
Posted on Thursday, September 24 2020 @ 12:08 CEST by Thomas De Maesschalck
TSMC is already looking at a second site for 2nm production capacity. Last month, it was revealed that the Taiwanese foundry stepped up its 2nm efforts at the request of a major client. TSMC
secured land for a 2nm facility in Hsinchu, Taiwan and now
there's word about an additional facility in central Taiwan. The DigiTimes report also notes that TSMC is ramping up its IC packaging capacity:
TSMC is fast advancing its manufacturing processes, and it has already disclosed a plan to build a 2nm fab in Hsinchu, northern Taiwan. And if demand is strong, it may have to expand a central Taiwan fab to house more 2nm capacity, according to the foundry house's chairman. TSMC is also fast expanding its IC packaging capacity, with plans to open two new packaging fabs in the next two years. The semiconductor is embracing opportunities in the era of 5G and AI, which Micron believes will drive memory market growth in the next decade.