Bad batch of chemicals ruins TSMC wafers, NVIDIA production affected

Posted on Tuesday, Jan 29 2019 @ 13:04 CET by Thomas De Maesschalck
TSMC logo
News is going around that production at TSMC's Fab 14B in Tainan, southern Taiwan, was affected by a substandard batch of a chemical used in the manufacturing process. Media reports indicate over 10,000 wafers with abnormally low yield were produced due to the use of a chemical that deviated from specifications.

The yield issues affect 12nm and 16nm chips produced for NVIDIA, MediaTek, and HiSilicon, as well as smaller clients. TSMC confirmed the issue but said it doesn't affect its first quarter financial guidance given on January 17, 2019.
"TSMC has discovered that a shipment of certain chemical used in the manufacturing process deviated from specifications and caused wafers to have lower yields," said the foundry house in a filing with Taiwan's stock exchange late Monday night in response to the media reports.
In a different statement, the foundry elaborated that the yield problem was discovered on January 19, and that the chemical was supplied by a vendor with a good, multi-year track record.
It said the problem was caused by a shipment of photoresist material provided by a vendor with many years of experience and a good track record in supplying to TSMC. But that particular batch of shipment "is significantly below the quality of its previous shipments," TSMC said.

The foundry house said it immediately stopped using the material and notified all affected customers. It did not name the customers.
Via: DigiTimes

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

Loading Comments