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Corsair adds the wireless DARK CORE RGB PRO gaming mouse - including model with Qi April 07, 2020 - 15:44
Intel Core i7-1185G7 performance details leak - Xe graphics look good April 07, 2020 - 15:16
Rumor: AMD Zen 3 design to offer 10-15 percent IPC uplift April 07, 2020 - 15:01
PlayStation 5 vs Xbox Series X - why teraflops is misleading April 07, 2020 - 14:48
SteelSeries buys Nahimic - maker of 3D sound software April 07, 2020 - 14:03
SMIC expects to offer initial 7nm-class production by Q4 2020 April 07, 2020 - 13:44
Intel Comet Lake-S announcement on April 30 but product availability is May 27 April 07, 2020 - 13:24
Microsoft Edge is now the second-most used browser April 06, 2020 - 14:48
All Intel-based ASUS ROG laptops get liquid metal compound April 06, 2020 - 14:38
Samsung 3nm rollout delayed by coronavirus April 06, 2020 - 14:22
Firefox gets update for two zero-day vulnerabilities April 06, 2020 - 14:18
Intel Comet Lake-S marketing materials leak, launch on April 30 April 06, 2020 - 14:15
Tesla shows how it makes medical ventilators April 06, 2020 - 14:08
AMD discontinues StoreMI but promises successor April 06, 2020 - 14:00
Reimagined E3 event planned for June 2021 April 06, 2020 - 13:41
ThermalTake CyberChair E500 starts shipping April 06, 2020 - 13:32
Inno3D ships two GeForce GTX 1650 cards with GDDR6 April 03, 2020 - 15:53
Amazon preps its own cloud gaming service - Project Tempo April 03, 2020 - 14:13
SK Hynix talks about DDR5 benefits, production to start at 4800MHz April 03, 2020 - 14:03
Wi-Fi 6E promises very-low latency and higher throughput thanks to big spectrum increase April 03, 2020 - 11:49

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CORSAIR Dark Core RGB Pro Wireless FPS/MOBA Gaming Mouse April 07, 2020 - 23:06
Corsair Dark Core RGB Pro Wireless Gaming Mouse April 07, 2020 - 20:43
Corsair A500 Dual Fan CPU Cooler April 07, 2020 - 19:41
Dell XPS 13 (2020): Laptop Excellence Refined April 07, 2020 - 19:41
Corsair Dark Core RGB Pro April 07, 2020 - 18:38
Corsair Dark Core RGB Pro Wireless Optical Mouse April 07, 2020 - 18:37
CORSAIR DARK CORE RGB PRO SE Wireless FPS/MOBA Gaming Mouse April 07, 2020 - 15:17
Corsair DARK CORE RGB PRO SE Wireless FPS/MOBA Gaming Mouse April 07, 2020 - 15:05
Corsair Dark Core RGB Pro Mouse & MM500 April 07, 2020 - 15:05
Corsair Dark Core RGB Pro April 07, 2020 - 15:02
Corsair Dark Core RGB Pro Gaming Mouse April 07, 2020 - 15:02
DOOM Eternal April 07, 2020 - 09:04
Corsair HydroX Custom Liquid Cooling April 07, 2020 - 09:04
Proscenic M7 Pro Robot Vacuum Bundle April 06, 2020 - 20:35
ADATA SE760 Portable SSD 1 TB Review April 06, 2020 - 20:05
Antlion Audio ModMic Wireless Attachable Microphone April 06, 2020 - 15:56
Ghost Recon Breakpoint DX11 vs Vulkan Performance April 06, 2020 - 15:28
Thermaltake A700 TG Full Tower Case April 06, 2020 - 14:07
Kingston DC1000B 480GB SSD April 06, 2020 - 12:27
Looking At The LVI Mitigation Impact On Intel Cascade Lake Refresh April 05, 2020 - 18:33

Posted on Tuesday, April 07 2020 @ 15:44:48 CEST by Thomas De Maesschalck
Fans of wireless gaming mice have another option as Corsair has added the DARK CORE RGB PRO series to its portfolio. Priced at $79.99 for the regular DARK CORE RGB PRO and $89.99 for the DARK CORE RGB PRO SE, these mice offer a custom PixArt PAW3392 sensor with 18k DPI resolution. The difference between the two models is that the SE has Qi wireless charging support.
CORSAIR®, a world leader in high-performance gaming peripherals and enthusiast components, today announced the launch of the new DARK CORE RGB PRO and DARK CORE RGB PRO SE, its new premier wireless mice. Utilizing CORSAIR SLIPSTREAM WIRELESS, hyper-polling technology, and an 18,000 DPI optical sensor, these new mice offer bleeding-edge wireless mouse performance with both wired and wireless charging options.

The CORSAIR DARK CORE RGB PRO makes several key updates to the award-winning DARK CORE RGB, while retaining the same shape and comfort that has made it a fast-growing choice among gamers of all kinds. The DARK CORE RGB PRO now features the ability to connect in three different ways: sub-1ms SLIPSTREAM WIRELESS, low-latency Bluetooth®, or USB wired. The optical sensor has also been upgraded to a custom PixArt PAW3392 optimized for wireless, with extremely low power consumption and a native 18,000 DPI resolution customizable in 1 DPI steps. New hyper-polling technology from CORSAIR, debuting in the DARK CORE RGB PRO, ensures blazingly fast response times by communicating with a PC at up to 2,000Hz – twice the speed of standard gaming mice and able to deliver the full performance benefits of SLIPSTREAM WIRELESS, for better-than-wired latency.

The DARK CORE RGB PRO boasts nine zones of RGB lighting, the most ever for a CORSAIR mouse, including an eye-catching integrated light bar with four individually addressable LEDs. CORSAIR iCUE software harnesses both the performance and the customization of DARK CORE RGB PRO, with full RGB lighting customization and synchronization with other iCUE devices, as well as button remaps and advanced macro programming for the mouse’s eight buttons.

The DARK CORE RGB PRO retains the comfortable contoured shape of its predecessor, including two interchangeable side grips, and charges via a reversible USB-C cable. The DARK CORE RGB PRO SE adds another level of charging technology with the inclusion of Qi wireless charging, for effortless use with Qi-compatible devices such as the CORSAIR MM1000 mouse pad. With up to 50 hours of battery life between recharges, durable Omron switches rated for 50 million clicks, and onboard storage to save up to three lighting and macro profiles, the DARK CORE RGB is the most advanced wireless gaming mouse that CORSAIR has ever produced.
DARK CORE RGB PRO Wireless Gaming Mouse

Posted on Tuesday, April 07 2020 @ 15:16:03 CEST by Thomas De Maesschalck
INTC logo
The Intel Core i7-1185G7 popped up in the 3DMark Time Spy database. This 11th Gen Core quad-core processor is a 10nm Tiger Lake-U laptop processor based on the Willow Cove design. It has integrated Xe graphics and early engineering samples are running at 3.0GHz. WCCF Tech summarizes the performance over here and concludes that the integrated Xe graphics are faster than the integrated graphics of the Ryzen 7 4800U as per AMD's official claims. CPU performance on the other hand isn't as good.
In the graphics benchmark, the chip scored around 1296 points which are around 5-6% faster than the Ryzen 7 4800U scores as per AMD's official claims. The CPU side, however, takes a major hit with a lackluster score of 2922 points only but that is to be expected from a quad-core chip that features a locked 3 GHz frequency. We have seen other samples with much higher frequencies of 4.30 GHz and faster 3DMark Time Spy CPU scores so expect final performance with proper clocks to feature much better compute output.


Posted on Tuesday, April 07 2020 @ 15:01:56 CEST by Thomas De Maesschalck
AMD logo
AdoredTV offers some fresh rumors about AMD's future Zen 3 design, which will be used by the Ryzen 4000 series desktop CPUs. Before we get into the meaty details, the site offers some clarification about stuff that was already known. First up, AdoredTV has been able to confirm that Zen 3 will be based on an eight-core CCX design, with increased boost clocks and lower power draw that will be offset by new features (like new instructions). The site also heard from its sources that Zen 3 sticks with two threads per physical core, and not the SMT4 that was rumored last year. This was all pretty much known, so nothing new here.

The fresh information is that Zen 3 reportedly delivers a 10-15 percent IPC gain on a single thread, which is about on par with the IPC increase of Zen 2. That's a bit lower than what earlier rumors suggested. A large part of the IPC increase originates from a reworked front end.

Zen 3 will get double the L3 cache per CCX, but total L3 cache remains the same as each compute die now has only one CCX instead o two:
Additionally, Zen 3 will double the L3 cache per CCX, but since there is now only 1 CCX per compute die instead of 2, the level of L3 cache remains the same at 32 MB. Unfortunately, there will be no 48 MB or 64 MB L3 caches with Zen 3, which I’m sure is disappointing for some. L3 cache latency has slightly increased, presumably due to the CCX redesign but this is offset by the fact that cores now have equal access to all the L3 cache on the same die; no more spikes in latency from grabbing data off of another CCX. This will make the performance more consistent, a problem that Zen 2 mostly fixed but not entirely.
AMD has A0 engineering samples of the "Milan" EPYC server processor but these are still in early testing phases. The site heard that current samples do not have working SMT. B0 samples are expected around September and an actual product launch will probably be late 2020 or early 2021. As always, take these rumors with a grain of salt.

Last but not least, AdoredTV claims Zen 4 will likely be a 5nm part with more cores, a new socket, 1MB L2, AVX-512 support, and further IPC gains. Nothing really groundbreaking here.


Posted on Tuesday, April 07 2020 @ 14:48:48 CEST by Thomas De Maesschalck
Not a whole lot of news today so lets take a look at what ExtremeTech has to say about the next generation of consoles over here. The site notes it's hard to compare the performance of the PlayStation 5 and the Xbox Series X based on teraflops figures, as these don't capture the full performance tale.
Right now, it looks as if the Xbox Series X brings more graphics firepower to the table than the PlayStation 5. There are a number of additional factors that could still influence how the two consoles compare with each other, including aspects that have nothing to do with hardware, like whether Microsoft or Sony offers better dev tools and support. But as to the value of FLOPS as a metric for comparing console performance? Even in the best case, it isn’t great.


Posted on Tuesday, April 07 2020 @ 14:03:15 CEST by Thomas De Maesschalck
SteelSeries logo
SteelSeries announced a new acquisition. The gaming peripheral maker bought Nahimic, the creator of A-Volute, a popular 3D sound tool that's used on various gaming laptops:
SteelSeries, the leader in gaming and esports peripherals, today announces its acquisition of A-Volute, the leading independent developer of 3D sound solutions for gaming. The acquisition of A-Volute will continue to bolster SteelSeries’ reputation of industry-leading gaming audio performance across both hardware and software.

For nearly two decades, SteelSeries has been a frontrunner in the gaming industry, offering high-quality gaming peripherals to pro and enthusiast gamers. Its SteelSeries Engine software platform has millions of daily users and is integrated with games and applications. Over the years, the company has built a strong brand and has leveraged this to outpace category growth globally. The award-winning Arctis line of gaming headsets redefined the category as is the new standard in excellence in gaming audio hardware.

A-Volute is the leading independent gaming audio software developer with more than 150 man-years of research and development, and more than twenty dedicated audio, DSP, driver and software engineers based across France, Singapore and Taiwan.

A-Volute’s software development roadmap includes unique and relevant features that fit strongly with SteelSeries’ current and envisaged offering for its SteelSeries Engine platform. Acquiring A-Volute’s talented engineering team will significantly accelerate SteelSeries’ vision for its gaming software platform. Additionally, A-Volute’s existing customer base, including leading gaming laptop manufacturers, is a strong testament to the quality of their current solutions.

“With our award-winning innovations that have redefined the gaming audio experience, and our best-in-class SteelSeries Engine software, bringing A-Volute into the SteelSeries family seemed like a natural fit and we are extremely excited about partnering with Tuyen and his team,” said Ehtisham Rabbani, CEO of SteelSeries. “With their excellence in audio software, they’ll help us improve gamers’ audio experiences even further.”

“We are incredibly excited to be joining the SteelSeries team,” said Tuyen Pham, CEO of A-Volute. “Our focus has always been to create outstanding audio experiences, and we could not think of a better partner than SteelSeries.”

“SteelSeries’ acquisition of A-Volute will add even more tools to its arsenal to continue to lead the way in gaming audio,” said Lars Cordt, Partner at Axcel, SteelSeries’ controlling shareholder. “A-Volute’s team have done an excellent job in creating new tools to enhance audio, and we see them adding tremendous value to SteelSeries’ software efforts moving forward.”

A-Volute is a private company being acquired by SteelSeries ApS. The parties have agreed not to disclose any financial terms. The transaction is expected to close later in the spring. On this transaction, A-Volute has been advised by LPA-Law and Inflexion Points Technology Partners SAS.


Posted on Tuesday, April 07 2020 @ 13:44:56 CEST by Thomas De Maesschalck
China's biggest semiconductor foundry expects it will be able to offer its 7nm-class N+1 process for small scale production in Q4 2020. According to the Chinese chip foundry, its 7nm N+1 node will have 20 percent higher performance, 57 percent lower power consumption, a 63 percent reduction in logic area, an a 55 percent reduction in SoC area versus its 14nm FinFET process.
[SMIC co-CEO] Dr. Liang confirmed that the N+1 7 nm node and its immediate successor will not use EUV lithography. N+1 will receive a refinement in the form of N+2, with modest chip power consumption improvement goals compared to N+1. This is similar to SMIC's 12 nm FinFET node being a refinement of its 14 nm FinFET node. Later down its lifecycle, once the company has got a handle of its EUV lithography equipment, N+2 could receive various photomasks, including a switch to EUV at scale.
SMIC introduced its 14nm process in 2019. We don't know exactly how SMIC's 7nm node compares to what's offered by TSMC, world's largest foundry. SMIC is still behind its larger rivals but seems to be closing the gap.

Via: TPU

Posted on Tuesday, April 07 2020 @ 13:24:54 CEST by Thomas De Maesschalck
Intel logo
Recently, we've heard April 30 several times as the launch date for Intel's Comet Lake-S desktop processors. However, it appears that this is nothing more than a paperlaunch. Intel is expected to make a formal announcement on April 30 but WCCF Tech says the review embargo date and the actual product availability date is May 27th.

So you can expect some marketing talk and specifications on April 30 but independent performance tests aren't going to happen before late May.
The actual retail launch and product shipments would commence from 27th May at 13:00 GMT. It's the same time when you will also get to read reviews on the new launches. With the launch set for the end of May which essentially lands close to mid-2020, the question arises that how long of a shelve life would Comet Lake-S CPUs as recent rumors have suggested its immediate successor, the 11th Gen Rocket Lake-S family is expected to launch later this year. This would mean that we are looking at less than 6 months before which Comet Lake-S CPUs would be replaced by a lineup that is better than it.


Posted on Monday, April 06 2020 @ 14:48:08 CEST by Thomas De Maesschalck
MSFT logo
Things are changing again in the browser market as Microsoft's Edge is now the second-most used browser. Since the rollout of the Chromium-based version of Edge, many complaints have vanished and this has resulted in an uptick in use.

The latest browser market statistics from NetMarketShare reveal Firefox now ranks third with 7.19 percent marketshare, down from 9.27 percent a year ago. Microsoft's Edge on the other hand finished March with 7.59 percent marketshare, up from 5.20 percent a year ago. Chrome remains the dominant force though, Google's browser is used by 68.50 percent of the market.

Edge bests Firefox

Via: BleepingComputer

Posted on Monday, April 06 2020 @ 14:38:22 CEST by Thomas De Maesschalck
ASUS announces that its full 2020 lineup of ROG gaming laptops with 10th Gen Intel Core processors will feature liquid metal compound. The company says this new production process is the result of more than a year of development. Previously, liquid metal was primarily used by overclockers and enthusiasts. ASUS has been able to figure out a way to make liquid metal compound suitable for mass production. You can read the full story at the ROG blog.
Liquid metals have low melting points that render them fluid at room temperature. These alloys are highly conductive, so they’re extremely effective at transferring thermal energy between surfaces like a processor die and heatsink. The benefits are well-established in overclocking and DIY circles, and internal testing reinforced the appeal for gaming laptops. Our engineers observed a 10~20°C reduction in temperatures depending on the CPU.

The improved thermal interface creates margin that can be used in different ways. Lower temperatures help processors sustain higher clock speeds for longer, and also prevent fans from ramping up to louder RPMs. The additional thermal headroom can also be used to reach even faster frequencies and higher performance.
The piece explains the company is still working on a way to use it for AMD-based systems. ASUS says Intel processors are better suited for its current production process because they have a small die that's surrounded by a safe zone on the CPU package that's free of surface-mounted components. AMD processors on the other hand have surface-mounted circuitry that's prone to shorting upon accidental contact with the liquid metal compound. ASUS is trying to use new insulation techniques to overcome this issue.


Posted on Monday, April 06 2020 @ 14:22:05 CEST by Thomas De Maesschalck
Samsung logo
The coronavirus pandemic will have an impact on Samsung's 3nm rollout, according to a new report by DigiTimes. The site picked up word that Samsung's plan to enter 3nm volume production in 2021 is unlikely to materialize due to delays in shipments of EUV and other critical production equipment. As such, 2022 is now a more realistic timetable.
Samsung unlikely to move 3nm to volume production until 2022: Samsung Foundry, the foundry operations of Samsung Electronics, has set its goal of moving its advanced 3nm process technology to volume production as early as 2021. But the Korean firm will probably have to reschedule it to 2022, as the coronavirus pandemic's impacts on logistics and transportation services are causing delays to deliveries of EUV and other critical production equipment, according to industry sources.





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