Intel 10nm+ Tiger Lake wafer spotted at CES 2020

Last week at Computex, AnandTech got its hands on a 10nm+ Tiger Lake wafer from Intel. Tiger Lake will have a higher CPU and graphics performance level than Ice Lake and is expected to hit the market by the end of this year.

The site counted the number of dies on the wafer shown at CES 2020, it contains 22 dies in one direction and 28 dies in the other. After some calculations this works out to a die size of around 146.10mm² and a closeup of the wafer reveals each die has four cores. Based on its photos, AnandTech also believes the rumor of Tiger Lake having Xe graphics with 96 EUs is true.

So here you have it. Here’s what we know about Intel’s Tiger Lake CPU:

Four Cores, Likely updates to the Sunny Cove microarchitecture found in Ice Lake (Willow Cove?)

Xe-LP Graphics, 96 EUs confirmed

146.1 mm2 die size

10+ nm process node (non-EUV)

Enhanced DL-Boost Support (AVX-512, VNNI, Xe Graphics, GNA 2.0)

Thunderbolt 4 Support