German memory maker Infineon announced that is has shipped the first samples of its 2GB DDR2 Planar Registered memory modules. These modules use single-die 512Mbit DDR2 memory chips in very compact FBGA packages and are based on a planar design. Currently available modules with densities greater than 1GB use stacked-die.
Infineon’s new planar solution for 2 GB modules is based on mature single-die components. System manufacturers will benefit from considerably flatter modules which with a thickness of 4.1 mm fulfil the requirements for DDR2 server applications and depending on the respective system configuration result in up to 10 percent reduced heat generation.
The 2 GB DDR2 Planar Registered DIMM, which is expected to become the preferred density of high-end server suppliers, targets high-performance data processing and storage applications in the server and storage infrastructure market. According to market research firm iSuppli the demand for mid-end and high-end servers units will increase from around 800,000 units in 2003 to approx. 1 million units in 2006 with an average growth rate of 9 percent per year.
This new 2 GB Registered DIMM uses 36 single-die 512 Mbit DDR2 components in JEDEC (Joint Electronic Device Engineering Council) compliant 60-ball FBGA packages which operate at speeds of 400 Mbit/s and 533 Mbit/s.
With the introduction of the 2 GB DDR2 Planar Registered DIMM, Infineon optimizes its DDR2 standard portfolio of registered modules with memory densities of 256 MB, 512 MB, 1 GB, 2 GB and 4 GB. Each DIMM except the 4 GB module is based on a planar design.
Samples of the 2 GB DDR2 Planar Registered DIMM are available in an organization of 256 Mbit x 72 (2 Rank x4), for speeds of PC2-3200 and PC2-4300 at unit prices from US-Dollar 700,- to 910,-. Volume production is planned to start in the second half of calendar year 2004
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