Posted on Thursday, December 09 2010 @ 14:19 CET by Thomas De Maesschalck
Intel confirmed rumors that its new R&D wafer fab in Hillsboro, Oregon is "450nm ready". This means the fab will be constructed to support 450mm tools if or when these machines are ready.
Intel confirmed Tuesday (Dec. 7) that D1X is being readied for 450-mm. ''Intel is very interested in 450-mm,'' said Mark Bohr, Intel Senior Fellow and director of process architecture and integration at Intel. ''D1X is being (constructed) to be compatible with 450-mm.''
The fab tool community is also warming up to 450-mm. At one time, they did not want to devise 450-mm tools, because the cost is too high.
Now, there is a different story in the market. "I sense that some of the equipment vendors are interested in 450-mm,'' he said.
More details
at EE Times.
