OCZ has taken a new approach at lowering noise and improving cooling capacity. Borrowing a page from CPU and GPU cooling solutions, we now have heatpipe technology being used on memory modules. The principal is the same as other heatpipe coolers - heat is transferred from the base of the cooler (in this case, the memory modules) to the upper deck of aluminum fins via the copper heatpipes on either side of the module. Heatpipe technology has worked wonders for CPU coolers, but is it really functional and even necessary for memory modules? What are the pros and cons of such a system?



Link: OCIA