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Transcend’s triple channel kits are designed specifically for the new platform, and offer an optimized combination of low voltage (1.5V), generous speed, and enhanced latency (9-9-9-24) to deliver ideal performance and compatibility with next-generation PCs.

Available in two different capacities of 3GB (1GBx3) and 6GB (2GBx3), Transcend’s DDR3-1333 triple channel memory kits’ three identically matched DDR3 modules are carefully matched for use in triple-channel configuration, which together provide memory bandwidth of up to 32GB/sec. To ensure extra-stability and signal integrity, all DDR3 modules use robust PCBs that fully comply with JEDEC standards. Each chip is selected with the strictest quality and performance standards and is manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages with extra contacts to assure better thermal dissipation, electrical efficiency and reliable computing quality.