TSMC to make some iPhone 3rd gen chips

Posted on Tuesday, April 14 2009 @ 14:32 CEST by Thomas De Maesschalck
DigiTimes heard TSMC and two subsidiaries of the foundry will benefit from the next-generation iPhone. TSMC will make the GSM EDGE power amplifiers, Bluetooth ICs and 3.2 megapixel OmniVision CMOS image sensor (CIS), while subsidiaries Xintec and VisEra will be responsible for the packaging and testing service for the CIS and on-chip color filters for the CIS.
Taiwan Semiconductor Manufacturing Company (TSMC) and two of its subsidiaries – packaging and testing house Xintec and color filer (CF) maker VisEra Technologies – are likely to benefit from their roles in the manufacturing of the next-generation iPhone, according to industry sources.

TSMC have landed foundry orders for GSM EDGE power amplifiers, Bluetooth ICs and 3.2-megapixel OmniVision CMOS image sensor (CIS) used in the upcoming iPhone model, indicated the sources. Xintec will handle the packaging and testing service for the CIS whereas VisEra will manufacture on-chip color filters for the CIS.




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