Intel has 400-500W TDP four-tile chiplet Xe GPU for datacenters

Posted on Tuesday, Feb 11 2020 @ 13:00 CET by Thomas De Maesschalck
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Freshly leaked slides reveal Intel plans to use a tile-based approach for its Xe-based datacenter GPUs. The company's Arctic Sound product will come in one-tile, two-tile and four-tile variants, with TDP ranging from 75/150W for the one-tile version to 400-500W for the quad-tile model.

Arctic Sound will use chiplets packaged together via the Foveros 3D stacking technology. The highest-end model may feature up to 512 execution units (EUs), offering a total of 4096 cores. It's possible that we'll see a consumer version of the the dual-tile model.
The requirement of 48V input voltage pretty much means that the 4-tile design (400-500W) won’t appear in the consumer market, as this voltage is only provided by server power supplies. That said, Arctic Sound might be exclusive to the server market.
INTC Arctic Sound configuration

Via: VideoCardz

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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