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Intel Core i9-13900KS is the first CPU with a 6.0GHz Boost

2 weeks ago
Earlier this week we saw the launch of Intel's newest processor, the Core i9-13900KS. This powerful processor boasts an impressive 6.0GHz max turbo frequency, making it the fastest desktop processor on the market. It's the first processor in the PC industry to cross the 6.0GHz mark at stock. It's sold for $699.
What's New: Intel today announced full details and availability for the new 13th Gen Intel® Core™ i9-13900KS, the world's fastest desktop processor1. It delivers up to 6.0 gigahertz (GHz) max turbo frequency out of the box – the first processor in the PC industry to cross that threshold at stock – to power world-class gaming and creating experiences for desktop enthusiasts.

"The Core i9-13900KS continues our 13th Gen Intel Core desktop processor family excellence, showcasing the new performance heights made possible by our performance hybrid architecture. Extreme gamers and enthusiasts can now push their everyday performance further than ever before with the first desktop processor in the PC industry to provide 6.0 GHz speeds at stock." –Marcus Kennedy, Intel Client Computing Group manager, Gaming and Channel

Why It Matters: The unlocked i9-13900KS processor represents a major milestone in the PC industry – bringing faster speeds than before to enthusiast desktop users. In addition to 24 cores, it delivers up to 6.0 GHz max turbo frequency and 36MB Intel® Smart Cache for incredible performance in gaming and content creation workloads.

What It Offers: Key features and capabilities of the i9-13900KS include:
  • Up to 6.0 GHz max turbo frequency with Intel® Thermal Velocity Boost – the first CPU in the PC industry to reach 6.0 GHz without overclocking.
  • Intel® Adaptive Boost Technology for improved gaming performance by opportunistically allowing higher multicore turbo frequencies.
  • 24 cores (eight Performance-cores and 16 Efficient-cores), 32 threads, 150W processor base power, 36MB Intel Smart Cache and a total of 20 PCIe lanes (16 PCIe 5.0 and four PCIe 4.0 lanes).
  • Up to DDR5 5600 MT/s and DDR4 3200 MT/s support.
  • Compatible with Z790 and Z690 motherboards, with the latest BIOS recommended for the best gaming and content creation experience.
The i9-13900KS processor allows gamers and enthusiasts to take performance to the next level.

When It's Available: This special edition processor will be available beginning Jan. 12, 2023, with a recommended customer price starting at $699. It can be found at retailers worldwide as a boxed processor and integrated into systems from Intel's channel and OEM partners.
Core i9-13900KS

TSMC 3nm... when the SRAM scaling stops

1 month ago
INTC logo
XDA Developers offers a hot take on the recent news about TSMC's 3nm process technology. One of the profound implications of TSMC's latest process technology seems to be that historical scaling is officially dead. According to TSMC's own figures, the 3NE node will have exactly the same SRAM cache density as its 5nm predecessor.

The 3NB node, which is more of a niche product, will have some SRAM scaling. But even that node's SRAM scaling will be a mere 5 percent better than 5nm. Chip-level transistor scaling is still 1.6x and 1.7x for N3B and N3E, but overall it's bad news for Moore's Law as shrinking chips is becoming increasingly more complex.
But the problem isn't just about not being able to increase the amount of cache without using up more area. Processors can only be so large, and any space taken up by cache is space that can't be used for logic, or the transistors that lead to direct performance gains. At the same time, processors with more cores and other features need more cache to avoid memory-related bottlenecks. Even though the density of logic continues to increase with every new node, it might not be enough to compensate for the lack of SRAM scaling. This might be the killing blow for Moore's Law.

Merry Christmas from DVHARDWARE!

1 month ago
Dear readers of DVHARDWARE,

Christmas is almost upon us, and that means it's time to look back on the past year and look forward to the new one. First and foremost, I would like to apologize for posting relatively little content this year. It has been a busy year for me. Between a new job and a family, I was often too busy with other things to make time for writing and posting new articles.

However, despite my absence on the website, I still believe in the power of technology to improve and enrich our lives. DVHARDWARE looks forward to the new year, in which there will hopefully be more time to post new and interesting articles.

I wish all readers of DVHARDWARE a happy holiday season and a healthy and successful new year!

Merry Xmas

P.S. This post was almost entirely written by AI! The capabilities of ChatGPT are impressive to say the last.

MONTECH SKY TWO cases give you an unobstructed view

1 month ago
MONTECH showcases the SKY TWO, a new mainstream computer case that offers an unobstructed view of your hardware by incorporating not only a left side window but also a front side window. The case uses a unique airflow design, by using fine mesh intake from the bottom of the front and side panels. The SKY TWO is sold online in three colors; Black (US$99.99), Pristine White (US$105.99), and Morocco Blue (US$119.99).

Montech Sky TWO
  • Front and side tempered glass panels for unobstructed view
  • Unique airflow with fine mesh intake from the bottom of front and side panel
  • Supports motherboards from Mini-ITX to E-ATX, and 360mm radiator on top
  • Supports the latest NVIDIA 4000 series GPUs
  • 3 x pre-installed RX120 reversed blades 120mm ARGB/PWM fans with fan controller hub, 1 x pre-installed AX120 fan at the rear
  • Available in Black US$99.99, Pristine White US$105.99, Morocco Blue US$119.99
MONTECH, an innovative PC components and peripherals brand, announces the SKY TWO, a mainstream mid-tower case that showcases your PC components with the front and side tempered glass panels. The latest addition to the SKY series offers top cooling performance with a unique airflow configuration featuring fine mesh bottom front panel and side panel, 3 pre-installed RX120 reversed 120mm ARGB/PWM fans at the side and bottom and pre-installed AX120 ARGB/PWM fan at the rear. The SKY TWO is compatible with motherboards from Mini-ITX to E-ATX, supports top mounting of up to a 360mm radiator and fans, and features a top I/O including a USB Gen 2 Type C port. The SKY TWO is available in Black US$99.99, Pristine Frost White US$105.99, and Morocco Blue US$119.99.

Designed for High-Performance
The SKY TWO offers a unique airflow approach with the lower portion of the front and left side panel designed with a fine mesh optimized for airflow and dust filtration. This concept ensures plenty of air is pushed through the PSU shroud and fed into the fans above it, providing a direct supply of fresh air to the GPU. In addition, the 3 pre-installed RX120 120mm ARGB/PWM fans (2 at the side and 1 at the bottom) feature a reverse blade design which allows them to be installed as intake with their best side visible. An additional 120mm ARGB/PWM fan is pre-installed at the rear of the SKY TWO to create a balanced out-of-the-box thermal solution.

Unobstructed View and High-End Compatibility
The SKY TWO is equipped with two tempered glass panels, one at the front and one on the left side of the case, allowing a full view of the PC hardware installed inside, and easily removable to provide an unrestricted building experience. Users are presented with great configuration possibilities with the SKY TWO’s compatibility for Mini-ITX to E-ATX motherboards, 168mm tall CPU cooling towers support, up to a 360mm radiator at the top, and up to 400mm long GPUs, enough to support the latest NVIDIA 4000 series graphics without any issues. In addition, the SKY TWO can support up to 2 x HDDs/SSDs in the PSU chamber drive cage, and 2 x SSDs in the second chamber, which is also equipped with 3 large Velcro straps, and a fan hub capable to support up to 6 ARGB and PWM devices (with 3 ports each populated by the pre-installed fans).

3 Colors to Choose From
The SKY TWO is available in classic black, a Pristine white, and a special Morocco blue. The Pristine White edition is an inside-out all-white design with white rubber grommets, white fans, and silver screws. The Morocco Blue edition, each part of the case features a unique blue from the tempered glass panel’s edges to the fans, grommets, and case screws.

Optional Accessories
The AX120 PWM and RX120PWM (reversed fan) are also sold separately, MSRP $8.90 in black, and $9.90 in white. The reversed blade design complements builds with more intake fans while maintaining a great aesthetics. Users can also opt for the VGM Vertical GPU Mounting at MSRP$59. The vertical GPU kit comes with a 220mm PCIe 4.0 riser card and is compatible with any case with 7 PCIe expansion slots.


Product Name


Exterior Color

Black, Pristine White, Morocco Blue

Dimensions (LxWxH)


Motherboard Support


Fan Support

Top: 3 x 120 / 2 x 140mm
Side: 2 x 120mm
Bottom: 2 x 120mm
Rear: 1 x 120mm

Radiator Support

Top: 120//240/280/360mm
Rear: 120mm


GPU: 400mm
CPU: 168mm
PSU: 210mm

Power Supply Support

Bottom mount, ATX

Expansions Slots


Drive Bays

3.5” = x 2
2.5” = x 4

I/O Port

2 x USB3.0, 1 x USB Type C, 1 x HD Audio, 1 x Mic, LED Button

Included Fans

3 x RX120 Reversed Blades ARGB/PWM 120mm (Front)
1 x AX120 ARGB/PWM 120mm (Rear)
Speed: 800-1600 RPM
Airflow: 59 CFM
Air Pressure: 1.8 mm H2O
Noise: 27 dBA


Fan hub with 6 x ARBG/PWM headers

Intel foresees packages with trillions of transistors by 2030

1 month ago
INTC logo
Over at IEDM 2022 this week, Intel talked about how it plans to keep Moore's Law alive. Among other things, the chip giant revealed advances in 3D packaging tech with a 10x density improvement and new materials for 2D transistor scaling beyond RibbonFET, including a material just 3 atoms thick. Intel says we can expect packages with trillions of transistors by 2030.

Intel chip
What's New: Today, Intel unveiled research breakthroughs fueling its innovation pipeline for keeping Moore's Law on track to a trillion transistors on a package in the next decade. At IEEE International Electron Devices Meeting (IEDM) 2022, Intel researchers showcased advancements in 3D packaging technology with a new 10x improvement in density; novel materials for 2D transistor scaling beyond RibbonFET, including super-thin material just 3 atoms thick; new possibilities in energy efficiency and memory for higher-performing computing; and advancements for quantum computing.

"Seventy-five years since the invention of the transistor, innovation driving Moore's Law continues to address the world's exponentially increasing demand for computing. At IEDM 2022, Intel is showcasing both the forward-thinking and concrete research advancements needed to break through current and future barriers, deliver to this insatiable demand, and keep Moore's Law alive and well for years to come." –Gary Patton, Intel vice president and general manager of Components Research and Design Enablement

What's Happening at IEDM: Commemorating the 75th anniversary of the transistor, Dr. Ann Kelleher, Intel executive vice president and general manager of Technology Development, will lead a plenary session at IEDM. Kelleher will outline the paths forward for continued industry innovation – rallying the ecosystem around a systems-based strategy to address the world's increasing demand for computing and more effectively innovate to advance at a Moore's Law pace. The session, "Celebrating 75 Years of the Transistor! A Look at the Evolution of Moore's Law Innovation," takes place at 9:45 a.m. PST on Monday, Dec. 5.

Why It Matters: Moore's Law is vital to addressing the world's insatiable computing needs as surging data consumption and the drive toward increased artificial intelligence (AI) brings about the greatest acceleration in demand ever.

Continuous innovation is the cornerstone of Moore's Law. Many of the key innovation milestones for continued power, performance and cost improvements over the past two decades – including strained silicon, Hi-K metal gate and FinFET – in personal computers, graphics processors and data centers started with Intel's Components Research Group. Further research, including RibbonFET gate-all-around (GAA) transistors, PowerVia back side power delivery technology and packaging breakthroughs like EMIB and Foveros Direct, are on the roadmap today.

At IEDM 2022, Intel's Components Research Group showed its commitment to innovating across three key areas to continue Moore's Law: new 3D hybrid bonding packaging technology to enable seamless integration of chiplets; super-thin, 2D materials to fit more transistors onto a single chip; and new possibilities in energy efficiency and memory for higher-performing computing.

How We Do It: Components Research Group researchers have identified new materials and processes that blur the line between packaging and silicon. We reveal critical next steps on the journey to extending Moore's Law to a trillion transistors on a package, including advanced packaging that can achieve an additional 10x interconnect density, leading to quasi-monolithic chips. Intel's materials innovations have also identified practical design choices that can meet the requirements of transistor scaling using novel material just 3 atoms thick, enabling the company to continue scaling beyond RibbonFET.

Intel introduces quasi-monolithic chips for next generation 3D packaging:
  • Intel's latest hybrid bonding research presented at IEDM 2022 shows an additional 10 times improvement in density for power and performance over Intel's IEDM 2021 research presentation.
  • Continued hybrid bonding scaling to a 3 um pitch achieves similar interconnect densities and bandwidths as those found on monolithic system-on-chip connections.
Intel looks to super-thin '2D' materials to fit more transistors onto a single chip:
  • Intel demonstrated a gate-all-around stacked nanosheet structure using 2D channel material just 3 atoms thick, while achieving near-ideal switching of transistors on a double-gate structure at room temperature with low leakage current. These are two key breakthroughs needed for stacking GAA transistors and moving beyond the fundamental limits of silicon.
  • Researchers also revealed the first comprehensive analysis of electrical contact topologies to 2D materials that could further pave the way for high-performing and scalable transistor channels.
Intel brings new possibilities in energy efficiency and memory for higher-performing computing:
  • To use chip area more effectively, Intel redefines scaling by developing memory that can be placed vertically above transistors. In an industry first, Intel demonstrates stacked ferroelectric capacitors that match the performance of conventional ferroelectric trench capacitors and can be used to build FeRAM on a logic die.
  • An industry-first device-level model captures mixed phases and defects for improved ferroelectric hafnia devices, marking significant progress for Intel in supporting industry tools to develop novel memories and ferroelectric transistors.
  • Bringing the world one step closer to transitioning beyond 5G and solving the challenges of power efficiency, Intel is building a viable path to 300 millimeter GaN-on-silicon wafers. Intel breakthroughs in this area demonstrate a 20 times gain over industry standard GaN and sets an industry record figure-of-merit for high performance power delivery.
  • Intel is making breakthroughs on super-energy-efficient technologies, specifically transistors that don't forget, retaining data even when the power is off. Already, Intel researchers have broken two of three barriers keeping the technology from being fully viable and operational at room temperature.
Intel continues to introduce new concepts in physics with breakthroughs in delivering better qubits for quantum computing:

Intel researchers work to find better ways to store quantum information by gathering a better understanding of various interface defects that could act as environmental disturbances affecting quantum data.

NVIDIA to be one of first customers of TSMC plant in Arizona

1 month ago
Reports out of Asia suggest NVIDIA and Apple will be among the first customers of the future TSMC fab in Arizona. This fab is expected to make 5nm chips and is believed to be ready for production in 2024. In February, Seeking Alpha noted the fab's construction was running about three to six months behind schedule.

More domestic chip production capacity is one of the big goals of both the US and the European Union, as both realize the world's supply is very concentrated in a tiny part of Asia.
Last month, Apple (AAPL) Chief Executive Tim Cook told employees that the tech giant would source some of its chips from Arizona as the company looks to diversify its supply chain.

"We’ve already made a decision to be buying out of a plant in Arizona, and this plant in Arizona starts up in ’24, so we’ve got about two years ahead of us on that one, maybe a little less,” Cook told employees in Germany. "And in Europe, I’m sure that we will also source from Europe as those plans become more apparent."

Lian Li V3000 PLUS case offers three modes for $499.99

2 months ago
Lian Li cooked up a new premium case that offers three configurable modes: standard, rotated motherboard, and dual system. The V3000 PLUS offers a ton of room, it supports motherboards of up to EEB form factor, three 480mm watercooling radiators, and 16 storage disks. If you don't use watercooling, there's room for a maximum of sixteen 120mm fans. The suggested retail price of this aluminium/steel case is $499.99, it will start shipping in January 2023.

Optional accessories include Hotswap Drive Module ($14.99), Vertical GPU PCIe 4.0 ($59.99), and Dual System PCIe 4.0 ($49.99).

Lian Li V3000 PLUS

Lian Li V3000 PLUS
LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, announces the V3000 PLUS, a modular full tower that can be configured to 3 different modes. Standard mode fits EEB motherboards with a total of 3 x 480mm radiators and 16 x storage drives. Rotated mode, the motherboard tray is rotated 90 degrees, maintains the same radiator support, and upright GPU installation. Dual System mode fits the main system with support for up to EEB motherboards, and a secondary with Mini-ITX. The V3000 PLUS is available in black, and in January also in white, at an MSRP of $499.99.

Mode 1 - Standard Mode
The V3000 PLUS is compatible with EEB motherboards, up to 16 x 120mm fans, 480mm radiators at the top, front and on the side of the PSU shroud, and a 360mm radiator above it. A removable top radiator bracket, removable side PSU shroud radiator bracket, and multi-position front radiator bracket ensure easy and safe installation of all the cooling hardware. Even the motherboard tray can be removed for the installation of the main components outside of the case.

Mode 2 - Rotated Mode
In rotated mode, the motherboard tray is installed with the rear I/O located at the PSU shroud, with a pass-through channel for the ports to the rear of the case. Maintaining the same cooling support as in Standard mode, upright GPU mounting is also supported for a tower-like look. This mode allows for a unique PC look and direct ventilation of the GPU from the front panel, ensuring optimal thermal performance.

Mode 3 - Dual System Mode
With the motherboard tray elevated, two systems can be installed in the main chamber of the V3000 PLUS. Up to EEB motherboards on the system 1 tray, and a Mini-ITX motherboard above the PSU shroud. In this configuration, up to 11 x 120mm fans, 2 x 480mm radiators (top and front), and up to a 280mm radiator (above PSU shroud) can be installed. The rear panel’s PSU mounting bracket can be replaced by a dual PSU for ATX and SFX mounting compatibility. The same bracket can support a vertical GPU mounted in the PSU shroud compartment with direct air intake from the side mesh panel.

Extreme Storage
The V3000 PLUS is an ideal solution for data storage with support for up to 16 SSDs/HDDs. Inside the PSU shroud, 2 adjustable drive cages hold 4x HDDs/SSDs each. In the main chamber, up to 4 SSDs can be mounted. Alternatively, the mounting brackets can be removed and the PSU shroud drive cages can be relocated beside the motherboard. And behind the motherboard tray, 4 toolless SSD mounting trays are also available for additional storage.

Additional Accessories
The drive cages can be upgraded with hot-swap drive modules. Each backplate supports 2 drives, with a maximum of 4 hot-swap drive modules supported. For a vertical GPU solution while in Standard mode, a 200mm riser cable (90-degree to 180-degree connection) additional accessory is available. In the dual system, the second system’s GPU in the dual system mode, users can mount their GPU in the PSU shroud compartment with an additional 240mm riser cable (90-degree to 90-degree connection) accessory.

The V3000 PLUS is available for pre-order starting November 18th, 2022. A white version of the V3000 PLUS will be available in January 2023.



V3000 PLUS


(D) 678.5mm x (W) 279mm x (H) 674mm




Dual system
System 1
System 2


ATX (Under 220mm)
ATX (Under 220mm)
Dual system
ATX (Under 220mm) + SFX-L/SFX


0.8mm Steel
4.0mm Dark Tinted Tempered Glass (right side)
4.0mm Tinted Tempered Glass (left side)


Front 4 x 120mm or 3 x 140mm
Top 4 x 120mm or 3 x 140mm or 2 x 200mm
Above PSU Chamber 3 x 120mm or 3 x 140mm
Bottom side 4 x 120mm or 3 x 140mm
Rear: 1 x 120mm or 1 x 140mm
Front 4 x 120mm or 3 x 140mm
Top 4 x 120mm or 3 x 140mm or 2 x 200mm
Bottom side 4 x 120mm or 3 x 140mm
Rear: 3 x 120mm or 2 x 140mm
Dual system
Front 4 x 120mm or 3 x 140mm
Top 4 x 120mm or 3 x 140mm
Above PSU Chamber 2 x 120mm or 2 x 140mm
Rear: 1 x 120mm or 1 x 140mm


Front 480mm or 420mm
Top 480mm or 420mm
Above PSU Chamber 360mm
Bottom side 480mm or 420mm
Front 480mm or 420mm
Top 480mm or 420mm
Bottom side 480mm or 420mm
Rear: 360mm or 280mm
Dual system
Front 480mm or 420mm
Top 480mm
Above PSU Chamber 240mm or 280mm


Max 589mm
Max 358mm
Dual system
Max 589mm


Max 204mm


Drive Cage 8 x 2.5” SSD or 8 x 3.5” HDD
Side 4 x 2.5” SSD
Behind MB tray: 4 x 2.5” SSD


Dual system
8 + 3 (Optional)


System 1
1 x Power Button
1 x Reset Button
1 x Light Color Button (C)
1 x Light Mode Button (M)
2 x USB 3.0
1 x USB Type C
1 x Audio
System 2
1 x Power Button
1 x Reset Button
2 x USB 3.0
1 x USB Type C
1 x Audio

Lian Li LANCOOL 216 has air and watercooling mode

2 months ago
Lian Li adds a new medium budget case, the LANCOOL 216. This model stands out because it offers a water cooling and air cooling mode -- the position of the motherboard can be adjusted to optimize the case. Out of the box, the case comes with three pre-installed PWM fans, including two large 160mm fans and a 140mm one. Lian Li offers the LANCOOL 216 base model only in black, with a MSRP of $99.99. There is also a variant with RGB LED illumination for $109.99, that version also ships in a white edition for $114.99.

LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, announces the LANCOOL 216, an airflow focused case. Pre-installed with two 160mm and one 140mm PWM fan, the LANCOOL 216 offers great out-of-box performance and can be configured from air cooling to AIO cooling mode by lowering/raising the motherboard position. To help balance the case airflow and provide better GPU cooling, the Lancool 216 includes an external PCIe fan bracket that supports a 120mm fan to be mounted on the rear panel, in front of the expansion slots. The LANCOOL 216 is available in black with non-RGB front fans, and in black or white with addressable RGB front fans.

Air Cooling Mode & Water Cooling Mode
To ensure plenty of air is passed through, the LANCOOL 216 features a continuous front-to-top fine mesh panel and a PSU shroud side mesh panel. Paired with 2 x 160mm and 1 x 140mm pre-installed PWM fans, the LANCOOL 216 ensures great out-of-box performance. For air cooling solutions, the LANCOOL 216’s rear I/O can be flipped and the motherboard standoffs set higher in the main chamber to allow up to 2 x 140mm fans above the PSU shroud and at the top of the case. In water-cooling mode, with a motherboard in a lower position, the top of the case can be fitted with up to a 360mm radiator for AIO or custom water-cooling loop design.

Additional Airflow
In addition to the 140mm fan pre-installed at the rear of the case, the LANCOOL 216 also supports an additional 120mm fan behind the expansion slots. The included PCIe fan bracket accessory can be used in air-cooling mode in conjunction with horizontal GPUs at the 1st expansion slot, or with vertical GPU closer to the motherboard without obstructing the GPU I/O while providing better cooling for the GPU and a greater intake/exhaust balance for the system.

Easy to Build & Easier Access
The removable top radiator bracket opens the case to simplify the installation of hardware in the main chamber. In the second chamber, 5 velcro straps, clips, and tie points provide clear routing options for cable management. Lastly, the drive cage in the PSU shroud compartment, which can be moved to accommodate front-mounted radiator/fan combos, supports the mounting of 3.5” HDDs and 2.5” SSDs simultaneously on both of its trays. The front panel I/O module can be moved to the lower left side of the front panel for easier access when the case is set on a table.

Optional ARGB Front I/O Accessory
To provide greater control of the light effects on the LANCOOL 216 RGB front fans, an additional ARGB front I/O accessory, the ARGB control & USB module, can be installed at the lower side of the front panel. The additional I/O lets users control the two addressable LEDs channels (opening rim and fan blade shaft) individually to create custom styles. The ARGB control & USB module additional accessory is available in black and white at an MSRP of $13.99.

The LANCOOL 216 Black, Black RGB, and White RGB are available for pre-order at Newegg starting November 11th, 2022, and at and starting November 21st, 2022.

Noctua expands portfolio with inlet spacers and gasket sets

2 months ago
Two new accessories from Noctua; the firm has added the NA-IS1 inlet spacers and the NA-SAVG2 gasket set to its product portfolio. The first is aimed at reducing influx turbulence in situations where a fan draws air through obstacles such as perforated plates, mesh panels, filters, or radiations. The gasket set is aimed at getting a tighter seal with the fan, for example for cooling radiators.

Recommended retail pricing is 14.90EUR ($14.90) for the NA-IS1 and 9.90EUR ($9.90) for the NA-SAVG2.

NA-IS1 inlet spacers NA-SAVG2 gasket set
Noctua today introduced its new NA-IS1 intake side spacer frames for suction or “pull” type applications where fans draw air through obstacles such as grills, perforated plates, mesh panels, filters or radiators. By offsetting the fan from the obstacle, the NA-IS1 can significantly reduce influx turbulences and thereby help to improve both acoustics and performance. In addition, Noctua also introduced the NA-SAVG2 anti-vibration gasket set for using 140mm fans on water cooling radiators or other applications that benefit from a tighter seal with the fan.

“Intake applications where fans draw air through obstacles such as grills or perforated panels are notoriously challenging both from an aerodynamic and from an acoustic point of view due to the massive turbulences that are caused by these objects”, explains Roland Mossig (Noctua CEO). “These influx turbulences can have a significant impact on fan acoustics and performance, so we have created the NA-IS1 spacer frames that give customers a simple yet highly effective solution to reduce these turbulences and thereby make fans more efficient in suction type applications.”

Introducing a 5mm off-set between the fan and the obstacle, the NA-IS1 spacers can reduce influx turbulences significantly, which not only improves acoustics but also helps fans to operate more efficiently from an airflow performance point of view because the fan blades are less hampered by turbulence. In many suction type applications, using inlet spacers can therefore enable fans to achieve higher flow rates and lower noise emissions at the same time.

For example, in controlled testing on a perforated panel with a typical circular hole pattern, the tested 140 and 120mm fans showed an average reduction in noise levels of around 2dB(A) and an average increase in flow rate of around 4.4m³/h. While the results will vary between different fans models and applications depending on factors such as the exact shape and structure of the obstacle, fan speed and flow resistance, the improvements are significant in most cases.

Available in 14cm (NA-IS1-14 Sx2) and 12cm (NA-IS1-12 Sx2) sizes, the NA-IS1 are compatible with all current square-frame Noctua 120x25mm and 140x25mm models. Designed to replace the fans’ stock NA-AVP1 anti-vibration pads , the spacer frames are extremely straightforward to install: For case fan applications, either the supplied self-tapping screws or the included NA-AV3 anti-vibration mounts can be used to sandwich the spacer between the fan and the case panel. For radiator mounting, both M3 and UNC 6-32 screws are supplied. Each set includes two spacer frames plus the matching anti-vibration mounts, fan screws and radiator screws.

In sum, the NA-IS1 inlet spacers are a simple yet highly effective fine-tuning measure for suction type applications where a reduction of influx turbulence can lead to improved airflow and acoustics. The variants are a perfect match for black chromax or industrialPPC line fans.

In addition to the NA-IS1 inlet spacers, Noctua also introduced the new NA-AVG2 anti-vibration gasket for using 140mm fans on water cooling radiators or other applications that benefit from a tighter seal with the fan. Like the NA-AVG1 for 120mm fans, the NA-AVG2 is made from extra soft yet highly tear-proof silicone rubber and helps to dampen minute vibrations as well as to reduce air loss between the fan and the radiator. As such, it is an ideal accessory for performance enthusiasts who want to squeeze out those extra few percent of cooling efficiency. The NA-SAVG2 set contains three NA-AVG2 gaskets.

Lian Li UNI FAN SL120 V2 and SL140 V2 offer daisy-chaining for two clusters

2 months ago
Lian Li shows its UNI FAN SL120 V2 and SL140 V2 case fans, these second-generation models have a new connector that allows you to daisy chain two clusters to a single hub port. This means you can now daisy chain a total of six UNI FAN products. Furthermore, Lian Li also worked on improving the airflow performance and enhancing the RGB LED illumination.

There are 120mm single pack that will set you back $26.99 and is available in black and white color options. It's also available in a triple pack (with a controller) for $89.99. The 140mm fan is exclusively offered in a single pack that costs $29.99.

The 120mm variant spins at up to 2000RPM, it has a max airflow of 64.5CFM, a max air pressure of 2.59 mmH2O, and a max noise level of 29.2dBA. The 140mm edition spins at up to 1600RPM, it pushes up to 77.6CFM of air, with a max pressure of 2.09 mmH2O, and a noise level of up to 29dBA. Both fans use fluid dynamic bearing.

SL120 V2 and SL140 V2
LIAN LI Industrial Co. Ltd., a leading manufacturer of chassis and PC accessories, announces the newly improved UNI FAN SL120 V2 and SL140 V2, both available in black and in white. The new UNI FAN SL V2 now offers the ability to daisy chain up to two clusters to a single hub port. With a 28mm thick frame, the SL120 V2 brings a 10% increase in airflow performance when compared to the V1. Additional updates to the V2 includes a single power module cable that sits flush with the fan frame as well as a removable interlocking key for improved compatibility with radiator fittings. The UNI FAN SL V2 also comes with a few updates to the L-Connect 3 software such as new merging lighting effects and the ability to control fan speed profiles with real-time RPM values. The UNI FAN SL120 V2 and SL140 V2 are available in single packs, with the SL120 V2 also available in a triple pack including the controller.

Better & Fewer Cables
The UNI FAN SL V2 can daisy chain up to 6 fans in 2 clusters to a single hub port, thanks to a new bridging cable included in the 3-pack. The new daisy-chaining solution reduces the number of cables needed to power 2 clusters and enables new lighting effects to be continuous between the two bridged clusters. In addition, the connection between the cluster and the controller is now a single slim cable that combines PWM and ARGB signal power. The same cable features a redesigned connector at the fan frame with a header that sits within the fan to create a seamless and flexible connection for the best aesthetic possible.

Improved Performance
The UNI FAN SL120 V2 features a thicker 28mm frame resulting in a 10% increase in airflow performance when compared to the SL120 V1. With speeds ranging from 0, 250 to 2000 RPM, the SL V2 can achieve 2.59 mmH2O of static pressure and 64.5 CFM of airflow at low noise levels of 29.2 dBA max. With the SL140 V2, users can achieve speeds of 0, 250-1600 RPM with a static pressure of 2.09 mmH2O, an airflow of 77.6 CFM, and noise levels of 29 dBA max.

L-Connect 3 Improvements
The UNI FAN SL V2 comes with a few improvements to L-Connect 3. Starting with the SL V2 page, 4 new lighting effects and 5 new merge-lighting effects are available. On the setting page, users have the ability to configure their merged clusters. From there, they can select the number of fans bridged together, rename the clusters and re-arrange the order for the new merging light effects to look continuous in the computer case. Lastly, on the Fan/Pump Profile page, the fan curve diagram has been modified to set values in real-time RPM speed instead of percentage for a more intuitive fan speed profile.



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