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UMC tapes out its first 14nm test chip

Posted on Wednesday, June 24 2015 @ 18:42:47 CEST by


UMC logo
Chip foundry UMC announced it has successfully taped out its first 14nm test chip and expects the process will be ready for customer tape outs towards the end of the year.
United Microelectronics Corporation (NYSE:UMC;TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced it has collaborated with ARM to tape out a process qualification vehicle (PQV) test chip on UMC's 14nm FinFET technology to help validate an ARM Cortex-A family core on the advanced foundry process node. The 14nm cooperation expands on the two companies' successful effort to develop and offer ARM ArtisanĀ® Physical IP on UMC's volume production 28nm High-K/Metal Gate process.

The validation of the UMC 14nm FinFET process technology kickstarts the enablement process for the rest of IP ecosystem needed for UMC's FinFET technology, including the need for foundation IP and ARM processor physical design.

"ARM and UMC share a long history of successful collaboration through multiple technology generations," said Will Abbey, general manager, physical design group, ARM. "We are highly encouraged by the test chip tape-out of a Cortex-A family core using UMC's 14nm FinFet process. ARM will continue its close partnership with UMC during the development of this advanced process node."

"As UMC prepares to make available our 14nm FinFET process to customers, it is important that we build a strong design support foundation to enhance our overall 14nm platform offering," said Steve Wang, vice president of UMC's IP and Design Support division. "ARM is a world-leading provider of advanced IP for leading-edge processes and we are excited to expand upon our past successes with them to develop Artisan Physical IP and Cortex-based solutions for our 14nm technology."

UMC's 14nm FinFET process has already demonstrated favorable 128mb SRAM yields and is expected to be ready for customer tape-out by late 2015.
Via: KitGuru



 



 

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