Posted on Wednesday, October 21 2020 @ 18:49:32 CEST by Thomas De Maesschalck
Neowin reports Microsoft and various cybersecurity and telecom firms managed to disable close to 94 percent of the Trickbot botnet. In a blog post, the software giant this is an ongoing operation with continued action being taken from both sides.
In a blog post, Microsoft has claimed that as of October 18, it has eliminated 94% of Trickbot's critical operational infrastructure since it began its operation a few days ago. Out of 69 major Trickbot servers identified, 62 have already been taken down and the malicious actors operating this botnet have been struggling to add new infrastructure. Microsoft stated that these criminals set up 59 new servers and that the company has disabled all of them, bringing the eliminated servers tally to 120 out of 128.
Posted on Wednesday, October 21 2020 @ 18:46:39 CEST by Thomas De Maesschalck
German tech writer Igor Wallossek claims one of the fastest Big Navi cards from AMD's partners will feature a Boost clockspeed of up to 2577MHz.
According to Igor Wallossek from Igor’sLAB, a ‘very special board partner’ graphics card based on Navi 21 GPU will feature a boost clock of 2577 MHz. Now, before we all get too excited, Igor did not mention which SKU this is (XTX, XT or XL). He did say that this is a boost clock, meaning this is not the ‘actual’ clock speed of the graphics card. This Radeon RX 6000 model will likely stay at 2.3-2.4 clocks, where AMD’s ‘gaming clock’ is more representative of what may be seen during gameplay.
Three models are expected to be announced one week from now, at AMD's October 28th virtual event. This includes the Radeon RX 6900XT, RX 6800XT, and RX 6800. The RX 6900 XT is said to be an AMD-exclusive card, at least at first.
Posted on Wednesday, October 21 2020 @ 12:46:57 CEST by Thomas De Maesschalck
As we get nearer to the October 28 reveal of AMD's Radeon RX 6000 series, more and more details are leaking to the web. Today there's an overview of the latest rumors at VideoCardz. AMD has reportedly seeded its add-in board partners with working drivers, final SKU names, and other critical stuff earlier this week. One week from now, AMD will introduce the Radeon RX 6900 XT, RX 6800 XT, and RX 6800. Here's an overview of what to expect:
AMD Radeon RX 6900 XT – Navi 21 XTX
This will be the fastest Big Navi model. It will feature 80 CUs, good for 5120 stream processors. The GPU has a 256-bit memory bus and will be paired with 16GB GDDR6 memory. Rumored clockspeeds include a 2040MHz Game clock and 2330MHz Boost.
One caveat is that this will be an AMD exclusive, at least for now. Quantity is said to be limited.
AMD Radeon RX 6800 XT – Navi 21 XT
One step down we have the Radeon RX 6800 XT, a model with 72 CUs and 4608 stream processors. It has a 256-bit bus with 16GB GDDR6 memory and the reference GPU clockspeeds are said to be 2015MHz for the Game clock, with a Boost of under 2250MHz.
AMD Radeon RX 6800 – Navi 21 XL
A further cut-down version of Navi 21 is the Radeon RX 6800. This variant packs 64 CUs, good for 4096 stream processors, and has the same 256-bit memory bus with 16GB GDDR6 memory. Expect a Game clock of 1815MHz and a Boost of 2105MHz.
AMD Radeon RX 6700 XT and 6700 – Navi 22 is for 2021
AMD's Radeon RX 6700 series is based on Navi 22, the company reportedly pulled the launch forward but you still shouldn't expect them anytime soon. The current launch schedule is reportedly January 2021. The Radeon RX 6700 XT is said to have a full Navi 22 GPU with 40 CUs and 2560 stream processors, coupled with a 192-bit memory bus and 12GB GDDR6.
Posted on Wednesday, October 21 2020 @ 12:13:03 CEST by Thomas De Maesschalck
AMD has rolled out version 22.214.171.1248 of its Ryzen Chipset driver. A lot of folks rarely update these drivers so if you have a Ryzen chip it may be worth to head over to the AMD site to download this release. This release has bug fixes for the PCI device driver, new program support for the Ryzen Power Plan, and clock frequency tuning for the I2C driver.
Few drivers updated.
Installer may fail to launch if executed from a folder name with non-Latin character.
Installer may not downgrade to older version.
Installer may fail to install on Windows® 10 with Russian language pack installed.
Installer may fail to uninstall from Apps and features with Singapore Chinese language pack installed.
Manual system restart required on Non-English OS after installation is completed.
Windows Installer pop-up message may appear during install.
Uninstallation log may not be generated in silent mode.
Posted on Wednesday, October 21 2020 @ 11:53:46 CEST by Thomas De Maesschalck
NVIDIA has been catching a lot of heat recently for the poor availability of its GeForce RTX 30 series video cards. Any available supply sold out instantaneously on launch day and it's still hard to get a card. It seems AMD is afraid of a similar PR fiasco as the company has reportedly issued a document with anti-scalper recommendations to its partners. VideoCardz has a copy over here.
The guidelines are not only for the Radeon RX 6000 series but also the Ryzen 5000 series CPUs.
Among other things, AMD recommends its partners to implement bot detection and management, as well as CAPTCHAs to ensure only real humans can place an order. Furthermore, AMD recommend to limit purchases at launch to one item per end-user and to manually process orders to ensure proper validation. AMD also asks to limit the number of sales made to commercial re-sellers during the 3 weeks after launch.
Posted on Wednesday, October 21 2020 @ 11:47:11 CEST by Thomas De Maesschalck
As expected, NVIDIA's $40 billion quest to acquire chip designer ARM will not go without problems. Bloomberg reports Chinese tech firms like Huawei have expressed strong concerns to local regulators about the deal. The news agency says multiple of China's most influential tech firms have urged the State Administration for Market Regulation to either flat out reject the takeover or to impose conditions to ensure access to the ARM architecture.
China’s fear is that Arm -- whose semiconductor designs and architecture are central to most of the world’s electronics from smartphones to supercomputers -- will become yet another pawn in a U.S.-Chinese struggle for tech supremacy. Nvidia is buying the British firm from Japan’s SoftBank Group Corp., bringing it under American jurisdiction and theoretically threatening its cherished status as a neutral party in the chip industry. SoftBank’s shares erased gains Wednesday to close slightly lower in Tokyo.
Posted on Wednesday, October 21 2020 @ 11:20:59 CEST by Thomas De Maesschalck
Intel has uploaded its Graphics Driver version 126.96.36.19953, you can find the download over here. This release adds support for Windows 10 October 2020 Update and has some game optimizations as well as bug fixes:
Battle endless hordes of demons as you seek to save humanity in Doom Eternal: The Ancient Gods – Part One, dive into the sea and battle your foes with powerful underwater ships in Aquanox: Deep Descent and experience remastered visuals, enhanced audio, new game modes and new civilizations in Age of Empires III: Definitive Edition on Iris Xe graphics or better!
Experience a gripping first-person horror adventure in Amnesia: Rebirth, gear up for the World of Warcraft: Shadowlands pre-patch, customize your hero and defend Novastraia against invaders in Torchlight III and Immerse yourself in the rich and dynamic world of RuneScape on Iris Plus graphics or better!
Playability Improvements for Halo: Combat Evolved Anniversary* and Ori and the Will of the Wisps on 11th Generation Intel® Core™ Processors with Iris Xe Graphics.
Super Wet Ink touch latency improvements when using pen in applications such as OneNote.
Intermittent crash or hang seen in Shadow of the Tomb Raider* (DX12) and Modern Combat 5* (during
loading) (Iris Xe Graphics).
Intermittent crash or hang seen in Red Dead Redemption 2* (Vulkan).
Minor graphic anomalies seen while playing Assassin’s Creed Odyssey.
System unable to output 8K resolution with MTC/DSC docks such as Dell Thunderbolt dock (Iris Xe Graphics).
System hang while plug/unplug monitor from MST hub (Iris Xe Graphics).
LG27UK850 Monitor intermittent black screen in second screen only mode via Type-C to DP (Iris Xe Graphics).
Possible garbage display issue seen on external monitor when three monitors plugged into Adicora-A dock
and one of the monitors is unplugged (Iris Xe Graphics).
Display momentarily off on external monitor when playing video on Movies & TV application in full screen (Iris
Possible garbage display issue seen while changing Overwatch game to Windowed mode (Iris Xe Graphics).
Graphical glitches observed while scrolling down in Edge (Chromium) browser (Iris Xe Graphics).
Before log-in screen on startup, momentary corruption observed with certain display adapter mode settings
(Iris Xe Graphics).
Stability fixes when connected to USB-C dock (Iris Xe Graphics).
Small black box corruption seen while moving cursor under different options in Sekiro: Shadows Die Twice on
Iris Plus graphics.
Driver installation via igxpin removes OpenCL entry from the registry.
Posted on Wednesday, October 21 2020 @ 11:16:30 CEST by Thomas De Maesschalck
Besides submerged datacenters, Microsoft is now also experimenting with mobile datacenters. In a new blog post, Microsoft outlines its new Azure Modular Datacenter (MDC). These transportable datacenters are intended for customers who require cloud computing in
hybrid or challenging environments, including remote areas. So what type of applications does MDC have? Microsoft suggests these datacenters could be used for mobile command centers, humanitarian assistance, military mission needs, mineral exploration, etc.
With MDC you can deploy a self-contained datacenter unit with a field transportable solution that provides near-immediate value. The unit can operate in a wide range of climates and harsh conditions in a ruggedized, radio frequency (RF) shielded unit. Once deployed it can act as critical infrastructure where temperature, humidity, and even level surfaces can pose a challenge.
MDC can provide onsite augmentation of compute and storage capabilities, managing and operating high-performance applications in the field, IoT and real-time analytics workloads that require ultra-low latency, and standing up cloud applications to support critical infrastructure recovery.
Posted on Wednesday, October 21 2020 @ 11:12:07 CEST by Thomas De Maesschalck
Microsoft announces the availability of Windows 10 October 2020 Update. The rollout has started and your PC will likely receive it over the next couple of weeks (or months). Alternatively, if you're very brave, you can force the update via the Settings > Update & Security > Windows Update menu in Windows 10.
It's a relatively minor update, a list of the main changes can be found at the Windows Blog. Among other things, there's new Edge stuff like an integration of web tabs in Alt + Tab. The Start Menu and the Taskbar have also been refreshed with a more streamlined, less colorful design.
A refreshing Start. The Start menu has a more streamlined design. A uniform, partially transparent background to the tiles creates a beautiful stage for the redesigned app icons like Calculator, Mail and Calendar. This refined Start design looks great in both dark and light themes, but if you’re looking for a splash of color, first make sure to turn on Windows dark theme and then toggle “Show accent color on the following surfaces” for “Start, taskbar, and action center” under Settings > Personalization > Color to elegantly apply your accent color to the Start frame and tiles.
Posted on Wednesday, October 21 2020 @ 11:06:18 CEST by Thomas De Maesschalck
Micron announced the creation of world's first multi-chip module that combines universal flash storage (UFS) multichip with LPDDR5 memory. This smartphone module will be offered in several configurations, the largest one being 256GB flash + 12GB LPDDR5.
Micron Technology, Inc. (Nasdaq: MU), today announced the launch of uMCP5, the industry’s first universal flash storage (UFS) multichip package with low-power DDR5 (LPDDR5) DRAM. Now ready for mass production, Micron’s uMCP5 combines high-performance, high-density and low-power memory and storage in one compact package, equipping smartphones to handle data-intensive 5G workloads with dramatically increased speed and power efficiency. The multichip package uses Micron’s LPDDR5 memory, high-reliability NAND and leading-edge UFS 3.1 controller to power advanced mobile features previously only seen in costly flagship devices using discrete products, such as stand-alone memory and storage. Now available on other high-end phones, these emerging technologies — such as image recognition, advanced artificial intelligence (AI), multicamera support, augmented reality (AR) and high-resolution displays — are becoming accessible to more consumers.
“Moving 5G’s potential from hype to reality will require smartphones that can support the immense volumes of data flowing through the network and next-gen applications,” said Raj Talluri, senior vice president and general manager of Micron’s Mobile Business Unit. “Our uMCP5 combines the fastest memory and storage in a single package, unleashing new possibilities for 5G’s disruptive, data-rich technologies right at consumers’ fingertips.”
Micron uMCP5 brings unparalleled speed and efficiency to the 5G ecosystem
This launch builds on Micron’s March announcement of its sampling of uMCP5 and sets a new standard for the mobile market as the first multichip package to use the latest generations of UFS NAND storage and low-power DRAM. The vast volumes of data that smartphones must store and process today are pushing memory bandwidth to its limits with LPDDR4-based midtier chipsets. The result is lowered video resolution, frustrating lags and limited features.
With LPDDR5, Micron has significantly increased memory bandwidth from 3,733 to 6,400 megabits per second (Mb/s), enabling seamless, instant experiences for mobile users, even when using data-heavy features.
“5G provides smartphones with unprecedented multigigabit speeds to connect with the cloud,” said Ziad Asghar, vice president of product management at Qualcomm Technologies, Inc. “We're excited that uMCP5 is now available, bringing memory on par with 5G speeds to a new generation of phones and enabling best-in-class gaming, differentiated camera and AI experiences, and ultrafast file transfers.”
Designed specifically for next-generation 5G devices, uMCP5 can easily and quickly process and store massive amounts of data without compromising performance or power usage. High-performance memory and storage capabilities provide uMCP5 with the ability to fully support 5G download speeds and more applications running at once.
Micron uMCP5 features include:
Dramatically extended battery life: Building on its success with uMCP4, Micron taps LPDDR5 memory for uMCP5 to enable complete utilization of 5G networks, providing a nearly 20% power efficiency boost compared to LPDDR4. In addition, Micron’s UFS 3.1 consumes about 40% less power than Micron’s UFS 2.1 predecessor. For smartphone users, this means extended battery life — even when consuming power-draining multimedia applications or data-intensive features such as AI, AR, image recognition, gaming, immersive entertainment and more.
Fast download speeds: Unlocking the full potential of 5G performance, Micron’s uMCP5 provides users with 20% faster sustained download speeds, as compared to Micron’s previous UFS 2.1-based solutions.
Boosted endurance: Micron’s uMCP5 NAND boasts an improved endurance by around 66% to 5,000 program/erase cycles, exponentially increasing the cycles and volume of data that devices can program and erase without degrading device performance — extending a smartphone’s life span even for the heaviest of users.
Industry-leading bandwidth: Devices with uMCP5 will support a maximum DRAM bandwidth of up to 6,400 Mb/s, a 50% increase compared to the previous LPDDR4x generation, which runs at a bandwidth of 4,266 Mb/s. This allows mobile users to multitask on many applications without diminishing experience. The increased bandwidth also enables higher-quality image processing for AI-powered computational photography in smartphones, putting professional photography capabilities in users’ hands. Micron is the first vendor in the industry to support full-speed LPDDR5.
Latest flash performance: Micron’s uMCP5 also draws on the fastest UFS 3.1-based storage interface, providing twice the sequential read performance and 20% faster write speeds compared to Micron’s previous generation of UFS 2.1 products.
Tight, space-saving design: Micron designed uMCP5 in the most compact form factor possible, using its multichip package expertise and known manufacturing and packaging techniques — enabling slimmer, more agile smartphone designs. Devices using Micron’s package can save 55% of printed circuit board space compared to discrete solutions, meaning stand-alone versions of LPDDR5 and UFS. This space savings enables phone manufacturers to maximize battery size or add features, such as cameras, gesture devices or sensors. Micron offers a broad range of capacity configurations up to 12 gigabytes (GB) of LPDDR5 and 512 GB NAND.
Availability of Micron uMCP5
Now ready for mass production, uMCP5 is available in four distinct density configurations: 128+8 GB, 128+12 GB, 256+8 GB and 256+12 GB.