Intel 300mm fab in China on track for 2010

Posted on Tuesday, June 09 2009 @ 16:52 CEST by Thomas De Maesschalck
Intel revealed it's on track to open its 300mm fan in Dalian, China, in 2010. The company also said it's looking to integrate its assembly and test facility in Shanghai with its Chengdu plant.
The first batch of graduates from the Semiconductor Technology Institute, which was established under Intel's partnership with the Dalian University of Technology and the Dalian Municipal Government, will start working at Intel's operations in Dalian in 2010, according to Intel.

Intel's existing workforce of around 2,400 employees at the Chengdu site will also grow to a total of more than 3,000 by the end of 2009, after the consolidation of assembly and test lines in China, said the company. Intel's upcoming chips on 32nm and beyond will also complete backend processing at the Chengdu facility.


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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