Late last year OCZ developed what they called XTC (Xtreme Thermal Convection). Put simply this honeycomb like heatspreader was design to more effectively disperse the heat. Although at first the design appears to make no sense it is actually quite ingenious. The honeycomb vents or holes allow for greater air-flow through and over the heatspreaders. Conventional heatspreaders create large air pockets between the memory modules, trapping the hot air within. The XTC heatspreaders allow air to flow over and between the memory chips.



Link: Legion Hardware