Intel has 400-500W TDP four-tile chiplet Xe GPU for datacenters

Freshly leaked slides reveal Intel plans to use a tile-based approach for its Xe-based datacenter GPUs. The company's Arctic Sound product will come in one-tile, two-tile and four-tile variants, with TDP ranging from 75/150W for the one-tile version to 400-500W for the quad-tile model.

Arctic Sound will use chiplets packaged together via the Foveros 3D stacking technology. The highest-end model may feature up to 512 execution units (EUs), offering a total of 4096 cores. It's possible that we'll see a consumer version of the the dual-tile model.

The requirement of 48V input voltage pretty much means that the 4-tile design (400-500W) won’t appear in the consumer market, as this voltage is only provided by server power supplies. That said, Arctic Sound might be exclusive to the server market.

Via: VideoCardz