VIA aims to ship 5.5 million processors this year, up to 50% more than last year. Last year VIA sold 3.6 million processors. VIA also aims to ship 40 to 45 million chipsets this year, compared to 31 to 33 million last year.
VIA currently has three CPU lines, all based on the company’s Nehemiah processor core and produced at Taiwan Semiconductor Manufacturing Company (TSMC). The C3 line is for desktop PCs, the Antaur for notebooks and the Eden for embedded solutions.
By the second half of this year, VIA will add the new Esther processor core to its CPU lines. Esther is now being developed at IBM’s 12-inch East Fishkill, New York fab using 90nm SOI CMOS, low-k dielectric manufacturing technology, as reported yesterday.
The VPSD and CPU divisions are now being operated under a new VIA Embedded Platform Division (VEPD), responsible for CPU sales along with embedded motherboard solutions. Lee heads the new division.