Xilence presents the M606, a new processor cooler for Intel LGA 775, 1156, 1366 and AMD AM2/AM3 processors with a TDP of up to 150W. The cooler features six heatpipes and an aluminium fin array that is cooled by a 120mm fan.
Pricing and availability is unknown.
Pictured below, the upcoming tower cooler has support for Intel LGA 775, 1156, 1366 and AMD AM2/AM3 processors with a TDP of up to 150W, boasts six heatpipes and is equipped with a 120mm 2CF PWM fan that features a rubber frame and works at up to 1500 RPM (rotations per minute). Thermal paste is also bundled for a full package.