TSMC is fast advancing its manufacturing processes, and it has already disclosed a plan to build a 2nm fab in Hsinchu, northern Taiwan. And if demand is strong, it may have to expand a central Taiwan fab to house more 2nm capacity, according to the foundry house's chairman. TSMC is also fast expanding its IC packaging capacity, with plans to open two new packaging fabs in the next two years. The semiconductor is embracing opportunities in the era of 5G and AI, which Micron believes will drive memory market growth in the next decade.
TSMC already looking at extra 2nm production capacity
Posted on Thursday, September 24 2020 @ 12:08 CEST by Thomas De Maesschalck