IBM and partners to expand agreements to 32nm process

The joint development agreements between these companies will now include 32nm bulk CMOS process technology and joint development of process design kits (PDKs) to support that technology. Building on the success of earlier joint development and manufacturing agreements at 90nm, 65nm and 45nm, alliance partners will be able to produce high-performance, energy-efficient chips at 32nm.

IBM remains convinced that collaborative innovation in an open ecosystem of partners is the key to technology leadership, both now and in the years to come," said Michael Cadigan, general manager, semiconductor solutions, IBM global engineering solutions. "Today’s announcement validates that strategy by meeting client requirements for leadership technology. With the extensions of our agreements to the 32nm generation -- including manufacturing and IBM Research to complement the proven joint development model in place for well over a decade."