manufacturer of aluminum chassis for enthusiasts, custom OEM/ODM case solutions and case accessories is pleased to announce the official launch of the LANCOOL ONE chassis. Featuring Lian Li’s signature brushed aluminum finish and quality combined with modern RGB lighting, the LANCOOL ONE brings a new twist to a classic Lian Li design. Debuted in the recent COMPUTEX 2018 expo, the LANCOOL ONE has already managed to wow consumers due to its unique design and incredible value offering.
Classic Look with Modern RGB
Nobody in the business does aluminum better than Lian Li and the LANCOOL ONE continues that legacy with its stylish aluminum front panel which exudes a timeless, elegant vibe but is given a modern touch with impressive RGB lighting. The RGB lighting serves as both an accent piece for the front panel as well an ambient lighting for the internal chamber giving it a two-in-one function that provides a lot of value. The LEDs also illuminate front fans directly so users not using RGB fans on the front can get the illusion of using RGB fans on the front thanks to the front panel lighting.
Lian Li has worked with all leading motherboard brands to provide the LANCOOL ONE with RGB sync support with most popular lighting control software like ASUS AURA Sync, GIGABYTE RGB Fusion, ASRock Polychrome and MSI Mystic Light.
Optimized Airflow for Great Cooling
Both top and front panels of the Lian Li LANCOOL ONE offer great airflow. Lian Li has designed the LANCOOL ONE to have optimized airflow so users who want to maximize cooling can do so thanks to plenty of fan mounting locations. Integrated removable dust filters allow ease-of-cleaning and reduced dust inside the chassis. The front panel of the LANCOOL ONE features an open front slit and side vents maintain looks while still providing high airflow for a great balance of looks and function.
The LANCOOL One supports up 360mm radiators on the top or front (only one at a time) or users can also mount a single 280mm radiator on the front. A total of nine 120mm fans can be installed on the LANCOOL One for incredible airflow possibilities.
Multifunction PSU Shroud
Increase cooling in your case or add more storage with the Lian Li’s innovative dual-function PSU shroud. The shroud includes removable drive trays to house two additional 2.5” drives like SSDs or mount additional two 120mm fans for improved cooling that helps in cooling PCIe devices like the GPU. Underneath the PSU shroud, user can install up to two 3.5” drives like HDDs for further storage. The drive cage is removable and you can move it so you can have more space underneath the shroud for other airflow or modifications.
Cable Management Made Easy
The modular drive cage caddy can be removed for easier cable routing and the LANCOOL ONE also features plenty of tie down points for easier cable management. This enables a cleaner look and an easier time when doing maintenance.
Modern Meets Classic with More Features
The LANCOOL ONE features a full tempered glass side panel which is locked in place with LIAN LI’s signature mounting system, which allows for a seamless look yet still secure and easy to use. This makes it easier to remove your tempered glass panel and do maintenance and cleaning as well as installation of new components on your system.
Support for modern systems is given attention as the LANCOOL ONE supports up to larger EATX motherboards and the tilted tray design compliments the cable management feature of the LANCOOL ONE making it easier to route cables on the front. Motherboards following the E-ATX standard with dimensions of 12” x 10.9” can fit in the LANCOOL ONE. Furthermore, The LANCOOL ONE can accommodate motherboards with width of up to 280mm.
For greater presentation possibilities, the LANCOOL ONE can accommodate vertical GPU mounting.
Posted on Tuesday, August 14 2018 @ 21:50:17 CEST by Thomas De Maesschalck
A group of international security researchers discovered three new vulnerabilities in Intel's processors. Dubbed L1 Terminal Fault (L1TF) bugs because they involve extracting information from the CPU's level-one data cache, these vulnerabilities potentially enable malware on a vulnerable machine, and guest virtual machines on a cloud service, to steal sensitive data from other software and other customers' virtual machines.
CVE-2018-3615: This affects Software Guard Extensions (SGX), and was discovered by various academics who will reveal their findings this week at the Usenix Security Symposium. According to Intel, "systems with microprocessors utilizing speculative execution and software guard extensions (Intel SGX) may allow unauthorized disclosure of information residing in the L1 data cache from an enclave to an attacker with local user access via side-channel analysis." This vulnerability was named Foreshadow by the team who uncovered it. This will require the microcode update to fix.
CVE-2018-3620: This affects operating systems and SMM. According to Intel, "systems with microprocessors utilizing speculative execution and address translations may allow unauthorized disclosure of information residing in the L1 data cache to an attacker with local user access via a terminal page fault and side-channel analysis." Operating system kernels will need patching, and the SMM requires the microcode update, to be protected.
CVE-2018-3646: This affects hypervisors and virtual machines. According to Intel, "systems with microprocessors utilizing speculative execution and address translations may allow unauthorized disclosure of information residing in the L1 data cache to an attacker with local user access with guest OS privilege via a terminal page fault and side-channel analysis." This will require the microcode, operating system, and hypervisor updates to protect data.
Intel gave the bugs a high severity rating and plans to ship redesigned CPUs later this year. Software-based mitigation is expected very soon, these may have yet another potential performance impact.
As The Register points out, this is one of the clearest examples that, over time, Intel traded security for speed.
Posted on Tuesday, August 14 2018 @ 16:59:54 CEST by Thomas De Maesschalck
Cooler Master presents the MasterLiquid ML360R RGB, this is the company's first all-in-one liquid cooling solution with a 360mm radiator. The product features a new dual-chamber pump with 12 addressable RGB LEDs and three MasterFan MF120R ARGB fans, which each have 12 addressable RGB LEDs. The cooler ships today and has a suggested retail price of $159.99.
Cooler Master, a global leader in manufacturing CPU coolers, computer components and peripherals, introduces its first 360mm all-in-one (AIO) liquid CPU cooler. The MasterLiquid ML360R features addressable RGB LEDs on both the fans and water block and is certified compatible with ASUS, MSI and ASRock motherboards.
16.7 Million Color Customizing with Software or Wired Controller
The MasterLiquid ML360R RGB features Cooler Master’s newly designed pump with 12 addressable RGB LEDs on the water block and eight addressable RGB LEDs on each fan, capable of 16.7million color options. Users can easily customize each LED, individually, through the addressable RGB software from ASUS, MSI and ASRock motherboards, or with Cooler Master’s MasterPlus+ software for complete ambient control.
Cooler Master’s MasterLiquid ML360R RGB comes equipped with a new addressable RGB LED controller for use and compatibility with non-addressable RGB components and easy lighting and mode control. A 5-in-1 addressable RGB splitter is also included in the packaging.
Innovative Quality Design and More
Exclusively designed in-house, the MasterLiquid ML360R RGB is constructed with a low-profile, dual chamber pump that separates incoming coolant from the radiator-bound heated coolant. Cooler Master’s unique pump design maximizes CPU cooling results and assists in maintaining ideal system temperatures. In addition, the MasterLiquid ML360R RGB features a precision machined microchannel cold plate to quickly dissipate heat, FEP tubing on the interior and sleeved tubing on the exterior for a premium look and extended durability.
Cooler Master MasterLiquid ML360R RGB features:
Addressable RGB LED pump with 16.7 million colors
Dual chamber pump design to separate incoming and outgoing coolant
Posted on Tuesday, August 14 2018 @ 16:42:03 CEST by Thomas De Maesschalck
Word is going around that Intel's next HEDT chipset will be called X599 as the firm is skipping the "X499". This chipset will support the upcoming Skylake-X XCC (extreme core-count) processors, which includes an 28-core model and likely also 24-core and 26-core editions. This is basically the consumer version of the Intel C629 "Lewisburg" chipset and the Xeon Platinum 8180.
This chipset will support new SKUs derived from the "Skylake-X" XCC silicon (probably 24-core, 26-core, and 28-core), in the LGA3647 package. The platform features not just up to 28 cores, but also a 6-channel DDR4 memory interface, which will probably support up to 192 GB of memory on the client-platform. There's also a rumor that Intel could launch new 20-core and 22-core LGA2066 processors. Those, coupled with the 8-core LGA1151 processor, will be Intel's fig-leaf until late-2019.