Posted on Monday, August 06 2012 @ 20:55 CEST by Thomas De Maesschalck
DigiTimes
reports TSMC will join ASML's co-investment program to spur development of EUV and 450mm wafer technology.
TSMC on August 5 announced that the firm has joined ASML's customer co-investment program, aimed at accelerating the development and industrialization of key next-generation semiconductor manufacturing technologies which include extreme ultraviolet (EUV) lithography and 450mm tools.
The agreement includes an investment amount of EUR838 million (US$1.04 billion) in ASML to acquire 5% of its equity; and to commit EUR276 million to ASML's R&D funding for the next five years, according to TSMC.
Intel was the first participant in ASML's customer co-investment program, having committed to acquire a stake of as much as 15% in the fab tool supplier, according to ASML's July 9 release.
