High-performance computing chip designs have been pushing the ultra-high-end packaging technologies to their limits in the recent years. A solution to the need for extreme bandwidth requirements in the industry has been the shifts towards large designs integrated into silicon interposers, directly connected to high-bandwidth-memory (HBM) stacks.
TSMC hints at 3400mm² interposer with 12 HBM stacks in 2023
Posted on Wednesday, August 26 2020 @ 15:21 CEST by Thomas De Maesschalck