The jet intakes into each cup were tweaked to more evenly balance the jet flow distribution to more accurately match the bulk heat load distribution patterns under the jetted area - which as a byproduct also lowered the block's pressure drop while improving performance. The cupped area was carefully "ported" to further lower the block's pressure drop without impacting cooling performance. The thickness of the silver material between the CPU die and the cupped area was altered to take better advantage of the silver's higher thermal conductivity over copper.



Link: Procooling