AMD Vega 11 to be packed by SPIL, Vega 20 to be fabbed at TSMC?

Posted on Friday, September 08 2017 @ 22:42 CEST by Thomas De Maesschalck
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A couple of interesting details leaked about AMD's next Vega chips. DigiTimes heard from its sources that the Vega 11 series will most likely be manufactured by GlobalFoundries. One difference versus the current Vega models is that AMD reportedly contracted Siliconware Precision Industries (SPIL) as its biggest packager for the chips.

While some portion of the Vega 10 GPUs are packaged by Advanced Semiconductor Engineering (ASE), the report indicates the majority of the chip packages is put together by SPIL and that this will remain the case with the mainstream Vega 11 lineup.

Another interesting rumor concerns AMD's Vega 20 series. DigiTimes claims AMD will likely switch orders to TSMC to produce these chip at 7nm FinFET process and with TSMC's CoWoS packaging. Not a lot of details are available about Vega 20 but the site hints it may primarily be aimed at supercomputers. Perhaps Vega 20 will be a compute-heavy architecture like NVIDIA's GV100, this implies Navi may be the Vega 10 successor in the consumer lineups.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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