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TSMC reveals 450mm wafer, 7/10/16nm FinFET and other future plans

Posted on Tuesday, June 04 2013 @ 20:03:04 CEST by

TSMC logo
TSMC revealed a bunch of its future plans at its 2013 Technology Symposium, Bright Side of News offers some good coverage over here.
First and foremost, TSMC plans to introduce volume products based on 20nm Planar design (CLN20SOC) over the course of 2013, switching to FinFET with the 2014 arrival of CLN16FF. As TSMC decided to skip on 14nm, the company is going 16nm to 10nm. 2015 will see no new process nodes, while 2016 is scheduled to see the first 10 nanometer process nodes - CLN10FF.

All of these processes are high-performance, while the company is keeping its Low Power roadmap mostly hush hush. Truth to be told, we would not be surprised if, very soon, the Low Power and High Performance nodes simply merge, as High Performance nodes are becoming more and more power aware, and just are able to scale higher. At least, that was the general feeling between TSMC executives that we managed to listen to.



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