Cooler Master presents the H-B6 HSF at CES 2011. This new tower heatsink features its six heatpipes along the length of the fins rather than breadth. The cooler measures 136mm x 127mm x 163mm and is equipped with a 120mm xTraFlo fan with a quick-snap fan bracked for easier installation.
It features an aluminum fin tower design, but with its heat-pipes passing along the length of the fins rather than breadth (like on most tower-type heatsinks). This approach spreads heat more evenly, and adds to the turbulence.
The Cooler Master H-B6 is compatible with Intel's LGA775/1155/1156/1366 and AMD's Socket AM2/AM2+/AM3.