TSMC's new advanced packaging plant is expected to accelerate the foundry's IC backend business expansion, according to industry sources. TSMC has been enhancing its backend packaging capability to strengthen its competitiveness in the sub-10nm process segment.
TSMC's new advanced packaging fab will fulfill mainly orders demanding the foundry's CoWoS (chip-on-wafer-on-substrate) and integrated fan-out (InFO) wafer-level packaging, and its newly-unveiled system-on-integrated-chips (SoIC) and wafer-on-wafer (WoW) packaging services, the sources indicated.
TSMC planning new fab for advanced packaging tech
Posted on Wednesday, September 26 2018 @ 13:38 CEST by Thomas De Maesschalck