GIGABYTE Technologies INC., a leading manufacturer of motherboards and graphics cards today is pleased to introduce their revolutionary Ultra Durable 3 Classic technology, featuring ounces of copper for both the Power and Ground layers to a dramatically lower system temperature, improved energy efficiency and enhanced stability for overclocking on a wide range of current AMD motherboards.
GIGABYTE once again leads the motherboard industry for the highest quality, most innovative motherboard design with the launch of their latest Ultra Durable 3 Classic technology. Equipped on the latest GIGABYTE AMD chipset-based solutions including the AMD 790GX, 790X, 780G and 770, GIGABYTE Ultra Durable 3 Classic motherboards feature double the amount of copper for the Power and Ground layers of the PCB. Most traditional motherboard designs utilize a single ounce of copper for each layer, whereas GIGABYTE's ultra Durable 3 motherboards feature 2 ounces per layer.
Benefits of 2 oz Copper design
Doubling the amount of copper provides a more effective thermal cooling solution by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. In fact, GIGABYTE Ultra Durable 3 Classic motherboards are able to deliver up to 50°C cooler working temperatures than traditional motherboards.
In addition, doubling the amount of copper lowers the PCB impedance by 50%. Impedance is a measure of how much the circuit impedes the flow of current. The less the flow of current is impeded, the less amount of energy is wasted. For GIGABYTE Ultra Durable 3 Classic motherboards, this means total PCB electrical waste is reduced by 50%, which also means less heat is generated. 2 ounces of copper also provides improved signal quality and lower EMI (Electro Magnetic Interference) providing better system stability and allowing for greater margins for overclocking.