DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
 
DarkVision Hardware - Daily tech news
November 18, 2018 
Main Menu
Home
Info
News archives
Articles
Howto
Reviews
 

Who's Online
There are currently 164 people online.

 

Latest Reviews
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller
 

Follow us
RSS
 

TSMC joins ASML co-investment program

Posted on Monday, August 06 2012 @ 20:55:00 CEST by


DigiTimes reports TSMC will join ASML's co-investment program to spur development of EUV and 450mm wafer technology.
TSMC on August 5 announced that the firm has joined ASML's customer co-investment program, aimed at accelerating the development and industrialization of key next-generation semiconductor manufacturing technologies which include extreme ultraviolet (EUV) lithography and 450mm tools.

The agreement includes an investment amount of EUR838 million (US$1.04 billion) in ASML to acquire 5% of its equity; and to commit EUR276 million to ASML's R&D funding for the next five years, according to TSMC.

Intel was the first participant in ASML's customer co-investment program, having committed to acquire a stake of as much as 15% in the fab tool supplier, according to ASML's July 9 release.




 



 

DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2018 DM Media Group bvba