CPUs have gotten faster and faster over the past few years, and with speed comes heat. Heatsink/fan combos usually do a good job of relieving that heat, but this requires a perfectly flat contact surface between the CPU core and the heatsink. Sadly, not all companies will provide you with a perfectly flat heatsink contact area. This is where lapping comes in
The rear 60mm fan point was offset mostly by the inclusion of four 80mm fan points at the front of the case, for hard drive cooling. The inside of the case was nice with a lot of hard drive rails (6 internal/external), however the lack of a removable motherboard tray was very disappointing.
When we first put the DLT3C XP1700+ in, we were replacing an old XP2000+ Palomino in the test rig. Previously, the XP2000+ was clocked at 1.96GHz @ 1.85v and ran at 32C under load with prime95, at an ambient of 22-23C. I should note that all temperatures were recorded with Motherboard Monitor... Surprised? So were we.
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