Posted on Wednesday, November 05 2008 @ 23:50 CET by Thomas De Maesschalck
Hexus
writes Corsair is toying with thermoelectric cooling (TEC) for memory modules. The spotted by sources of the British hardware site featured a TEC cooler to reach sub-ambient temperatures and a waterblock to remove the heat from the hot side of the peltier cooler.
The sub-ambient temperatures of the Pelt/waterblock combination should allow extra voltage to be pushed through appropriately selected RAM modules without killing them, potentially yielding higher clock rates and lower latencies.
Pelt cooling is not for the faint of heart, though; sub-ambient temps will lead to condensation, which if dealt with improperly, can be a lot more harmful to components than overvolting.
