IBM, Samsung, GlobalFoundries and STMicroelectronics to synchronize production

Four companies in IBM Corp.’s ''fab club’’--IBM, Samsung, GlobalFoundries and STMicroelectronics--said that they are in collaboration to ''synchronize’’ the production of chips, based on its previously-announced, 28-nm low-power process.

The group will begin shipping 28-nm wafers starting by the later part of 2010. IBM’s group has also come out of its shell and launched a subtle verbal attack on the rival foundry camp, reportedly Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).

The group did not mention TSMC by name, but the Taiwan foundry giant has been critical of the high-k technology implemented by IBM’s group. IBM’s 28-nm process is based on a high-k/metal-gate scheme, built around a gate-first technology.

In contrast, TSMC uses the rival gate-last technology in its high-k technology. Members of IBM’s fab club defended its technology, saying that it’s superior over competitive offerings.