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Intel improves cost-effectiveness of LGA775 HSF design

Posted on Monday, March 01 2010 @ 11:17:09 CET by

TC Mag spotted Intel will start shipping a slightly updated cooler for its boxed LGA775 processors starting April 1st, 2010.
The new model is set to come with multiple tweaks compared to the currently-used solution and these are:

- a slightly smaller impeller (fan speed is increased because of this but noise output stays the same)
- fan shroud hub diameter increased (from 34mm to 40mm) due to modifications to fan electronics
- heatsink fins will be straight (as opposed to curved as they are now)
- the heatsink will be a bit more compact (height decreased from 18.9 mm to 18.47mm)



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