Samsung began mass production of a new 2.5Gb MCP (multi-chip package) for 3G phones. This chip will allow playback of video and digital multimedia broadcasting (DMB) support on mobile phones.
Operating on a mere 1.8 volts, the MCP consists of two 1Gb NAND flash memory chips and two 256Mb Mobile DRAMs providing to four hours of high-quality QVGA video storage. The chip will allow manufacturers to produce slimmer, lighter handsets with increased functionality.
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