HKEPC writes VIA is working on a new unified chipset for AMD's AM2+ platform.
According to a friend from main board manufacturing market, VIA has scheduled its next-generation unified chipset for AMD platform in 2H07. As a unified chipset, the new model would help VIA to fight in the value market more effective by a lowered cost. Further, supporting Hyper-Transport 3.0 means the chipset is also ready for AMD AM2+ processors.
In fact, VIA’s competitors NVIDIA and ATI have already announced their unified chipset in the earlier time, where NVIDIA has introduced unified design in MCP61 and ATI’s SC780 would come in 2H07. Unified chipset is a marketing trend for the value market that no one could deny, said a friend from the market. VIA’s move is just following the trend, and there will be 2 chipsets released from VIA for AMD platform. These new models include KT960 and KM960 which has build-in Chrome9 HD IGP的KM960. They are in unified design, which helps in lowering the cost..