DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
 
DarkVision Hardware - Daily tech news
November 18, 2018 
Main Menu
Home
Info
News archives
Articles
Howto
Reviews
 

Who's Online
There are currently 144 people online.

 

Latest Reviews
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller
 

Follow us
RSS
 

TSMC reveals 450mm wafer, 7/10/16nm FinFET and other future plans

Posted on Tuesday, June 04 2013 @ 20:03:04 CEST by


TSMC logo
TSMC revealed a bunch of its future plans at its 2013 Technology Symposium, Bright Side of News offers some good coverage over here.
First and foremost, TSMC plans to introduce volume products based on 20nm Planar design (CLN20SOC) over the course of 2013, switching to FinFET with the 2014 arrival of CLN16FF. As TSMC decided to skip on 14nm, the company is going 16nm to 10nm. 2015 will see no new process nodes, while 2016 is scheduled to see the first 10 nanometer process nodes - CLN10FF.

All of these processes are high-performance, while the company is keeping its Low Power roadmap mostly hush hush. Truth to be told, we would not be surprised if, very soon, the Low Power and High Performance nodes simply merge, as High Performance nodes are becoming more and more power aware, and just are able to scale higher. At least, that was the general feeling between TSMC executives that we managed to listen to.




 



 

DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2018 DM Media Group bvba