"This is a project I have been thinking about and working on, on and off, for many months. It started back when I first heard about the Innovation Cooling Graphite Thermal Pad, which can be described as a solid-state TIM. Something I have no issue admitting to is I do not particularly like working with thermal paste, as it can be messy and because I want to make sure I apply enough and in the correct places. (That last point is probably more important when you are working with a Threadripper-size CPU that also uses multiple dies.) Thus, the idea of a solid and therefore dry material you can place between the processor and cooler is very attractive to me."



Link: OCC