TSMC 300mm wafer fab in China gets greenlit

Posted on Thursday, February 04 2016 @ 14:27 CET by Thomas De Maesschalck
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Chip foundry TSMC announced it received approval from the Taiwanese government to build a 300mm wafer fab in China. TSMC plans to build a $3 billion wafer fab in China, with a capacity of 20,000 wafer starts. The Chinese fab should start churning out 16nm FinFET chips in the second half of 2018:
Taiwan announced a plan to invest about $3 billion in building a wafer fab in Nanjing, Jiangsu Province, China in December 2015. The facility is planned for a capacity of 20,000 wafer starts per month and would begin volume production of 16nm FinFETs in second half of 2018, but the plan was subject to Taiwan government approval. At the time TSMC chairman Morris Chang said such a move would provide closer support to TSMC's customers there and further expand the company’s business opportunities.
The foundry already operates a 200mm fab in China, but legislation forbade Taiwanese companies from owning and operating Chinese fabs that use the more efficient 300mm wafer size because Taiwan wants to keep its technological edge over China.

The Taiwanese government is relaxing its position, saying it would allow a maximum of three such plants, but notes that it will require proof from TSMC that it has begun manufacturing 10nm chips in Taiwan before it can move equipment into the Chinese wafer fab.

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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