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AMD Inks Substrate Agreement for 65nm/300mm Production

Posted on Tuesday, January 18 2005 @ 17:01:49 CET by

The Soitec Group, a leading supplier of engineering substrate solutions for chipmakers said Monday it and Advanced Micro Devices had signed an agreement under which AMD will continue to use the Soitek’s UNIBOND wafers for its future production using 200mm and 300mm wafers.

More info at X-bit Labs



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