Posted on Saturday, April 12 2008 @ 6:10 CEST by Thomas De MaesschalckLower Temperature = Lower Power Consumption
All users are pursuing higher system performance. Memory frequency is one of the key factors. According to the theory, higher memory frequency takes higher power consumption as the higher Vdimm needed. G.Skill series heat spreader design takes more heat out from the memory IC surface. It can lower the temperature at least 20% to 30% more than the traditional design.
Lower Temperature = More System Performance
For Overclockers, every degree is also the matter. As per semiconductor characteristic, too high temperature will limit the working frequency, OC capability, and product life. G.Skill series heat spreader design allows overclockers to squeeze their memory performance more than the past. For the serious gamers, they can avoid be killed dues to the system lag.
Here's a list with the specifications of the new modules:
F2-6400CL4D-2GBPI: DDR2-800 4-4-4-12 1GBx2 kit F2-8000CL5D-2GBPI: DDR2-1000 5-5-5-15 1GBx2 kit F2-8500CL5D-2GBPI: DDR2-1066 5-5-5-15 1GBx2 kit F2-6400CL5D-4GBPI: DDR2-800 5-5-5-15 2GBx2 kit F2-6400CL4D-4GBPI: DDR2-800 4-4-4-12 2GBx2 kit F2-8000CL5D-4GBPI: DDR2-1000 5-5-5-15 2GBx2 kit F2-8500CL5D-4GBPI: DDR2-1066 5-5-5-15 2GBx2 kit F3-10600CL8D-2GBPI: DDR3-1333 8-8-8-21 1GBx2 kit F3-10600CL8D-4GBPI: DDR3-1333 8-8-8-21 2GBx2 kit F3-10600CL7D-2GBPI: DDR3-1333 7-7-7-18 1GBx2 kit F3-10600CL7D-4GBPI: DDR3-1333 7-7-7-18 2GBx2 kit F3-12800CL7D-2GBPI: DDR3-1600 7-7-7-18 1GBx2 kit F3-12800CL7D-4GBPI: DDR3-1600 7-7-7-18 2GBx2 kit
