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Coolink has thermal compound with ceramic nanoparticles and new VGA cooler
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Posted on Tuesday, June 10 2008 @ 00:05:14 CEST by Thomas De Maesschalck |
Coolink send us a mail with some information on their upcoming cooling products. They have a new thermal paste that uses ceramic nano-particles for improved performance and also a new VGA cooler:
The first new product on show was Coolink's first high-performance thermal
compound product named 'Chillaramic'. Using ceramic nano-particles for excellent
cooling performance and coming in a large tube of 10g, this product is set to
launch in June 2008.
Also on show was the upcoming bigger brother of the popular GFXChilla video card
cooler, which itself got numerous awards for its slim design approach while
still providing very good cooling capabilities.
The target for the so called 'Big GFXChilla' is to provide users of highest-end
cards and overclockers with a product that allows them to cool a
high-performance card quietly. Of course, it will support next-generation
products from ATI (RV770) and NVIDIA (GT200) while still retaining compatibility
with existing and previous generation video cards.
The Big GFXChilla is scheduled for a release at the end of Q3/2008.
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