DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
 
DarkVision Hardware - Daily tech news
May 22, 2018 
Main Menu
Home
Info
News archives
Articles
Howto
Reviews
 

Who's Online
There are currently 175 people online.

 

Latest Reviews
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller
 

Follow us
RSS
 

140-layer 3D NAND flash expected by 2021

Posted on Wednesday, May 16 2018 @ 11:54:52 CEST by


Applied Materials revealed some details about the future of the 3D NAND flash memory market at Japan's International Memory Workshop (IMW). The company expects that by 2021, flash makers will be shipping products with 140-layers, up from the 96-layers used this year. The use of more layers enables more bits to be crammed in the same area, resulting in higher densities and lower costs.
Increased numbers of layers will allow for increased die densities whilst keeping the same PCB real-estate and implementation area; at the same time, which is something the industry is craving for as data-sets only continue to increase in size. Before 2021 and its 140-layer NAND comes (which will require new fabrication materials), 90-layer solutions are expected to be launched this year, with a 20% decrease in layer height, down from its current 60 nm to 55 nm, which will allow for relatively stable stack heights, even as the number of layers increases significantly (by around 40% compared to 64-layer tech).
3D NAND roadmap

Via: TPU



 



 

DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2018 DM Media Group bvba